| Patent application number | Description | Published |
|---|
| 20080273829 | Planar Lightwave Circuit, Design Method for Wave Propagation Circuit, and Computer Program - A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) ( | 11-06-2008 |
| 20090051735 | LIQUID DROPLET FLIGHT DEVICE AND IMAGE FORMING APPARATUS - A liquid droplet flight device is provided that moves an ink or the like using a comparatively low voltage and stably causes flight of even a high viscosity ink or the like. When causing droplets of a liquid inside a liquid retaining section to fly onto a medium transported between liquid droplet discharge means and an opposing electrode in the liquid droplet flight device, a high voltage is applied to the flight electrode from a bias power source to generate an electric field between the flight electrode and the opposing electrode. On/off control of flight control means is performed in this state to apply a drive voltage of a low voltage to an EW drive electrode from a drive power source such that the liquid inside a slit moves to a leading end portion of the flight electrode due to an electrowetting phenomenon, and the liquid that has moved to the leading end portion of the flight electrode flies toward the opposing electrode through the electric field such that a liquid droplet lands on the medium. | 02-26-2009 |
| 20090180156 | Image reading apparatus and image forming apparatus - An image reading apparatus is disclosed that includes a contact glass on which a document is placed; an imaging device configured to image a document image based on light reflected from the document through the contact glass; plural line image sensors arranged along a main scanning direction at positions where the document image is imaged and configured so that end portions of the line image sensors adjacent to each other similarly read same image data imaged at an overlapping area; a transmitted light quantity reduction unit disposed in the overlapping area on the contact glass and configured to reduce transmitted light quantity of a light transmitted through the contact glass; and a signal correction device configured to correct the signal intensity of the image data similarly read by the line image sensors adjacent to each other. | 07-16-2009 |
| 20090195843 | Image reading apparatus, document reading apparatus, and image forming apparatus - An image reading apparatus is disclosed that includes plural line image sensors partially overlapped with each other in an overlapped reading portion, the image reading apparatus characterized by: plural light sources disposed so as to face the overlapped reading portion; a light source turn-on unit sequentially and independently turning on the light sources; an optical unit converging each light emitted from the light sources onto the overlapped reading portion; and a position shift detecting unit detecting a position shift of a reading position of the line image sensors in the overlapped reading portion based on data of the overlapped reading portion. | 08-06-2009 |
| 20090316164 | Image forming apparatus - An image forming apparatus is disclosed that includes a recording head having a plurality of nozzles and scanning in forward and backward scanning directions to form dot images on the recording medium, an imaging unit imaging an image on the recording medium, a detection unit detecting a positional shift amounts of the dot images and inclination amounts of the recording head based on calibration image data obtained by imaging two first marks and two second marks in a single view by the imaging unit, and a correction unit correcting a drive of the recording head based on the detected positional shift amounts and the inclination amounts of the recording head. | 12-24-2009 |
| 20100117126 | SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS - A solid-state imaging device includes a substrate, a plurality of photodiodes arranged in the substrate in a depth direction of the substrate, a vertical readout gate electrode for reading signal charges in the photodiodes, the vertical readout gate electrode being embedded in the substrate such that the readout gate electrode extends in the depth direction of the substrate, a dark-current suppressing area which covers a bottom portion and a side surface of the readout gate electrode, the dark-current suppressing area including a first-conductivity-type semiconductor area having a uniform thickness on the side surface of the readout gate electrode, and a reading channel area disposed between the first-conductivity-type semiconductor area and the photodiodes, the reading channel area including a second-conductivity-type semiconductor area. | 05-13-2010 |
| 20100202555 | TRANSMISSION DEVICE - The present invention aims to provide a transmission device that, in a communication system using multilevel modulation with 2̂n levels (n being an integer greater than or equal to two), limits the run length to a predetermined value or less and guarantees DC balance. | 08-12-2010 |
| 20100238331 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips. | 09-23-2010 |
| 20100238334 | SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, METHOD OF DRIVING THE SAME, AND ELECTRONIC APPARATUS - A solid-state imaging device includes a plurality of pixels, each of which includes a photoelectric converter section formed on a first substrate to generate and accumulate signal charges corresponding to incident light, a charge accumulation capacitor section formed on the first substrate or a second substrate to temporarily hold the signal charges transferred from the photoelectric converter section, and a plurality of MOS transistors formed on the second substrate to transfer the signal charges accumulated in the charge accumulation capacitor section, connection electrodes formed on the first substrate, and connection electrodes formed on the second substrate and electrically connected to the connection electrodes formed on the first substrate. | 09-23-2010 |
| 20100308385 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME, AND SOLID-STATE IMAGE PICKUP ELEMENT - Disclosed herein is a semiconductor device having a vertical MOS transistor having a channel of a first conductivity type and formed by burying a gate electrode in a semiconductor substrate, a planar MOS transistor having a channel of the first conductivity and having a gate electrode formed on the semiconductor substrate, and a planar MOS transistor having a channel of a second conductivity and having a gate electrode formed on the semiconductor substrate, the semiconductor device, including other circuit element(s), other than a transistor, formed either below or above the vertical MOS transistor having the channel of the first conductivity type. | 12-09-2010 |
| 20110007112 | Recording apparatus and non-transitory computer-readable recording medium storing a recording program - A recording apparatus includes a carriage; a first head group including a recording head and disposed on the carriage; and a second head group including a recording head and disposed on the carriage adjacent the first head group in a staggered manner with respect to a sub-scan direction. The carriage is configured to move in a main scan direction in order to record an image on a recording medium. The recording apparatus further includes a forming unit configured to form plural test patterns including a first pattern formed by the recording head of the first head group and a second pattern formed by the recording head of the second head group. The test patterns are spaced apart from one another in the sub-scan direction. The position of the second pattern relative to the first pattern in the sub-scan direction is varied successively from one test pattern to another. | 01-13-2011 |
| 20110024858 | SOLID-STATE IMAGING DEVICE AND METHOD FOR PRODUCING THE SAME - A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate. | 02-03-2011 |
| 20110051200 | Image scanning device and image forming apparatus - An image scanning device includes a base part; and multiple image sensors each including a substrate, a line sensor including scanning elements arranged on the substrate, and a holder for holding the substrate. The base part holds the image sensors such that the scanning elements of an image sensor partly overlap the scanning elements of an adjacent image sensor in the main-scanning direction. The coefficients of linear expansion of the substrate and the base part are substantially the same; the holder and the base part are fixed together at a first fixing point; the holder and the substrate are fixed together at a second fixing point; and the distance in the main-scanning direction between the first fixing point and the second fixing point and the direction of the second fixing point with respect to the first fixing point are the same for all the image sensors. | 03-03-2011 |
| 20110063696 | Sheet feeding apparatus, image forming apparatus and sheet feeding method - A sheet feeding apparatus is disclosed that includes a plurality of size sensors configured to be arranged in line and to detect a sheet set into a predetermined position; a feeding part configured to feed the sheet set into the predetermined position to a scan position; and a controller configured to control the feeding part to feed the sheet based on two detect signals output from two size sensors among the plurality of the size sensors. | 03-17-2011 |
| 20110079866 | SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A method for manufacturing a solid-state image pickup device is provided. In this method, a pixel isolation member is formed in a semiconductor substrate including pixels, and the thickness of the substrate is reduced by CMP. For forming the pixel isolation member, a first pixel isolation member is formed by implanting impurity ions in a region of the substrate so that the pixels are disposed between portions of the region when viewed from a surface of the substrate. A second isolation member is also formed by forming a trench in a region of the substrate different from the first pixel isolation member so that the pixels are disposed between portions of the region, and then filling the trench with an electroconductive material harder to polish by CMP than the substrate. The CMP is performed on the rear side of the substrate using the second pixel isolation member as a stopper. | 04-07-2011 |
| 20110102657 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS - A semiconductor device having a first semiconductor section including a first wiring layer at one side thereof; a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other; a conductive material extending through the first semiconductor section to the second wiring layer of the second semiconductor section and by means of which the first and second wiring layers are in electrical communication; and an opening, other than the opening for the conductive material, which extends through the first semiconductor section to the second wiring layer. | 05-05-2011 |
