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Hiroshi Segawa
Hiroshi Segawa, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100136185 | MULTI-REGION CONFECTIONERY COMPOSITION, ARTICLE, METHOD, AND APPARATUS - A dough-like confectionery material contains a solid particulate, a liquid, and a diffusion controller. The dough-like confectionery material is an effective replacement for panned coatings, and it can be applied to an edible substrate, such as candy or chewing gum to form a layered confection. Methods and apparatus for forming layered confections are also described. | 06-03-2010 |
| 20110011459 | HYBRID AND/OR COMPLEX MATERIAL, PHOTOELECTRIC CONVERSION MATERIAL, DYE-SENSITIZED SOLAR CELL, DYE-SENSITIZED SOLAR CELL DEVICE, MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION DEVICE, AND METHOD OF ANALYZING TITANIUM OXIDE CRYSTAL STRUCTURE - There is provided a hybrid and/or complex material or the like which can realize a high-efficient photoelectric conversion material or the like. One aspect of the present invention lies in a dye-sensitized solar cell device | 01-20-2011 |
Hiroshi Segawa, Kawasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090231827 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad. | 09-17-2009 |
Hiroshi Segawa, Ogaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090173522 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring. | 07-09-2009 |
| 20090173530 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having a second wiring, a second pad for loading a second electronic component over the second insulating layer and a first via conductor electrically connecting the second land and the second wire. The first wiring and the second wiring electrically connect the first land and the second pad. The first land and second land are positioned such that a first electronic component is mounted over a second surface of the first insulating layer on the opposite side of the first surface. The second wiring has a longer wiring length and a greater thickness than the first wiring. | 07-09-2009 |
| 20090175023 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring. | 07-09-2009 |
| 20110265323 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring. | 11-03-2011 |
| 20110265324 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate. | 11-03-2011 |
Hiroshi Segawa, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090052869 | MULTIPLEXING METHOD PREVENTING OVERFLOW OF AUDIO DECODER BUFFER - A time zone start time point calculating unit calculates a time zone to be set in a VOBU in accordance with audio bit rate. A time zone comparing unit compares a time point at which an audio pack is to be multiplexed with the time zone calculated by the time zone start time point calculating unit. A flag setting unit sets whether the audio pack is to be completed or not in accordance with the result of comparison by the time zone comparing unit. Therefore, a completing process takes place before a VOBU boundary, and a completed PCK will not be generated immediately after the VOBU boundary. Thus, generation of a buffer overflow can be prevented. | 02-26-2009 |
| 20090148568 | Candy composition with excellent sweetness and candy using the same - It is an object of the invention is to provide a candy composition in which a sugar alcohol is used as a main raw material and which is comparable in intensity of sweetness and quality of sweetness to sugar as well as a candy manufactured using the same. | 06-11-2009 |
Hiroshi Segawa, Gifu JP
| Patent application number | Description | Published |
|---|---|---|
| 20090120677 | WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD - A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as to define a plurality of inner walls respectively. The wiring substrate further includes an external conductor that is formed on at least one of the first surface or the second surface of the substrate. A through-hole conductor is formed on one of the plurality of inner walls so as to define a through-hole conductor space and so as to be electrically connected to the external conductor. Also included is a conductive post with first and second post ends, the first post end being positioned in the through-hole conductor space such that the first post end is in contact with and is electrically connected to the through-hole conductor, and the second post end projects out of the conductor space. | 05-14-2009 |
Hiroshi Segawa, Toyko JP
| Patent application number | Description | Published |
|---|---|---|
| 20090078307 | Three-Pole Two-Layer Photo-Rechargeable Battery - A three-pole two-layer photo-rechargeable battery has a laminated two-layered structure that includes a solar battery cell, a storage cell, and a common electrode therebetween. The solar battery cell has a structure wherein a photo-electrode, which has a photo-sensitized dye and a semiconductor layer on a conductive substrate with optical transparency, counters via a first electrolytic solution a common electrode that has a catalyst layer on a conductive substrate. The storage cell has a structure wherein the common electrode, which has a first conductive polymer layer on a conductive substrate on a side opposite the catalyst layer, counters via a second electrolytic solution a storage cell counter electrode that has a second conductive polymer layer on a conductive substrate. | 03-26-2009 |
Hiroshi Segawa, Ibi-Gun JP
| Patent application number | Description | Published |
|---|---|---|
| 20120125680 | MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An opening is formed in resin | 05-24-2012 |