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Hiroshi Saegusa, Shizuoka JP

Hiroshi Saegusa, Shizuoka JP

Patent application numberDescriptionPublished
20080234460Fluorine-Containing Polymerizable Monomer and Polymer Compound Using Same - Disclosed is a fluorine-containing polymerizable monomer represented by the formula [1] below. (In the formula, A represents a single bond, an oxygen atom, a sulfur atom, CO, CH09-25-2008
20090023886Fluorine-containing polymerizable monomer and polymer compound using same - Disclosed is a fluorine-containing polymerizable monomer represented by the formula [1] below. (In the formula [1], a represents an integer of 1-4.) By having a plurality of polymerizable amines in a molecule while containing a hexafluoroisopropyl group, this fluorine-containing polymerizable monomer exhibiting water repellancy, oil repellency, low water absorbency, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index, low dielectric properties, and the like, and thus can be applied to the field of advanced polymer materials.01-22-2009
20090292104Fluorine-Containing Polymerizable Monomer and Polymer Compound Using Same - Polymer compounds obtained by polymerization of a fluorine-containing polymerizable monomer represented by the formula [1]11-26-2009
20100152401POLYMERIZABLE COMPOUND AND POLYMER COMPOUND OBTAINED BY USING THE SAME - Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1):06-17-2010
20100234556Fluorine-Containing Polymerizable Monomer and Polymer Compound Using Same - Polymers made by polymerization or cyclization condensation of a fluorine-containing polymerizable monomer represented by the formula [1]09-16-2010
20100248136ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition comprises a hydrophobic resin (HR) containing a fluorine atom, wherein the hydrophobic resin (HR) comprises any of repeating units (a) of general formula (I) or (II) below:09-30-2010
20110091809ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes (A) a resin that when acted on by an acid, increases its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, and (C) a resin containing at least one group selected from among the following groups (x) to (z) and further containing at least either a fluorine atom or a silicon atom, in which three or more polymer chains are contained through at least one branch point, (x) an alkali-soluble group, (y) a group that when acted on by an alkali developer, is decomposed to thereby increase its solubility in the alkali developer, and (z) a group that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.04-21-2011
20110143280POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND PATTERN FORMING METHOD - A positive resist composition for immersion exposure includes the following (A) to (D): (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3) as defined in the specification, in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D).06-16-2011

Patent applications by Hiroshi Saegusa, Shizuoka JP