| Patent application number | Description | Published |
|---|
| 20090279276 | ELECTRONIC COMPONENT - There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member. | 11-12-2009 |
| 20100090336 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR | 04-15-2010 |
| 20100101878 | SEMICONDUCTOR DEVICE AND ELECTRICALLY POWERED VEHICLE - A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate. | 04-29-2010 |
| 20100155027 | COOLING DEVICE - A cooling device includes a case including a mount surface having a power transistor mounted thereon, a coolant accommodating chamber formed in the case located above the mount surface, for accommodating a coolant capable of evaporating by heat from the power transistor, a cooling pipe provided in the case and being capable of cooling the coolant in a gaseous state, and a defining member provided in the coolant accommodating chamber and being capable of defining in the coolant accommodating chamber a first region capable of guiding the coolant in a gaseous state evaporated by the heat from the power transistor toward the cooling pipe, and a second region located downstream in a flow direction of the coolant with respect to the first region and being capable of guiding the coolant cooled by the cooling pipe toward a bottom of the coolant accommodating chamber. | 06-24-2010 |
| 20100182747 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein. | 07-22-2010 |
| 20100237507 | POWER MODULE - A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship. | 09-23-2010 |
| 20100319876 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material. | 12-23-2010 |
| 20110134608 | SEMICONDUCTOR DEVICE - A semiconductor apparatus | 06-09-2011 |
