Patent application number | Description | Published |
20100244440 | HIGH PRESSURE FUEL PIPE CONSTRUCTION FOR AN INTERNAL COMBUSTION ENGINE - A high pressure fuel pipe construction for an internal combustion engine, such as a direct injection engine. A conduit for the fuel is open at each end and a ball having a throughbore is slidably positioned over one end of the conduit. A reinforcing sleeve is positioned inside the end of the conduit so that the sleeve extends entirely through the ball. The sleeve, ball and the end of the conduit are then brazed together to attach the ball and conduit together. A double chamfer is provided at one end of the ball throughbore to facilitate inspection of the brazing quality. Additionally, a loop is formed in the conduit and a dampener is attached to the loop. | 09-30-2010 |
20100275883 | FUEL SYSTEM COMPONENT FOR A DIRECT INJECTION INTERNAL COMBUSTION ENGINE - A fuel system component for a direct injection internal combustion engine. The component includes a fuel rail and a plurality of direct injection fuel injectors which are rigidly attached to the rail. Each fuel injector has an elongated body as well as a harness assembly extending laterally outward from the elongated body. Each injector is attached to the fuel rail such that, when viewed along an axis of the fuel injector body, the fuel rail overlies at least a portion of the injector body and at least a portion of the harness assembly. | 11-04-2010 |
20120006914 | HIGH PRESSURE FUEL PIPE CONSTRUCTION FOR AN INTERNAL COMBUSTION ENGINE - A high pressure fuel pipe construction for an internal combustion engine, such as a direct injection engine. A conduit for the fuel is open at each end and a ball having a throughbore is slidably positioned over one end of the conduit. A reinforcing sleeve is positioned inside the end of the conduit so that the sleeve extends entirely through the ball. The sleeve, ball and the end of the conduit are then brazed together to attach the ball and conduit together. A double chamfer is provided at one end of the ball throughbore to facilitate inspection of the brazing quality. Additionally, a loop is formed in the conduit and a dampener is attached to the loop. | 01-12-2012 |
Patent application number | Description | Published |
20100216309 | CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME - Disclosed is a CMP polishing liquid for polishing a substrate having a layer containing ruthenium, comprising: an oxidizing agent; polishing particles; water; and a compound having a structure represented by the following Formula (1), or a salt thereof. This CMP liquid is improved in at least the polishing rate to a ruthenium layer when compared with conventional polishing liquid. Also disclosed is a method for polishing a substrate using such a CMP polishing liquid. | 08-26-2010 |
20100265685 | WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME - The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles. | 10-21-2010 |
20110177690 | POLISHING SOLUTION FOR CMP, AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING SOLUTION FOR CMP - The CMP polishing liquid of the present invention contains 1,2,4-triazole, a phosphoric acid, an oxidant, and abrasive particles. The polishing method of the present invention is a substrate polishing method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, in which the substrate is a substrate having a palladium layer, and the CMP polishing liquid is a CMP polishing liquid containing 1,2,4-triazole, a phosphoric acid, an oxidant, and abrasive particles. | 07-21-2011 |
20110300778 | ABRADING AGENT AND ABRADING METHOD - A polishing agent which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein the amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is at least 0.10 mol with respect to 1 kg of the composition without the organic acid, and the organic acid contains at least two carboxyl groups, wherein the logarithm of the inverse of the first acid dissociation constant (pKa1) is no greater than 3. | 12-08-2011 |
20120024818 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME - A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied.
| 02-02-2012 |
20120100718 | CMP Fluid and Method for Polishing Palladium - The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. | 04-26-2012 |
Patent application number | Description | Published |
20100244628 | PIEZOELECTRIC-DRIVEN MEMS ELEMENT - A piezoelectric-driven MEMS element includes a substrate, a beam, a fixed portion, a fixed electrode portion and a power source. The beam is provided with a lower electrode film, a lower piezoelectric film, a middle electrode film, an upper piezoelectric film and an upper electrode film. The fixed portion fixes one end of the beam onto the substrate so as to hold the beam with a gap above the substrate. The fixed electrode portion has a capacitive gap between the fixed electrode portion and the other end of the beam. In addition, at least one or two of the lower electrode film, the middle electrode film and the upper electrode film is thicker than the rest thereof. | 09-30-2010 |
20120138985 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer and a light emitting part. The first semiconductor layer includes an n-type semiconductor layer. The second semiconductor layer includes a p-type semiconductor layer. The light emitting part is provided between the first semiconductor layer and the second semiconductor layer, and includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers. The first semiconductor layer has a first irregularity and a second irregularity. The first irregularity is provided on a first major surface of the first semiconductor layer on an opposite side to the light emitting part. The second irregularity is provided on a bottom face and a top face of the first irregularity, and has a level difference smaller than a level difference between the bottom face and the top face. | 06-07-2012 |
20120292648 | NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER - According to one embodiment, a nitride semiconductor device includes a foundation layer and the functional layer. The foundation layer is formed on an amorphous layer and includes aluminum nitride. The functional layer is formed on the foundation layer and includes a nitride semiconductor. | 11-22-2012 |
20120292649 | SEMICONDUCTOR LIGHT EMITTING DEVICE, WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR CRYSTAL LAYER - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, and a low refractive index layer. The first semiconductor layer has a first major surface and a second major surface being opposite to the first major surface. The light emitting layer has an active layer provided on the second major surface. The second semiconductor layer is provided on the light emitting layer. The low refractive index layer covers partially the first major surface and has a refractive index lower than the refractive index of the first semiconductor layer. | 11-22-2012 |
20130203192 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer and a light emitting part. The first semiconductor layer includes an n-type semiconductor layer. The second semiconductor layer includes a p-type semiconductor layer. The light emitting part is provided between the first semiconductor layer and the second semiconductor layer, and includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers. The first semiconductor layer has a first irregularity and a second irregularity. The first irregularity is provided on a first major surface of the first semiconductor layer on an opposite side to the light emitting part. The second irregularity is provided on a bottom face and a top face of the first irregularity, and has a level difference smaller than a level difference between the bottom face and the top face. | 08-08-2013 |
20130228745 | NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER - According to one embodiment, a nitride semiconductor device includes a first layer and a functional layer. The first layer is formed on an amorphous layer, includes aluminum nitride, and has a compressive strain or a tensile strain. The functional layer is formed on the first layer and includes a nitride semiconductor. | 09-05-2013 |
20150102381 | SEMICONDUCTOR LIGHT EMITTING DEVICE, WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR CRYSTAL LAYER - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, and a low refractive index layer. The first semiconductor layer has a first major surface and a second major surface being opposite to the first major surface. The light emitting layer has an active layer provided on the second major surface. The second semiconductor layer is provided on the light emitting layer. The low refractive index layer covers partially the first major surface and has a refractive index lower than the refractive index of the first semiconductor layer. | 04-16-2015 |
Patent application number | Description | Published |
20090066450 | ELECTROMAGNETIC RELAY, AND METHOD AND SYSTEM FOR ADJUSTING SAME - An electromagnetic relay has a solenoid formed from a wound coil, a movable contact-point block having a movable iron core, an insulation holder integrated with the upper end portion of the movable iron core and a movable contact piece which is biased toward and supported by the insulation holder through a contact pressing spring, and a fixed iron core fitted in a through hole in a yoke. A restoring spring is inserted into an axial hole of the solenoid. The movable iron core of the movable contact-point block is slidably inserted into the axial hole of the solenoid from thereabove. The fixed iron core is inserted into the axial hole from therebelow. The movable iron core is adapted to be slid into the axial hole based on the magnetization force and the demagnetization of the coil to move the movable contact-point block back and forth. | 03-12-2009 |
20090096559 | ELECTROMAGNETIC RELAY - An electromagnetic relay has a solenoid formed from a wound coil, a movable iron core that is reciprocated upwardly and downwardly in an axial hole of the solenoid, and a movable contact point that reciprocates together with the movable iron core. The movable contact point is contacted and separated with and from a fixed contact point for opening and closing a contact point. An arc generated at a time of opening and closing of the contact point is flowed, in a predetermined direction, by the magnetic field of at least a single permanent magnet placed at a side of the fixed contact point and the movable contact point that are contacted and separated with and from each other. Coil terminals are connected to leader lines of the coil, at least at a single side of the flow of the arc. | 04-16-2009 |
20090237191 | ELECTROMAGNETIC RELAY - An electromagnetic relay has a movable iron core, an insulation holder integrated with an upper end portion of the movable iron core, a movable contact piece supported by the insulation holder, and a solenoid formed from a wound coil. The movable iron core is housed in an axial hole in the solenoid movably in the upward and downward directions. The movable iron core is adapted to be moved upwardly and downwardly based on magnetization and demagnetization of the solenoid for contacting and separating a movable contact point provided on the movable contact piece with and from a fixed contact point for opening and closing a contact point. A permanent magnet is embedded in a base portion of the insulation holder. | 09-24-2009 |
Patent application number | Description | Published |
20090117829 | Polishing slurry for metal, and polishing method - A polishing slurry for metal comprises an oxidizer, a metal oxide dissolving agent, a metal inhibitor, and water, wherein the metal inhibitor is at least one of a compound having an amino-triazole skeleton and a compound having an imidazole skeleton. The use of the polishing slurry for metal makes it possible to raise the polishing speed sufficiently while keeping the etching speed low, restrain the generation of corrosion of the surface of a metal and dishing, and form a metal-film-buried pattern having a high reliability in the process of formation of wiring of semiconductor devices. | 05-07-2009 |
20120160804 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME - A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied.
| 06-28-2012 |
20130020283 | POLISHING SOLUTION FOR COPPER POLISHING, AND POLISHING METHOD USING SAME - The polishing solution for copper polishing of the invention comprises a first organic acid component which is at least one type selected from among an organic acid containing a hydroxyl group, an organic acid salt and an organic acid anhydride, an inorganic acid component which is at least one type selected from among a dibasic or greater inorganic acid and an inorganic acid salt, an amino acid, a protective film-forming agent, an abrasive grain, an oxidizing agent and water, wherein the inorganic acid component content in terms of inorganic acid is 0.15 mass % or greater, the amino acid content is 0.30 mass % or greater, the protective film-forming agent content is 0.10 mass % or greater, based on the entire polishing solution for copper polishing, and the ratio of the first organic acid component content in terms of organic acid with respect to the protective film-forming agent content is at least 1.5. | 01-24-2013 |
20140017893 | CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME - Disclosed is a CMP polishing liquid for polishing a substrate having a layer containing ruthenium, comprising: an oxidizing agent; polishing particles; water; and a compound having a structure represented by the following Formula (1), or a salt thereof. This CMP liquid is improved in at least the polishing rate to a ruthenium layer when compared with conventional polishing liquid. Also disclosed is a method for polishing a substrate using such a CMP polishing liquid. | 01-16-2014 |
Patent application number | Description | Published |
20090047507 | Multilayer printed circuit board - A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of Fe | 02-19-2009 |
20090061256 | Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same - An electromagnetic noise suppressor including a ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by a plating method in the presence of a magnetic field. | 03-05-2009 |
20150235764 | BODY WITH MAGNETIC FILM ATTACHED AND MANUFACTURING METHOD THEREOF - A fabrication method for fabricating a magnetic film provided body includes preparing a base body and forming a magnetic film on the base body. The magnetic film includes organic film(s) and ferrite film(s) alternately layered. The formation of the magnetic film alternately includes forming a ferrite film through a ferrite plating method, the ferrite film having a thickness of 20 μm or less and forming an organic film having a thickness of 0.1 μm to 20 μm, both inclusive, and a ratio t/E of 0.025 μm/GPa or more, where “t” indicates the thickness of the organic film while “E” indicates Young's modulus of the organic film. | 08-20-2015 |
Patent application number | Description | Published |
20110229673 | FLAME-RETARDANT POLYESTER RESIN COMPOSITION AND BLOW MOLDED CONTAINER - Provide is a flame-retardant polyester resin composition exhibiting excellent flame-retardant performance, specifically flame self-extinction performance and excellent injection moldability and blow moldability by biaxially-stretch blow molding method, by solving problem of poor injection moldability of the conventional polyester. A flame-retardant polyester resin composition comprising: (A) 50-80% by mass of a polyester resin, (B) 10-40% by mass of a polycarbonate resin, (C) 5-30% by mass of a polymer of a glass transition temperature Tg of less than 35° C., and (D) 0.5-5% by mass of a polymer of a carbon residue rate resin of at least 15%. | 09-22-2011 |
20110230625 | FLAME-RETARDANT POLYESTER RESIN COMPOSITION - Provide is a flame-retardant polyester resin composition exhibiting excellent flame-retardant performance, specifically flame self-extinction performance and excellent mechanical performance such as elastic modulus, bending strength, and impact strength. Also provided is a flame-retardant polyester resin composition exhibiting excellent flame-retardant performance, specifically flame self-extinction performance and excellent mechanical performance such as elastic modulus, bending strength, and impact strength, even when at least one of a polyester resin and a polycarbonate resin obtained from molded products having become waste materials is recycled. A flame-retardant polyester resin composition comprising: (A) 50-80% by mass of a polyethylene terephthalate (PET), (B) 5-40% by mass of a polycarbonate resin, (C) 5-30% by mass of a polymer of a glass transition temperature Tg of less than 35° C., (D) 0.5-5% by mass of a polymer of a carbon residue rate resin of at least 15%, and (E) 1-10% by mass of a polyethylene naphthalate (PEN). | 09-22-2011 |
Patent application number | Description | Published |
20110234206 | ACCELERATION SENSOR - The present embodiments provide an acceleration sensor, which enables highly accurate detection and has an extremely compact size. The acceleration sensor of the present embodiments is provided with a substrate, a anchor portion formed on the substrate, a support beam, which has one end connected to the anchor portion and extends across a space from the substrate, and a proof mass which is connected to the other end of the support beam and held across a space from the substrate. The acceleration sensor is further provided with first and second piezoelectric bending resonators, a comparison unit, and a calculation unit. The first and second piezoelectric bending resonators have one end connected to the anchor portion and the other end connected to the proof mass or the support beam and have a stack of a first electrode, a first piezoelectric film, and a second electrode. The first and second piezoelectric bending resonators extend on the both sides of the support beam and perform bending resonance motion in a direction perpendicular to the piezoelectric film. The comparison unit measures a difference of a resonance frequency between the first and second piezoelectric bending resonators. The calculation unit calculates an acceleration in a direction perpendicular to the extending direction of the support beam in the substrate surface from the difference of the resonance frequency. | 09-29-2011 |
20120206018 | RESONATOR AND OSCILLATOR - A resonator according to the embodiment includes: a substrate; a flat layered body which is formed above the substrate and is formed with at least a lower electrode, a piezoelectric film and an upper electrode; an anchor portion which fixes the layered body above the substrate; a cut-out portion inside the layered body; a tuning fork vibrator which is formed in the cut-out portion, has both ends supported by the layered body and is formed with at least a lower electrode, a piezoelectric film and an upper electrode; and an envelope which envelopes the layered body and the tuning fork vibrator in a noncontact fashion, and prevents an external force from being applied to the layered body and the tuning fork vibrator. | 08-16-2012 |
Patent application number | Description | Published |
20110234359 | REACTOR AND METHOD FOR MANUFACTURING REACTOR - A reactor includes: a first core having end surfaces; a second core having end surfaces facing the end surfaces of the first core; coils wound around at least part of the circumference of the first core and the second core; and gap members arranged between the end surfaces of the first core and the end surfaces of the second core. The coils and the gap members are integrally molded with a first resin in a state where the first and second cores are not provided. The coils and the first and second cores are integrally molded with a second resin in a state where the gap members are sandwiched between the end surfaces of the first core and the end surfaces of the second core. | 09-29-2011 |
20110279208 | COIL COMPONENT, REACTOR, AND METHOD FOR FORMING COIL COMPONENT - A coil component comprises a plurality of coil elements arranged side-by-side and a connecting portion that interconnects the coil elements. The plurality of coil elements are formed from a single flat wire wound edgewise so that the coil elements wind in the same direction and have rectangular annular configurations. The connecting portion includes a portion of the flat wire between the two coil elements wound edgewise to protrude radially outward from two adjacent sides of the rectangular annular configurations of the coil elements, and bent flatwise at three positions including a turnover so that the two coil elements are arranged side-by-side with their axes in parallel with each other. | 11-17-2011 |
20110279210 | COIL COMPONENT, REACTOR, AND METHOD FOR FORMING COIL COMPONENT - A coil component comprises a plurality of coil elements arranged side-by-side and a connecting portion that interconnects the coil elements. The plurality of coil elements are formed from a single flat wire wound edgewise so that the coil elements wind in the same direction. The connecting portion includes a portion of the flat wire between the two coil elements wound edgewise, wherein a part of the connection portion protrudes radially outward from the two coil elements. The connecting portion is bent flatwise at two positions so that the two coil elements are arranged side-by-side with their axes in parallel with each other. | 11-17-2011 |
20120098631 | INDUCTION DEVICE - An induction device includes a first core, a coil wound around the first core, and a second core cooperating with the first core to form a closed magnetic circuit. The first core and the coil are molded by a mold resin to form a molding, and the second core is assembled to the molding. | 04-26-2012 |
20140333409 | COIL - A coil includes a conductive wire formed spirally in the axial direction of the coil and an insulator formed in a strip-like spiral shape in the axial direction of the coil. A conductive member as the conductive wire of the coil is applied on at least one surface of the insulator. | 11-13-2014 |
Patent application number | Description | Published |
20150369418 | CONVERTIBLE STAND/TABLE - A convertible stand/table may be converted for use alternately as a table or a stand, and in particular, a stand suitable for use in mounting, securing, holding, or otherwise retaining or mounting one or more items for viewing and/or use by an individual, including, for example, a tablet or other portable computing device. Further, in some configurations, a magnetic mounting pad, including a suction cup surface and at least one permanent magnet, may be used to mount a portable electronic device such as a tablet on an inclined and magnetically-attractive surface, with the suction cup surface, e.g., provided by a microsuction layer, adhered to the back of the portable electronic device, and with the permanent magnet attracted to the magnetically-attractive surface. | 12-24-2015 |