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Hiroshi Okumura

Hiroshi Okumura, Kariya-Shi JP

Patent application numberDescriptionPublished
20100231003PILLAR STRUCTURE FOR AUTOMOBILE - A pillar structure that reduces bending deformation of the pillar toward the vehicle interior, during a vehicle side collision, by suppressing cross-sectional collapse of the pillar.09-16-2010
20110121614AUTOMOBILE ROOF STRUCTURE - An automobile roof structure in which each end of the roof reinforcement member is connected to a roof side rail via a bracket, the base end of the bracket is fixed to the end of the roof reinforcement member, a base plate of the bracket has upstanding sections that extend to a head edge of the base plate, the upper end of an upstanding end edge of each upstanding section abuts the upper end of a vehicle interior side-surface of the roof side rail, a gap is provided between the lower portion of the upstanding end edge and the side surface. A rotational moment M that is induced in the roof side rail by a collision load acting from the center pillar is not transmitted to the roof reinforcement member 05-26-2011

Hiroshi Okumura, Tokyo JP

Patent application numberDescriptionPublished
20100221899METHOD OF MANUFACTURING A POLYCRYSTALLINE SEMICONDUCTOR THIN FILM - A TFT and the like capable of realizing performances such as a low threshold voltage value, high carrier mobility and a low leak current easily. A TFT consists of a polycrystalline Si film having a small heat capacity part and a large heat capacity part, and the small heat capacity part is used at least as a channel part. The polycrystalline Si film is formed of a crystal grain film through laser annealing of an energy density with which the small heat capacity part melts completely but the large heat capacity part does not melt completely. Since the channel part is formed of large crystal grains grown from the boundaries between the small heat capacity part and the large heat capacity parts, it is possible to realize performances such as a low threshold voltage value, high carrier mobility and a low leak current by using a typical laser annealing device.09-02-2010

Patent applications by Hiroshi Okumura, Tokyo JP

Hiroshi Okumura, Oizumi-Machi JP

Patent application numberDescriptionPublished
20100195317SHOWCASE - There is disclosed a showcase comprising an illumination apparatus which can stably be held by a simple structure and which can illuminate the inside of a display chamber effectively without any unevenness. The illumination apparatus provided in the showcase comprises a shade member constituted of a light-transmitting front wall positioned on the side of the light emitting surfaces of LED elements, and a back wall positioned on the side of a substrate provided with the LED elements, the front wall comprising a curved portion having an arc-like section and a pair of flat portions extended continuously from both ends of the curved portion to intersect with the back wall at an acute angle, corner portions where the flat portions intersect with the back wall being a pair of engaging portions; and a holder provided with a plurality of engagement portions and the like with which the engaging portions are disengageably engaged.08-05-2010

Hiroshi Okumura, Kawasaki JP

Patent application numberDescriptionPublished
20090086327LASER IRRADIATION METHOD AND APPARATUS FOR FORMING A POLYCRYSTALLINE SILICON FILM - A method for changing an amorphous silicon film to a polycrystalline silicon film includes the steps of irradiating an elongate pulse laser beam onto the silicon film while scanning in the direction normal to the major axis of the elongate pulse laser beam, to form a plurality of irradiated areas, irradiating flat-surface light onto the irradiated areas in the direction parallel to the major axis, and analyzing distribution of the reflected light from the irradiated areas to determine the threshold value of micro-crystallization. The threshold value is used to further determine an energy density of the elongate pulse laser beam for the phase change process.04-02-2009
20090251626LIQUID CRYSTAL DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - To provide a structure and a manufacturing method which can manufacture, at a low cost and with good yield, a liquid crystal display panel having a lenticular lens and a substrate formed in a unified manner. When forming a lenticular lens onto a mother CF substrate by using a wet etching method, substrates are dipped into an etching solution while being raised up in such a manner that the length direction of slit openings of a mask is aligned with a vertical direction and an area having no mask pattern comes on a bottom side. With this, the residuals generated due to glass impurities can be drained towards the lower side along the lenticular lens shape to be discharged to the flat area, which makes it possible to suppress deterioration in the etching processed shape.10-08-2009
20100149450LENS SHEET AND DISPLAY PANEL - To suppress malshaping in a lenticular lens sheet formed by using ultraviolet curing resin, which is caused due to an increase in the aspect ratio of cylindrical lenses and anisotropy of curing contraction. Notch sections are provided to the cylindrical lenses for sectioning the cylindrical lenses in a pseudo manner in the major axis direction (extending direction) of the cylindrical lenses so as to suppress the anisotropy of the curing contraction of the resin.06-17-2010

Patent applications by Hiroshi Okumura, Kawasaki JP

Hiroshi Okumura, Kyoto JP

Patent application numberDescriptionPublished
20090160049Semiconductor device - A semiconductor device of the present invention includes a semiconductor chip; an internal pad for electrical connection formed on a surface of the semiconductor chip; a stress relaxation layer formed on the semiconductor chip and having an opening for exposing the internal pad; a connection pad made of a metal having solder wettability, formed on a part facing the opening of the internal pad and provided with a protruding portion protruding on the stress relaxation layer; a metal flange made of a metal having solder wettability, encompassing the periphery of the protruding portion and formed with a smaller thickness than a protruding amount of the protruding portion onto the stress relaxation layer; and a solder terminal for electrical connection with outside formed on the protruding portion and the metal flange.06-25-2009
20090160063Semiconductor Device - A semiconductor device includes a semiconductor substrate; a sealing resin layer formed on a top face of the semiconductor substrate; a metal post formed on the top face of the semiconductor substrate such that a top face of the metal post is exposed through the sealing resin layer; a projecting electrode formed on the top face of the metal post; and a low-elasticity resin layer made of a resin material with an elasticity modulus lower than that of the sealing resin layer and formed on the top face of the sealing resin layer such that part of the low-elasticity resin layer lies between the projecting electrode and the sealing resin layer.06-25-2009
20100044863Semiconductor device - An inventive semiconductor device includes: a semiconductor chip; an internal pad provided on a surface of the semiconductor chip for electrical connection; a surface protective film covering the surface of the semiconductor chip and having a pad opening from which the internal pad is exposed; a stress relief layer provided on the surface protective film and having an opening portion through which the internal pad exposed from the pad opening is exposed; a connection pad including an anchor buried in the pad opening and the opening portion and connected to the internal pad, and a projection provided integrally with the anchor as projecting on the stress relief layer, the projection having a width greater than an opening width of the opening portion; and a metal ball provided for external electrical connection as covering the projection of the connection pad.02-25-2010

Patent applications by Hiroshi Okumura, Kyoto JP

Hiroshi Okumura, Kyoto-Shi JP

Patent application numberDescriptionPublished
20090206466SEMICONDUCTOR DEVICE - A semiconductor device is provided that can further reduce the thickness of an electronic device and that can reduce its own mounting area and development period. This semiconductor device has a first semiconductor chip and a second semiconductor chip, and is formed in a WLCSP type package. On the upper surface of the first semiconductor chip, an integrated circuit is formed and, in a region other than where it is formed, a recess is formed. An integrated circuit is formed on the second semiconductor chip. The second semiconductor chip is provided in the recess of the first semiconductor chip such that the upper surface of the first semiconductor chip is level with that of the second semiconductor chip.08-20-2009

Hiroshi Okumura, Hyogo JP

Patent application numberDescriptionPublished
20090194320White Prepreg, White Laminated Plate, and Metal Foil Clad White Laminated Plate - [Problems] White laminates for print wire boards heretofore have problems of discoloring of thermosetting resin portion and reduction of reflectance. In LEDs of type using UV emitting device have not been appropriate in mounting recent high luminous intensity LED, a requirement for substrates which are not discolored towards UV and heat is becoming strong, since substrates on which the LED chip is mounted are deteriorated and discolored by UV. Further, in mounting chip LED, accuracy of board thickness is also required in order to avoid liquid leakage during sealing process of the chip LED.08-06-2009

Hiroshi Okumura, Kariya-City JP

Patent application numberDescriptionPublished
20090093945Controller and control system for internal combustion engine - An alcohol sensor detects alcohol concentration of a fuel stored in a fuel tank. When an internal combustion engine is started, a start timing of heating a sensor element by a heater is variably set based on the alcohol concentration.04-09-2009

Hiroshi Okumura, Kanagawa JP

Patent application numberDescriptionPublished
20120063009LENS SHEET, DISPLAY PANEL, AND ELECTRONIC APPARATUS - To suppress bad shaping generated due to fusion of neighboring cylindrical lenses in a lens sheet formed by using an ultraviolet curable resin, for example. A lens sheet includes: a substrate formed with a transparent material; a plurality of protruded lines provided on the substrate in parallel at a specific pitch; and a plurality of cylindrical lenses, each of which is provided between the plurality of protruded lines on the substrate. The protruded line for forming the lens is designed to be constituted with a set of two lines, i.e., a left protruded line and a right protruded line, to suppress fusion of the neighboring lenses.03-15-2012