| Patent application number | Description | Published |
|---|
| 20080286562 | THERMOSETTING ENCAPSULATION ADHESIVE SHEET - A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device ( | 11-20-2008 |
| 20100164127 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof. | 07-01-2010 |
| 20100324164 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a photocurable resin composition including the following ingredients (A), (B) and (C): (A) a linear chain epoxy resin represented by the following general formula (1), in which m indicates an integer of from 2 to 10, and R | 12-23-2010 |
| 20110058776 | RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL-SEMICONDUCTOR-DEVICE LEAD FRAME OBTAINED USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment. | 03-10-2011 |
| 20110201763 | THERMOSETTING RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED MATERIAL THEREOF, AND OPTICAL-SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to a thermosetting resin composition for optical-semiconductor element encapsulation, the thermosetting resin composition including the following ingredients (A) to (D): (A) an epoxy group-containing siloxane compound represented by the following general formula (1) in which R | 08-18-2011 |
| 20110298003 | EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to an epoxy resin composition for optical use including the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler including (c1) an inorganic filler having a refractive index larger than a refractive index of a cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler and (c2) an inorganic filler having a refractive index smaller than the refractive index of the cured product obtained from the ingredients of the epoxy resin composition excluding the (C) inorganic filler. | 12-08-2011 |
| 20120010319 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredients (A) and (B) in combination, and the oxetane compound includes the following ingredient (C): (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at 60° C. or higher; (B) a solid epoxy resin having at least two epoxy groups in one molecule thereof and having a refractive index of 1.6 or more by itself; and (C) an oxetane compound represented by the following general formula (1) in which n is an integer of 1 to 6. | 01-12-2012 |
| 20120010320 | PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME - The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredient (A), and the oxetane compound includes the following ingredient (B), and the ingredient (A) is contained in an amount of from 60 to 95% by weight and the ingredient (B) is contained in an amount of from 5 to 40% by weight relative to 1000% by weight of a total resin amount in the resin composition: (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at room temperature; and (B) an oxetane compound represented by the following general formula (1) in which n is an integer of from 1 to 6. | 01-12-2012 |
