Patent application number | Description | Published |
20090026369 | Electron Beam Inspection System and an Image Generation Method for an Electron Beam Inspection System - An object of the present invention is to provide an inspection system using a scanning electron microscope that detects a high-precision electron beam image and at the same time, removes restrictions for a low sampling rate, which presents a problem at this point, of an AD converter element and an inspection method. | 01-29-2009 |
20090045338 | Inspection method and apparatus using an electron beam - An inspection method and apparatus irradiates a sample on which a pattern is formed with an electron beam, so that an inspection image and a reference image can be generated on the basis of a secondary electron or a reflected electron emitted by the sample. An abnormal pattern is determined based on a difference in halftone values of each pixel between the inspection image and the reference image. A plurality of feature quantities of the abnormal pattern are obtained from an image of the abnormal pattern, and, based on the distribution of the plurality of feature quantities of the abnormal pattern, a range for classifying the type of the abnormal pattern is designated. Thus, a desired defect can be extracted from many defects extracted by inspection. | 02-19-2009 |
20090123059 | INSPECTION APPARATUS AND INSPECTION METHOD USING ELECTRON BEAM - A visual inspection apparatus and method using the scanning electron microscope are disclosed. An electron beam is scanned repeatedly on a sample, and an inspection and a reference image are generated by the secondary electrons generated from the sample or reflected electrons. From the differential image between the inspection image and the reference image, a defect is determined. The number of pixels in the generated image along the direction of repetitive scanning by the electron beam can be changed. | 05-14-2009 |
20090208092 | APPERANCE INSPECTION APPARATUS WITH SCANNING ELECTRON MICROSCOPE AND IMAGE DATA PROCESSING METHOD USING SCANNING ELECTRON MICROSCOPE - The present invention provides an appearance inspection apparatus that allows a user to give precedence to either defect detection performance or throughput. The appearance inspection apparatus allows a user to select the frequency of a digital image signal or the ratio of the frequency of the digital image signal to a sampling rate. Further, a user is allowed to select either throughput improvement or S/N improvement to prioritize. | 08-20-2009 |
20100008564 | INSPECTION APPARATUS FOR INSPECTING PATTERNS OF A SUBSTRATE - A pattern inspection apparatus has a setting unit of a plurality of cell areas A and B of different cell comparison pitches and inspects the plurality of cell areas of the different cell comparison pitches in accordance with settings of the setting unit. As information to read out image data for an inspection image and a reference image from an image memory, in addition to position information of a defective image, identification information showing either a cell comparison or a die comparison and relative position information of the reference image can be set. The apparatus also has a unit for setting a plurality of inspection threshold values every inspection area and inspects a plurality of inspection areas by the plurality of inspection threshold values. | 01-14-2010 |
20100246933 | Pattern Inspection Method And Apparatus - An apparatus for processing a defect candidate image, including: a scanning electron microscope for taking an enlarged image of a specimen by irradiating and scanning a converged electron beam onto the specimen and detecting charged particles emanated from the specimen by the irradiation; an image processor for processing the image taken by the scanning electron microscope to detect defect candidates on the specimen and classify the detected defect candidates into one of plural classes; a memory for storing output from the image processor including images of the detected defect candidates; and a display unit which displays information stored in the memory and an indicator, wherein the display unit displays a distribution of the detected and classified defect candidates in a map format by distinguishing by the classified class, and the display unit also displays an image of a defect candidate stored in the memory together with the map which is indicated on the map by the indicator. | 09-30-2010 |
20110163230 | CHARGED PARTICLE BEAM DEVICE - There is provided a substrate inspection device which uses a charged particle beam and is capable of more quickly extracting a defect candidate than ever before. The configuration of the substrate inspection device is such that a substrate having a circuit pattern is irradiated with a primary charged particle beam, the substrate is moved at a constant speed or at an increasing or a decreasing speed, a position resulting from the movement is monitored, the position of irradiation with the primary charged particle beam is controlled according to the coordinates of the substrate, an image in a partial region on the substrate is captured at a speed lower than the velocity of the movement, a defect candidate is detected based on the captured image, and the detected defect candidate is displayed in a map format. | 07-07-2011 |
20110278452 | PATTERN CHECK DEVICE AND PATTERN CHECK METHOD - Provided is a pattern inspection apparatus including: a charge formation means which forms charge on a surface of a substrate ( | 11-17-2011 |
20120091339 | CHARGED-PARTICLE MICROSCOPE DEVICE, AND METHOD OF CONTROLLING CHARGED-PARTICLE BEAMS - A charged-particle microscope device and a method of controlling charged-particle beams are provided, which are capable of signal detection at the time when the charged state of an observation sample or a defect portion becomes optimum. Charge accumulation-waiting time T from an initial irradiation with an electron beam | 04-19-2012 |
20130248709 | DEFECT INSPECTING APPARATUS - A semiconductor wafer | 09-26-2013 |