| Patent application number | Description | Published |
|---|
| 20080211871 | NOZZLE PLATE, METHOD FOR MANUFACTURING NOZZLE PLATE, DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE APPARATUS - A nozzle plate includes: a first silicon layer; a glass layer; a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and a silicon oxide layer provided between the first silicon layer and the second silicon layer. A nozzle hole passing through the first silicon layer and discharging a droplet is formed. A channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole is formed. A liquid chamber formed in the glass layer and communicating with the channel is formed. | 09-04-2008 |
| 20080243008 | Blood Pressure Measuring Apparatus and Blood Pressure Measuring Method - To provide a technique which makes it possible to obtain a proper pulse wave signal for high-accuracy blood pressure measurements, thereby saving the trouble of taking measurements repeatedly and reducing a physical burden imposed on the user by cuff pressure. A blood pressure measuring apparatus includes a cuff which is attached to and around an external ear; a first pulse wave detector and a second pulse wave detector which detect a pulse wave in a part squeezed by the cuff and which are affected differently from each other by a characteristic of body movements; a body movement detecting means which detects the characteristic of body movements; a pulse wave selecting means which selects a pulse wave detected by one of the first pulse wave detector and the second pulse wave detector based on the characteristic of body movements detected by the body movement detecting means; and a blood pressure value deriving means which derives a blood pressure value based on the pulse wave selected by the pulse wave selecting means. | 10-02-2008 |
| 20100109037 | FLUORESCER SOLUTION, LIGHT-EMITTING DEVICE, AND METHOD FOR MANUFACTURING SAME - In a fluorescer solution, a plurality of types of fluorescent particles are contained in a resin liquid. Average particle sizes of these fluorescent particles decrease as densities of the types increase. In other words, average settling rates v | 05-06-2010 |
| 20100112734 | APPARATUS AND METHOD FOR MANUFACTURING LED DEVICE - A method for manufacturing an LED device, includes: mounting an LED chip, which emits a first light, on a bottom surface of a recess formed in an upper surface of a package, pouring a resin liquid containing phosphor particles, which emits a second light upon incidence of the first light, into the recess, fixing the package to a package fixing plate of an apparatus of the LED device, precipitating the phosphor particles in the resin liquid with a centrifugal force applying to the package in a direction from the upper surface to the lower surface of the package by rotating a rotary member with a rotary driving unit, and curing the resin liquid. | 05-06-2010 |
| 20110204400 | LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME AND APPARATUS FOR MANUFACTURING LIGHT EMITTING DEVICE - According to one embodiment, a light emitting device includes a package member, a light emitting element provided in the package member, a first phosphor layer and a second phosphor layer. A first phosphor layer is provided on the light emitting element and has a first phosphor. A second phosphor layer is provided on the first phosphor layer and has a second phosphor. A luminescent efficiency of the first phosphor is higher than a luminescent efficiency of the second phosphor. | 08-25-2011 |
| 20110297969 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle. | 12-08-2011 |
| 20110297987 | OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed. | 12-08-2011 |
| 20110300644 | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a method for manufacturing a semiconductor light emitting device is disclosed. The method can include forming a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, a second insulating layer, a transparent material and a phosphor layer. The transparent material is formed on the first major surface of a semiconductor layer selected from the plurality of semiconductor layers on the basis of an emission spectrum of a light obtained from the first major surface side. The transparent material transmits the light. The phosphor layer is formed on the transparent material and the first major surface of the plurality of the semiconductor layers. | 12-08-2011 |
