Patent application number | Description | Published |
20080210457 | Tape carrier for semiconductor device and method for making same - A tape carrier for semiconductor device has a resin tape provided with an opening section for bonding, and a wiring lead formed on the resin tape. The wiring lead has a notched section disposed in the opening section and including a notch width W | 09-04-2008 |
20130064499 | PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes a substrate, a photoelectric conversion element optically coupled to an optical fiber, and a conductor pattern that is provided on a surface of the substrate and includes an electrode pattern mounting the photoelectric conversion element and a restriction pattern for restricting a position of the optical fiber. | 03-14-2013 |
20130170790 | OPTICAL BOARD, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL MODULE STRUCTURE - An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane. | 07-04-2013 |
20130188906 | OPTICAL MODULE AND METHOD FOR PRODUCING THE SAME - An optical module includes a substrate, an optical device of a surface-emitting element or a surface-receiving element mounted on a surface of the substrate with a light-emitting portion or a light-receiving portion located to face the surface of the substrate, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a mirror provided to face the light-emitting portion or the light-receiving portion of the optical device and a tip of the optical fiber, and optically connect the optical device and the optical fiber, and an optical fiber receiving groove provided in the surface of the substrate to receive the optical fiber. A width of the mirror is greater than a width of the optical fiber receiving groove. Reflecting portions are provided on edges, respectively, of a mirror side end of the optical fiber receiving groove, and the reflecting portions reflect incident light from the mirror facing the edges, again back to the facing mirror. | 07-25-2013 |
20130188907 | OPTICAL MODULE AND METHOD FOR PRODUCING THE SAME - An optical module includes a substrate, an optical device including a surface-emitting or -receiving element mounted on a surface of the substrate with a light-emitting or -receiving portion, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a damming member provided between the optical device and the substrate to extend in a width direction of the substrate and dividing a gap between the optical device and the substrate in the longitudinal direction of the substrate into a first portion and a second portion, and a mirror provided at one side surface of the damming member a tip of the optical fiber. The first portion provided on an opposite side to the optical fiber is filled with an underfill resin, and the second portion provided on a side close to the optical fiber is filled with an optical fiber fixing resin. | 07-25-2013 |
20130209027 | PHOTOELECTRIC COMPOSITE WIRING MODULE - A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device. | 08-15-2013 |
20140102756 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND MULTI-CORE DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable includes first and second signal lines arranged parallel to each other, a conductive layer made of a conductor in which a current is induced when signals propagate through the first and second signal lines, and a dielectric disposed between the first and second signal lines and the conductive layer. The conductive layer has a signal attenuating structure including a non-continuous section in which the conductor is non-continuous, the non-continuous section being located such that, among differential signal components and common-mode signal components included in the signals propagating through the first and second signal lines, the common-mode signal components are attenuated by an attenuation factor greater than an attenuation factor of the differential signal components. | 04-17-2014 |
20140105536 | OPTICAL BOARD, METHOD OF MANUFACTURING THE OPTICAL BOARD AND OPTICAL MODULE STRUCTURE - An optical board includes a plate-shaped resin base material including a slit-shaped optical fiber housing portion formed thereon, a metal layer formed on a surface of the based material, and a reflective layer for reflecting light propagating in an optical fiber housed in the optical fiber housing portion. The base material further includes an inclined surface inclined with respect to the surface of the base material at a terminal end of the optical fiber housing portion. The reflective layer is formed over an end face of the metal layer and the inclined surface, the end face forming a flat surface continuously with the inclined surface. | 04-17-2014 |
20140133799 | OPTICAL BOARD, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL MODULE - An optical board a substrate includes a plate-shaped resin including a first main plane and a second main plane, and an optical fiber receiving portion to receive an optical fiber, a first metal layer provided on the first main plane, and a second metal layer provided on the second main plane. The optical fiber receiving portion has a cavity structure, which penetrates in a thickness direction of the substrate between the first main plane and the second main plane, and the optical fiber is prevented from slipping out of the first main plane and the second main plane. | 05-15-2014 |
20140212086 | OPTICAL MODULE - An optical module includes a substrate including a conductor pattern formed thereon, a photoelectric conversion element mounted on the substrate, and an optical coupling member for optically coupling the photoelectric conversion element to an optical fiber. A part of the conductor pattern on the substrate defines an engagement portion that engages with the optical coupling member so as to position the optical coupling member relative to the substrate. | 07-31-2014 |
20140332978 | OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF OPTICAL WIRING SUBSTRATE AND OPTICAL MODULE - An optical wiring substrate includes a first conductor layer including a metal, a second conductor layer including a metal and arranged parallel to the first conductor layer, an insulation layer disposed to insulate the first conductor layer from the second conductor layer, and an electronic component including a photoelectric conversion element mounted on the substrate, and a via hole formed in the second conductor layer and the insulation layer so as to pass through the second conductor layer and the insulation layer in a thickness direction thereof, the via hole including an inner surface plated with a metal. The via hole is configured such that at least a part of a bottom surface thereof blocked by the first conductor layer is arranged in a plan view so as to overlap with an arrangement position of a pad of the electronic component that is mounted on the first conductor layer. | 11-13-2014 |
20140334770 | OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF OPTICAL WIRING SUBSTRATE AND OPTICAL MODULE - An optical wiring substrate includes an insulation layer including a resin, and a conductor layer formed on the insulation layer and including a metal and an inclined surface inclined relative to an optical axis of an optical fiber. A first wiring pattern and a second wiring pattern are formed in the conductor layer, the first wiring pattern including a first connecting part to which a first electrode of a photoelectric conversion element is connected, and the second wiring pattern including a second connecting part to which a second electrode of the photoelectric conversion element is connected. A distance between the first wiring pattern and the second wiring pattern is narrowest between the first connecting part and the second connecting part. A distance between the first connecting part and the second connecting part is less than a dimension of the conductor layer in a thickness direction thereof. | 11-13-2014 |
20140334771 | OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF OPTICAL WIRING SUBSTRATE AND OPTICAL MODULE - An optical wiring substrate includes an insulation layer including a resin, an conductor layer formed on the insulation layer and including a metal, and an optical fiber accommodating part configured to accommodate an end part of an optical fiber. The conductor layer further includes a reflecting surface configured to be inclined relative to the insulation layer so as to reflect a light that propagates through the optical fiber. The optical fiber accommodating part includes at one end part thereof an abutting surface configured such that a tip of optical fiber inserted is abutted thereon. | 11-13-2014 |