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Hiroshi Inada

Hiroshi Inada, Utsunomiya-Shi JP

Patent application numberDescriptionPublished
20100233377IMPRINT APPARATUS AND METHOD - An imprint apparatus which includes an imprint head configured to hold a mold, and performs an imprint process including dispensing of a resin to a shot region on a substrate and pressing of the mold and the dispensed resin with each other, comprises a controller configured to control an order of the imprint process for a plurality of selected shot regions on the substrate, and a first dispenser and a second dispenser configured to dispense the resin, wherein the first dispenser is arranged on a side of a first direction with respect to the imprint head, and the second dispenser is arranged on a side of a second direction opposite to the first direction with respect to the imprint head.09-16-2010
20110057354IMPRINTING METHOD AND IMPRINTING APPARATUS - In an imprinting method for transferring a pattern of a mold to a resin coated on a substrate by using an imprinting apparatus including a mold holding unit and a resin coating unit, the resin is coated in n shot areas arranged in a direction parallel to a direction in which the holding unit and the coating unit are arranged where n is an integer equal to or greater than 2, and the pattern is transferred to the shot areas on a one-by-one basis. A distance D between the coating unit and the mold and a width W of each shot area as seen in the direction parallel to the direction in which the holding unit and the coating unit are arranged are selected so as to satisfy a condition D>(3/2−1/n)W, and the coating and the transferring are performed repeatedly on the substrate.03-10-2011

Hiroshi Inada, Osaka JP

Patent application numberDescriptionPublished
20100156450Enabling higher operation speed and/or lower power consumption in a semiconductor integrated circuit device - A semiconductor integrated circuit device 06-24-2010
20110031577Photodiode Array - A photodiode array for near infrared rays that includes photodiodes having a uniform size and a uniform shape, has high selectivity for the wavelength of received light between the photodiodes, and has high sensitivity with the aid of a high-quality semiconducting crystal containing a large amount of nitrogen, a method for manufacturing the photodiode array, and an optical measurement system are provided. The steps of forming a mask layer 02-10-2011
20110140082LIGHT-RECEIVING ELEMENT AND LIGHT-RECEIVING ELEMENT ARRAY - Provided are a light-receiving element which has sensitivity in the near-infrared region and in which a good crystal quality is easily obtained, a one-dimensional or two-dimensional array of the light-receiving elements is easily formed with a high accuracy, and a dark current can be reduced; a light-receiving element array; and methods for producing the same.06-16-2011

Patent applications by Hiroshi Inada, Osaka JP

Hiroshi Inada, Osaka-Shi JP

Patent application numberDescriptionPublished
20090295960PHOTODIODE, PHOTODIODE ARRAY AND IMAGE PICKUP DEVICE - A photodiode that can obtain a clear signal or image in a case in which noise that is not limited to a dark current is high, a photodiode array, and an image pickup device are provided. The photodiode includes a sensor section that is provided on a first semiconductor having a band gap energy which allows input light to be received; a modulated light-emitting section that is positioned behind the sensor section with respect to the input light, and that emits modulated light to the sensor section; and a signal processor that is formed on a second semiconductor which transmits the modulated light, and that is positioned between the sensor section and the modulated light emitting section.12-03-2009
20100171097DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a detection device includes the steps of providing bonding bumps on at least one of a light-receiving element array and a read-out circuit multiplexer, fixing a bump height adjusting member for adjusting the heights of the bumps to the light-receiving element array and/or the read-out circuit multiplexer on which the bumps are provided, and pressing a flat plate on the tops of the bumps and deforming the bumps until the flat plate comes in contact with the end of the bump height adjusting member.07-08-2010
20100181484NEAR-INFRARED IMAGING SENSOR - A near-infrared imaging sensor according to the present invention includes a photodiode array sensitive to light with a wavelength of 1.2 to 3 μm and a multiplexer including a signal readout circuit. The near-infrared imaging sensor is contained in a housing and is vacuum-sealed. The housing includes a main body section and a lid covering the main body section. The lid is made of a material transparent to light with a wavelength of 1.2 to 3 μm.07-22-2010
20100258707PHOTODIODE ARRAY AND IMAGE PICKUP DEVICE USING THE SAME - A photodiode array includes a plurality of photodiodes arranged in a single semiconductor laminate including a first conductivity-type semiconductor layer and an absorption layer overlying the first conductivity-type semiconductor layer. The photodiode array also includes a functional portion among the photodiodes in a predetermined proportion. The functional portion acts as a monitor light receiving portion and/or a charge sweep portion. Each of the photodiodes and functional portion has a second conductivity-type region reaching the absorption layer from the surface of the semiconductor laminate and an electrode in ohmic contact with the second conductivity-type region.10-14-2010
20100258894PHOTODIODE ARRAY AND IMAGE PICKUP DEVICE USING THE SAME - A photodiode array with reduced optical crosstalk and an image pickup device using it are provided. The photodiode array 10-14-2010
20110147707DETECTION DEVICE, PHOTODIODE ARRAY, AND METHOD FOR MANUFACTURING THE SAME - The present invention provides an image pickup device used to capture an image of an object by receiving light in a near infrared region reflected from the object. The image pickup device includes semiconductor light-receiving elements each having a light-receiving layer with a band gap wavelength of 1.65 to 3.0 μm.06-23-2011

Patent applications by Hiroshi Inada, Osaka-Shi JP

Hiroshi Inada, Shizuoka JP

Patent application numberDescriptionPublished
20100075500Metal polishing slurry and chemical mechanical polishing method - The invention provides a metal polishing slurry containing a compound represented by the general formula (1): (X03-25-2010

Hiroshi Inada, Kanagawa JP

Patent application numberDescriptionPublished
20100032265ARTICLE CONVEYING DEVICE - An article conveying device 02-11-2010

Hiroshi Inada, Haibara-Gun JP

Patent application numberDescriptionPublished
20090203215METAL POLISHING SLURRY AND CHEMICAL MECHANICAL POLISHING METHOD - A metal polishing slurry which is capable of simultaneously realizing a high polishing speed and reduced dishing in the polishing of a subject to be polished is provided. The metal polishing slurry includes a compound represented by the following general formula (1):08-13-2009
20090221145METAL POLISHING SLURRY AND CHEMICAL MECHANICAL POLISHING METHOD - A metal polishing slurry which is capable of simultaneously realizing a high polishing speed and reduced dishing in the polishing of a subject to be polished is provided. The metal polishing slurry includes, an oxidizing agent; and an organic acid; and a compound represented by the following general formula (1):09-03-2009
20090325103ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING SAME - An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a resin having at least two of repeating units represented by general formula (1) below and exhibiting increased solubility in an alkali developer when acted on by an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation.12-31-2009

Hiroshi Inada, Hyogo JP

Patent application numberDescriptionPublished
20090066222Organic electronic functional material and use thereof - The invention provides an organic electronic functional material which comprises a 1,3,5-tris(4-(N,N-diarylamino)phenyl)benzene represented by the general formula (I)03-12-2009

Hiroshi Inada, Haga-Gun JP

Patent application numberDescriptionPublished
20080312626DISPOSABLE DIAPER - A disposable diaper comprising a liquid permeable topsheet 12-18-2008