| Patent application number | Description | Published |
|---|
| 20090000109 | Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting Apparatus - To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. | 01-01-2009 |
| 20090004780 | Method for Fabricating Semiconductor Chip - After a film layer | 01-01-2009 |
| 20090035892 | Component Bonding Method, Component Laminating Method And Bonded Component Structure - It is an object of the invention to provide a component bonding method and a component laminating method that can improve productivity in the heat pressing process. | 02-05-2009 |
| 20090197393 | Method for dividing semiconductor wafer and manufacturing method for semiconductor devices - In a semiconductor wafer including a plurality of imaginary-divided-regions which are partitioned by imaginary-dividing-lines that are respectively arranged in a grid-like arrangement on the semiconductor wafer and a circumferential line that is the outer periphery outline of the semiconductor wafer, a mask is placed so as to expose an entirety of surfaces of the wafer corresponding to respective removal-regions, the removal-regions being regions in approximately triangular form partitioned by the circumferential line of the wafer and the imaginary-dividing-lines and being some of the imaginary-divided-regions, and then plasma etching is performed on a mask placement-side surface, by which the semiconductor wafer is divided into the individual semiconductor devices along dividing lines while portions correspond to the removal-regions in the wafer are removed. | 08-06-2009 |
| 20090202333 | ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING APPARATUS - This invention intends to provide an electronic component pick-up method, an electronic component loading method and an electronic component loading apparatus which are | 08-13-2009 |
| 20090279995 | CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AND CHIP RELEASING METHOD - An object of the invention is to provide a chip pickup apparatus, a chip pickup method, a chip releasing device and a chip releasing method in each of which chips can be picked up at a high speed without being damaged. | 11-12-2009 |
| 20100055875 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER - In a laser processing step S | 03-04-2010 |
