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Hiroshi Aoyama
Hiroshi Aoyama, Nagoya-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090286064 | SLIDING PARTS, PRECISION PARTS AND TIMEPIECES AND ELECTRONIC EQUIPMENT USING THE SAME - The present invention relates to sliding parts, precision parts and timepieces and electronic equipment using those parts. Sliding parts are composed by a resin in which the degree of orientation of a fibrous filler is higher at the portion serving as the sliding surface than inside the sliding part, and the fibrous filler is oriented along the sliding surface on the sliding surface. Alternatively, precision parts are composed by a resin to which has been added carbon fibers for which a carbon compound is thermally decomposed to carbon in the vapor phase and simultaneously grown directly into fibers simultaneous to this thermal decomposition. Moreover, timepieces and electronic equipment are composed by these sliding parts or these precision parts. | 11-19-2009 |
| 20110086976 | SLIDING PARTS, PRECISION PARTS AND TIMEPIECES AND ELECTRONIC EQUIPMENT USING THE SAME - The present invention relates to sliding parts, precision parts and timepieces and electronic equipment using those parts. Sliding parts are composed by a resin in which the degree of orientation of a fibrous filler is higher at the portion serving as the sliding surface than inside the sliding part, and the fibrous filler is oriented along the sliding surface on the sliding surface. Alternatively, precision parts are composed by a resin to which has been added carbon fibers for which a carbon compound is thermally decomposed to carbon in the vapor phase and simultaneously grown directly into fibers simultaneous to this thermal decomposition. Moreover, timepieces and electronic equipment are composed by these sliding parts or these precision parts. | 04-14-2011 |
Hiroshi Aoyama, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090158564 | ELECTRONIC COMPONENT MANUFACTURING APPARATUS - To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers. | 06-25-2009 |
| 20090166431 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - The invention relates to an RFID medium | 07-02-2009 |
| 20090217515 | ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRODUCTION EQUIPMENT - Manufacturing an electronic component | 09-03-2009 |
Hiroshi Aoyama, Ebina-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080223839 | Laser Machining Apparatus - A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey. | 09-18-2008 |
| 20080232421 | Method and Apparatus for Forming a Plurality of Laser Beams With Ultraviolet Wavelength, and Laser Machining Apparatus - The invention provides a method and an apparatus for forming a plurality of ultraviolet-wavelength laser beams, and a laser machining apparatus, in which the machining efficiency can be improved due to easy maintenance and inspection while deterioration of wavelength conversion means can be prevented to reduce the running cost. A laser beam with a near infrared wavelength output from a laser oscillator is branched into a plurality of laser beams by a laser distribution unit. Each branched laser beam is partially converted into a laser beam whose wavelength is ½ of the near infrared wavelength by a wavelength converter. An ultraviolet laser beam whose wavelength is ⅓ of the near infrared wavelength of the laser beam is formed out of the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength by another wavelength converter, both the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength being output from the wavelength converter. The ultraviolet laser beam is extracted and supplied to a portion to be machined, by a wavelength separator. | 09-25-2008 |
| 20080283491 | Fabrication method of printed circuit board and printed circuit board machining apparatus - There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer. | 11-20-2008 |
Hiroshi Aoyama, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20080273842 | Optical Connector - An optical connector comprising: first and second movable members | 11-06-2008 |
Hiroshi Aoyama, Ebina JP
| Patent application number | Description | Published |
|---|---|---|
| 20080237204 | Laser Beam Machining Method for Printed Circuit Board - A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam | 10-02-2008 |
Hiroshi Aoyama, Tsuchiura JP
| Patent application number | Description | Published |
|---|---|---|
| 20110214903 | FUNCTIONAL PANEL AND METHOD FOR JOINING SAME - There is provided a functional panel that can be joined and disassembled with ease by solving problems with a functional panel including electrical conductors integrally molded therewith, causing occurrence of cracking on the surface thereof, or cracking of a molded unit around the periphery of the electrical conductor, thereby rendering the electrical conductor susceptible to a break when a flexural load, an impact load, and so forth, acts on the functional panel. The functional panel comprises a main body of a panel member, an electrical conductor coated with a semi-cured resin having heat resistance and insulation properties, and a reinforcing fiber having a continuous filament, for fixing the electrical conductor to the main body of the panel member to thereby provide enhancement, and the functional panel is formed by exposing one end, and the other end of the electrical conductor from respective end faces of the panel member formed by integral molding. | 09-08-2011 |