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Hiroomi
Hiroomi Honda, Miyazaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20110197665 | SURFACE TEXTURE MEASURING DEVICE - A surface texture measuring device includes a threshold value storage module configured to store a threshold input through an operation key, a stylus move distance detector configured to detect a move distance in the trace direction of the stylus, a cumulative move distance storage module configured to cumulatively store the move distance of the stylus detected by the stylus move distance detector; and. a notification module (controller) configured to make a comparison between the threshold value stored in the threshold value storage module and the cumulative move distance stored in the cumulative move distance storage module and notifying a user of replacement of the stylus when the cumulative move distance has exceeded the threshold value. | 08-18-2011 |
Hiroomi Kobayashi, Ota-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080263857 | ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively. | 10-30-2008 |
| 20110030203 | ELECTRONIC COMPONENT MOUNTING APPARATUS - The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively. | 02-10-2011 |
Hiroomi Matsuzaki, Mishima-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100221038 | CLEANING DEVICE, DEVELOPING DEVICE, CARTRIDGE, CLEANING BLADE SECURING METHOD, AND DEVELOPING BLADE SECURING METHOD - A cleaning device includes a cleaning blade for removing toner remaining on a surface of an image bearing member for carrying a toner image; a supporting member for supporting the cleaning blade; a mounting hole provided in one of the cleaning blade and the supporting member; a projection which is provided on the other of the cleaning blade and the supporting member and which is inserted in the mounting hole; and a recess provided in the projection and extended from a free end portion of the projection toward a base portion of the projection, wherein the cleaning blade and the supporting member are secured to each other by the projection deformed such that the recess expands outwardly of the mounting hole by resin material in the recess. | 09-02-2010 |
Hiroomi Nakajima, Yokkaichi-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120018697 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device in accordance with an embodiment comprises first lines, second lines, and a memory cell array including memory cells. Each of the memory cells is disposed at each of intersections of the first lines and the second lines and is configured by a rectifier element and a variable resistor connected in series. The rectifier element comprises a first semiconductor region of a first conductivity type including an impurity of a first impurity concentration, and a second semiconductor region of a second conductivity type including an impurity of a second impurity concentration lower than the first impurity concentration. The first semiconductor region and the second semiconductor region are formed by silicon. A junction interface of the first semiconductor region and the second semiconductor region is a pseudo-heterojunction formed by two layers that have different band gap widths and are formed of the same material. | 01-26-2012 |
Hiroomi Ogawa, Ichinomiya-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20090154008 | SPINDLE MOTOR AND RECORDING DISK DRIVE HAVING SPINDLE MOTOR - Using a simple and inexpensive method, a reliable spindle motor having a simple and inexpensive structure is afforded, in which contact failure of the FPC does not occur even when the motor undergoes external impact. An extending portion is provided radially outer side of an annular recess of a base. The extending portion has a step whose radially outer side is higher, and a through hole formed such as to pass through the base from its inside to outside. A FPC is disposed on an upper surface of a stator. The FPC is fixed to a lower surface of the base through the through hole. The bending height and the bending angle of the FPC are minimized by providing the step having appropriate height so that the FPC is not easily peeled off even when subject to external impact. | 06-18-2009 |
Hiroomi Tanaka, Shizuoka-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090166190 | Anodizing apparatus - An anodizing apparatus for forming an anodized film on the surface of a workpiece ( | 07-02-2009 |
| 20090236228 | ANODIZING METHOD AND APPARATUS - An anodizing method in which a workpiece made of aluminum or aluminum alloy is immersed in an electrolytic solution, and treatment is performed in which the application of positive voltage for a very short period of time and the removal of charges are repeated alternately between the workpiece and a cathode arranged in the electrolytic solution includes a step of performing treatment in which the positive voltage application and the charge removal are repeated in a tentative cycle, measuring the control point arrival time of a current waveform at the positive voltage application period, and determining normal positive voltage application time based on the control point arrival time; and a step of performing treatment in which the application of positive voltage and the removal of charges are repeated in a cycle corresponding to the normal positive voltage application time, and forming an anodized film on the surface of the workpiece. | 09-24-2009 |
| 20100243457 | ANODIC OXIDE COATING AND ANODIZING OXIDATION METHOD - An anodic oxide coating has fewer irregularities and has a nonuniform film thickness, and an anodic oxidation method yields the coating. Specifically, an anodic oxidation method of an aluminum or aluminum alloy member applies a voltage to a process component immersed in a processing bath, the process component made of any of aluminum and aluminum alloy members containing at least any of an impurity and an additive. The method includes disposing a pair of negative plates so that the negative plates face the process component; and repeatedly performing a process of applying a positive voltage to the process component and a process of removing charges by using a power supply apparatus including an anodizing direct-current power source, a discharge direct-current power source, a switch configured to connect the process component and the pair of negative plates to any one of terminals of the anodizing direct-current power source and the discharge direct-current power source, the terminals having polarities opposite to each other, and capacitors and regeneration circuits connected to the respective power sources in parallel to the process component and the pair of negative plates. | 09-30-2010 |
Hiroomi Tsutae, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080290473 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device, in which a substrate is disposed in a chamber and a fluorine-containing silicon oxide film is formed on the substrate using a plasma CVD process. The fluorine-containing silicon oxide film is formed such that the release of fluorine from this silicon oxide layer is suppressed. According to this semiconductor device manufacturing method, a stable semiconductor device can be provided such that the device includes a fluorine-containing silicon oxide film (FSG film) at which the release of fluorine is suppressed, and thus peeling does not occur. | 11-27-2008 |
| 20090188526 | Process of cleaning a semiconductor manufacturing system and method of manufacturing a semiconductor device - A process of cleaning a semiconductor manufacturing system, and a method of manufacturing a semiconductor device. The cleaning process includes, for example, positioning a ceramic cover on the electrostatic chuck in tight contact with the chuck, and feeding a fluoride-based cleaning gas into a chamber. After the cleaning process, a process of forming a semiconductor film (deposition process) is performed. It is possible to prevent fluorine degasification from a substrate-supporting electrode (electrostatic chuck) during the deposition process. A semiconductor film can be formed without causing a temperature drop near the substrate. This prevents irregular film thickness, defective etching, film flaking, etc. | 07-30-2009 |
Hiroomi Ueda, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110140776 | VARIABLE FREQUENCY AMPLIFIER - A variable frequency amplifier includes a main amplifier system | 06-16-2011 |