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Hironori Takahashi
Hironori Takahashi, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100189478 | FIXING DEVICE AND IMAGE FORMING APPARATUS - An image forming apparatus includes a fixing device. The fixing device includes a heating member and a pressing member that form a fixing nip, an approach guide positioned an upstream in a recording-medium conveyance direction of a fixing nip, a fixing-pressure-changing mechanism designed to change the fixing device between a high-pressure mode and a low-pressure mode, and an approach-guide-changing mechanism designed to change an angle of the approach guide in conjunction with the changing by the fixing-pressure-changing mechanism. | 07-29-2010 |
Hironori Takahashi, Toyama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100184299 | SUBSTRATE PROCESSING METHOD - There is provided a substrate processing method to suppress popping while increasing the throughput in a photoresist removing process. The substrate processing method comprises: loading a substrate, which is coated with photoresist into which a dopant is introduced, into a process chamber; heating the substrate; supplying a reaction gas to the process chamber, wherein the reaction gas contains at least oxygen and hydrogen components, and concentration of the hydrogen component ranges from 60% to 70%; and processing the substrate in a state where the reaction gas is excited into plasma. In the heating of the substrate, the substrate may be heated to 220° C. to 300° C. In the heating of the substrate, the substrate may be heated to 250° C. to 300° C. | 07-22-2010 |
Hironori Takahashi, Shizuoka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100090112 | SINGLE TERAHERTZ WAVE TIME-WAVEFORM MEASURING DEVICE - A single terahertz wave time-waveform measuring device | 04-15-2010 |
| 20100091266 | TOTAL REFLECTION TERA HERTZ WAVE MEASURING APPARATUS - A total reflection terahertz wave measuring apparatus | 04-15-2010 |
| 20100091359 | OPTICAL AMPLIFYING DEVICE - The present invention provides an optical amplifying device which can be easily downsized, increased in output, and stabilized. An optical amplifying device | 04-15-2010 |
Hironori Takahashi, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100085633 | OPTICAL ELEMENT AND PRODUCTION METHOD OF THE SAME - Disclosed is an optical element for use in an optical apparatus having a light source which emits a light flux with a wavelength λ (350 nm≦λ≦450 nm), the optical element containing: a molded portion formed by molding a resin; and one or a plurality of anti-reflection layers formed on the molded portion, wherein at least one of the anti-reflection layers is made of Si | 04-08-2010 |
Hironori Takahashi, Redmond, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20100083254 | FLEXIBLE AND SCALABLE OPERATING SYSTEM ACHIEVING A FAST BOOT AND RELIABLE OPERATION - Systems and methods are provided for a flexible and scalable operating system achieving a fast boot. A computing system is described that includes a reserved static object memory configured to store predefined static threads, and a secure kernel configured to be executed in a fast boot mode. The secure kernel further may be configured to chain the static threads to a secure kernel thread queue stored in a secure kernel work memory, and to create temporary threads in the secure kernel work memory during the fast boot mode. The computing system may include a main kernel configured to be initialized by creating dynamic threads in a main kernel work memory during the fast boot mode. The main kernel may be configured to chain the static threads to a main kernel thread queue, and to assume control of the static threads from the secure kernel. | 04-01-2010 |
Hironori Takahashi, Nagoya-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20080230590 | METHOD FOR FABRICATING DISSIMILAR MATERIAL JOINTED BODY - A method for producing a bonded body of different materials of the present invention is a method for producing a bonded body of different materials ( | 09-25-2008 |
| 20090061040 | DIE FOR FORMING HONEYCOMB STRUCTURE - A plate-like shape die | 03-05-2009 |
| 20090230176 | JOINING JIG AND METHOD FOR MANUFACTURING A BONDED BODY OF DIFFERENT MEMBERS BY USING THE JIG - A joining jig | 09-17-2009 |
| 20090232927 | HONEYCOMB STRUCTURE-FORMING DIE AND METHOD FOR MANUFACTURING THE SAME - A honeycomb structure-forming die 1 has a die substrate 22 including a first plate-shaped member 23 having back holes 6 for introducing a raw forming material and a second plate-shaped member 24 having slits 5 for forming the material into a lattice shape. The first plate-shaped member 23 has columnar portions 8 where at least a part is zoned by a slit-shaped groove portion 7 corresponding with a shape of the slit 5 on a bonding face side 28 where the first plate-shaped member 23 is bonded with the second plate-shaped member 24. In the columnar portions 8, the ratio (L/T) of the height L of the columnar portions 8 to the minimum width T in an end face on the bonding face side 28 is within 1/3 to 3.5. Thus constituted die realizes high formability, and two plate-shaped members constituting the die substrate are hardly peeled from each other. | 09-17-2009 |
| 20100074982 | JOINED ARTICLE AND DIE FOR FORMING HONEYCOMB STRUCTURE - A joined article | 03-25-2010 |