Patent application number | Description | Published |
20090081852 | HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE - A backgrinding machine | 03-26-2009 |
20100289283 | Chip Pickup Method and Chip Pickup Apparatus - A method is provided for picking up a chip | 11-18-2010 |
20100314894 | Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus - It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig | 12-16-2010 |
20140308494 | GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMINATE, MEMBER FOR ELECTRONIC DEVICES, AND ELECTRONIC DEVICE - The present invention provides: a gas barrier film comprising a cured resin layer and a gas barrier layer, the gas barrier layer being provided on at least one side of the cured resin layer,
| 10-16-2014 |
20140350187 | CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY - Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin. | 11-27-2014 |
20140364531 | CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY - The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g., solvent and curable monomer), and has small in-plane retardation, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin. | 12-11-2014 |
20150111032 | Film, Sheet Substrate for Processing Workpiece, and Sheet for Processing Workpiece - A film is obtained by forming a film of and curing an energy ray-curable composition comprising a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S. | 04-23-2015 |
20150303093 | Adhesive Sheet - An adhesive sheet includes a substrate film and an adhesive layer which is provided on the substrate film, wherein the substrate film is composed of an energy ray curable composition being formed into a film and cured, the composition including an energy ray curable resin and an ion liquid having ethylenically unsaturated bonds. | 10-22-2015 |