Patent application number | Description | Published |
20110309384 | SEMICONDUCTOR LIGHT EMITTING DEVICE - The present invention relates to a semiconductor light emitting device including: a substrate for element mounting; a wiring provided on the substrate; an LED element provided on the substrate and electrically connected to the wiring; an encapsulating resin layer for encapsulating the LED element; and a wavelength conversion layer which contains a phosphor material and converts a wavelength of light emitted by the LED element, in which the wavelength conversion layer is provided on an upper side of the LED element, and a diffusive reflection resin layer is provided in a state that side faces of the LED element are surrounded therewith, and an area at the LED element face side of the wavelength conversion layer is at least twice larger by area ratio than an area of light emitting area on an upper surface of the LED element. | 12-22-2011 |
20110309398 | COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation light and is excited to emit visible light in a wavelength region longer than a wavelength of the excitation light, the diffusive reflection resin layer is selectively formed with patterning on one surface of the wavelength conversion layer, and a region on the one surface of the wavelength conversion layer where the diffusive reflection resin layer is not formed with patterning is a path of the excitation light which excites the phosphor material in the wavelength conversion layer. | 12-22-2011 |
20120012875 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a fluorescent layer that is capable of emitting fluorescent light and a housing that is connected to the fluorescent layer for housing a light-emitting diode. | 01-19-2012 |
20120014088 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a fluorescent layer capable of emitting fluorescent light, and a lens connected onto the fluorescent layer. | 01-19-2012 |
20120025247 | COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF - A component for a light-emitting device includes a sealing resin layer that is capable of sealing in a light emitting diode, a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light, and a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light. | 02-02-2012 |
20120032219 | LIGHT-EMITTING DEVICE - A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer. | 02-09-2012 |
20120039064 | LIGHT-EMITTING DEVICE - A light-emitting device includes a circuit board to which external electric power is supplied; a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board; a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode; an adhesive layer that is provided on the housing, the adhesive layer being provided entirely in the circumferential direction of the housing, and the adhesive layer having a length from the inner circumferential edge to the outer circumferential edge of mainly 0.3 mm or more and a thickness of 200 μm or less; and a phosphor ceramic that is allowed to adhere onto the housing with the adhesive layer interposed therebetween. | 02-16-2012 |
20120319575 | PHOSPHOR ADHESIVE SHEET, LIGHT EMITTING DIODE ELEMENT INCLUDING PHOSPHOR LAYER, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHODS THEREOF - A phosphor adhesive sheet includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer. The adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties. | 12-20-2012 |
20140091346 | PHOSPHOR ADHESIVE SHEET, OPTICAL SEMICONDUCTOR ELEMENT-PHOSPHOR LAYER PRESSURE-SENSITIVE ADHESIVE BODY, AND OPTICAL SEMICONDUCTOR DEVICE - A phosphor adhesive sheet includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer. The adhesive layer is formed from a silicone pressure-sensitive adhesive composition. A percentage of the peel strength of the phosphor adhesive sheet is 30% or more. | 04-03-2014 |
20140091347 | PHOSPHOR LAYER ATTACHING KIT, OPTICAL SEMICONDUCTOR ELEMENT-PHOSPHOR LAYER ATTACHING BODY, AND OPTICAL SEMICONDUCTOR DEVICE - A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more. | 04-03-2014 |
20140367725 | COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - The present invention relates to a composite film including a wavelength conversion layer and a diffusive reflection resin layer in a laminated state and being used in a semiconductor light emitting device, in which the wavelength conversion layer contains a phosphor material which absorbs a part or all of excitation light and is excited to emit visible light in a wavelength region longer than a wavelength of the excitation light, the diffusive reflection resin layer is selectively formed with patterning on one surface of the wavelength conversion layer, and a region on the one surface of the wavelength conversion layer where the diffusive reflection resin layer is not formed with patterning is a path of the excitation light which excites the phosphor material in the wavelength conversion layer. | 12-18-2014 |