Patent application number | Description | Published |
20120087285 | HIGH-FREQUENCY MODULE - A high-frequency switch module includes a first diplexer arranged to receive a GPS signal and to send/receive a GSM | 04-12-2012 |
20130329611 | HIGH-FREQUENCY MODULE - In a high frequency module, mounting lands for reception signal output side ports of SAW duplexers, respectively, on a top surface of a multilayer body are arranged so as to be superposed on reception side external connection lands on a bottom surface of the multilayer body along the layer direction and the mounting lands are directly connected to the reception side external connection lands via holes. Transmission side external connection lands are located on the bottom surface of the multilayer body. The transmission side external connection lands are connected to mounting lands for transmission signal input side ports on the top surface of the multilayer body via certain inner layer electrodes that do not come close to the via holes of the reception system and the via holes. | 12-12-2013 |
20140043112 | DUPLEXER AND CIRCUIT MODULE INCLUDING THE SAME - In a duplexer, a common terminal is arranged in a central region of a back surface of a main body of the duplexer, a transmission terminal and a reception terminal are arranged on a virtual line that is parallel or substantially parallel with one side of the back surface of the main body and that passes through the common terminal such that the common terminal is sandwiched between the transmission terminal and the common terminal. By arranging a plurality of the duplexers such that the transmission terminals are aligned and the reception terminals are aligned, the common terminals, the transmission terminals, and the reception terminals provided on the respective duplexers are not spaced apart from one another. | 02-13-2014 |
20140055965 | CIRCUIT MODULE - A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented. | 02-27-2014 |
20140179364 | CIRCUIT MODULE - In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode is mainly transmitted along an edge of the ground electrode and the transmission signal that has leaked into the ground electrode flows into a plurality of via conductors arranged with end surfaces superposed with the edge of the ground electrode when viewed in plan. Therefore, a transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along the edge of the ground electrode toward the reception electrode side. As a result, isolation characteristics of the transmission electrode and the reception electrode from each other are improved. | 06-26-2014 |
20140202750 | MULTILAYER SUBSTRATE MODULE - A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is. | 07-24-2014 |
20140218127 | HIGH-FREQUENCY MODULE - A high-frequency module includes a multilayer substrate, a switch IC, a SAW duplexer and a matching circuit. The matching circuit includes a wiring line and first and second inner layer ground electrodes. The matching circuit performs impedance matching between the switch IC and the SAW duplexer in a pass band of the SAW duplexer. The wiring line is an inner layer electrode of the multilayer substrate that is connected between the switch IC and the SAW duplexer. The first and second inner layer ground electrodes face the wiring line in a stacking direction with only dielectric layers of the multilayer substrate therebetween. | 08-07-2014 |
20140305686 | MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING SAME - A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate. | 10-16-2014 |
20140307406 | CERAMIC MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING THE SAME - A module includes a multilayer body including laminated ceramic green sheets that have been fired, multiple mounting terminals arranged to mount a component thereon, the mounting terminals each including an end surface that is exposed at a main surface of the multilayer body, and multiple via conductors disposed inside the multilayer body so as to correspond to the mounting terminals at positions overlapped by the corresponding mounting terminals when viewed in a plan view. The lengths of the via conductors are adjusted so that predetermined points on the mounting terminals are positioned on the same plane. | 10-16-2014 |
20150054599 | HIGH FREQUENCY MODULE - A multilayered high frequency module includes inductor conductor patterns each defined by a linear conductor having a coiled shape on intermediate insulator layers of a multilayer body. A first spiral inductor with its axis extending in the stacking direction is defined by the inductor conductor patterns on respective layers connected through conductive via holes. Overlapped portions of inner regions of the individual inductor conductor patterns within the coiled shape define an air core portion of the first inductor. A capacitor conductor pattern is provided on one layer lower than the insulator layers on which the inductor conductor patterns are provided. The capacitor conductor pattern is a flat plate and located at a position not overlapping with the air core portion when looking at the multilayer body in a plan view. | 02-26-2015 |
20150080050 | COMPOSITE MODULE - A composite module includes outer ground electrodes on one main surface of a wiring substrate, a wiring electrode inside the wiring substrate, and a first ground electrode between the wiring electrode and the outer ground electrode. A cutout is provided in the first ground electrode at least at a portion of a region overlapping with the wiring electrode and the outer ground electrode when viewed from above, and the wiring electrode overlaps with at least one of the first ground electrode and the outer ground electrode when viewed from above to reduce stray capacitance produced on the wiring electrode and to adjust impedance of the wiring electrode while preventing signals leaked from the exterior from interfering with the wiring electrode. | 03-19-2015 |