Patent application number | Description | Published |
20090202945 | FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION - An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E). | 08-13-2009 |
20100266953 | COPOLYMER AND TOP COATING COMPOSITION - A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which has a recurring unit (I) having a carboxyl group, a recurring unit (II) having a sulfo group and a recurring unit obtained by copolymerizing fluoroalkyl(meth)acrylates having 1 to 20 carbon atoms in a fluoroalkyl group thereof other than a recurring unit having a side chain that includes an alcoholic hydroxyl group having a fluoroalkyl group at least in an α-position thereof, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000. | 10-21-2010 |
20110183442 | ENCAPSULANT LAYER FOR PHOTOVOLTAIC MODULE, PHOTOVOLTAIC MODULE AND METHOD FOR MANUFACTURING REGENERATED PHOTOVOLTAIC CELL AND REGENERATED TRANSPARENT FRONT FACE SUBSTRATE - An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%. | 07-28-2011 |
20110212401 | RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST PATTERN FORMATION METHOD - A radiation-sensitive resin composition includes a resin, a photoacid generator, a fluorine-containing resin, and a lactone compound. The resin does not include a first fluorine-containing repeating unit. The resin includes a first repeating unit that becomes alkali-soluble due to an acid. The fluorine-containing resin includes a second fluorine-containing repeating unit and a second repeating unit that becomes alkali-soluble due to an acid. A content of the lactone compound in the radiation-sensitive resin composition is about 31 to about 200 parts by mass based on 100 parts by mass of the resin. | 09-01-2011 |
20110223537 | RADIATION-SENSITIVE RESIN COMPOSITION AND POLYMER - A radiation-sensitive resin composition includes a polymer, a photoacid generator, and an acid diffusion controller. The polymer includes a first repeating unit shown by a following formula (a-1). The acid diffusion controller includes at least one of a base shown by a following formula (C-1) and a photodegradable base, | 09-15-2011 |
20120028198 | UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD - An upper layer-forming composition includes a resin, and a solvent. The resin is dissolvable in a developer for a photoresist film which is to be covered by the upper layer-forming composition to form a pattern by exposure to radiation. The solvent dissolves the resin in the solvent. The solvent includes a compound shown by a formula (1). Each of R | 02-02-2012 |
20120101205 | COPOLYMER AND TOP COATING COMPOSITION - A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000. | 04-26-2012 |
20120183902 | RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes an acid-labile group-containing resin, a radiation-sensitive acid generating agent, and an acid diffusion controller including a first compound shown by a following general formula (1-1) and a second compound shown by a following general formula (1-2) or (1-3). In the formula (1-1), each of R | 07-19-2012 |
20120282553 | IMMERSION UPPER LAYER FILM FORMING COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN - An immersion upper layer film composition includes a resin and a solvent. The resin forms a water-stable film during irradiation and is dissolved in a subsequent developer. The solvent contains a monovalent alcohol having 6 or less carbon atoms. The composition is to be applied to form a coat on a photoresist film in an immersion exposure process in which the photoresist film is irradiated through water provided between a lens and the photoresist film. | 11-08-2012 |
20130107235 | PATTERN-FORMING METHOD | 05-02-2013 |
20130194211 | OPTICAL LAYERED BODY, POLARIZER AND IMAGE DISPLAY DEVICE - Provided is an optical layered body that includes a polyester base, a primer layer formed thereon, and a hard coat layer formed on the primer. The polyester has a retardation of not less than 8000 nm, and a difference (nx−ny) of 0.07 to 0.20 between a refractive index (nx) in a slow axis direction that is a high refractive index direction and a refractive index (ny) of a fast axis direction that is orthogonal to the slow axis direction, a refractive index (np) of the primer, the refractive index (nx) in the slow axis direction of the polyester, and the refractive index (ny) in the fast axis direction of the polyester satisfy ny08-01-2013 | |
20140162190 | FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION - A fluorine-containing polymer for use in a radiation-sensitive resin composition is used for forming a photoresist film in a process of forming a resist pattern, including a liquid immersion lithographic process in which radiation is emitted through a liquid having a refractive index larger than the refractive index of air at a wavelength of 193 nm, and being present between a lens and the photoresist film. The fluorine-containing polymer has a weight average molecular weight determined by gel permeation chromatography in the range from 1,000 to 50,000 and a receding contact angle with water and the photoresist film formed therefrom is 70° or more. | 06-12-2014 |