| Patent application number | Description | Published |
|---|
| 20080200580 | Base Multiplying Agents and Base-Reactive Curable Compositions - To provide such a base multiplying agent capable of being used for crosslinking reaction, for example of a epoxy compound and the like, that generates another base by action of a base, and can efficiently perform base multiplying reaction, and a base-reactive curable composition using the base multiplying agent. | 08-21-2008 |
| 20090050850 | Binder resin composition and inorganic fine particle-dispersed paste composition - It is an object of the present invention to provide a binder resin composition usable for an inorganic fine particle-dispersed paste composition which is excellent in thixotropy and storage stability, has scarcely changeable screen printability with the lapse of time, and can be fired at a low temperature, and to provide the inorganic fine particle-dispersed paste composition. | 02-26-2009 |
| 20090126516 | MICRO FLUID DEVICE AND TRACE LIQUID DILUTING METHOD - A microfluidic device provided with a micro-channel structure capable of easily and positively providing therein micro-droplet having various dilution ratios. A micro-channel structure provided in a substrate ( | 05-21-2009 |
| 20090202942 | PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPOSITION - A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate ( | 08-13-2009 |
| 20100184880 | PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION - The present invention provides a photocurable pressure-sensitive adhesive composition which has sufficient adhesion before being irradiated with light, and after being irradiated with light, keeps a sufficient pot life and has a short cure-completion time at a room temperature. A cured product produced from the composition has high adhesion force to adherends difficult to be attached, and excellent durability. The photocurable pressure-sensitive adhesive composition comprises a crosslinking compound (A) that is crosslinkable by the action of a base, a photobase generator (B) which becomes active upon light irradiation to generate a base, and a tackifying component (C). | 07-22-2010 |
| 20100222462 | BINDER RESIN, VEHICLE COMPOSITION, AND PASTE COMPOSITION HAVING INORGANIC MICROPARTICLE DISPERSED THEREIN - It is an object of the present invention to provide a binder resin which, when used in an inorganic fine particle-dispersed paste composition, leaves little amount of residual carbon after sintering and can be degreased even under low temperature conditions. It is also an object of the present invention to provide a vehicle composition and an inorganic fine particle-dispersed paste composition, which are obtained by using the binder resin. | 09-02-2010 |
| 20110097669 | PHOTOCURABLE COMPOSITION - The present invention provides a photocurable composition which contains a photobase generator capable of generating a satisfactory amount of a base in a high quantum yield when irradiated even with a small quantity of light for a short time, and contains a curable compound that is rapidly cured by the generated base such that the composition is cured into a cured product. The photocurable composition comprises: a photobase generator (A) which is a salt of a carboxylic acid (a1-1) represented by the following formula (1-1) with a basic compound (a2), and a curable compound (B) which has, in one molecule thereof, at least two functional groups selected from among epoxy group, (meth)acryloyl group, isocyanato group, acid anhydride group, and alkoxysilyl group, | 04-28-2011 |
