| Patent application number | Description | Published |
|---|
| 20090239080 | PHOTOSENSITIVE INSULATION RESIN COMPOSITION AND CURED PRODUCT THEREOF - An object of the present invention is to provide a cured product which is excellent in characteristics such as an electric insulation property, a heat impact resistance, an adhesive property and the like and to provide a photosensitive insulation resin composition from which the above cured product can be obtained and which is suited to uses such as an interlayer insulation film, a surface protecting layer and the like in semiconductor elements. The photosensitive insulation resin composition according to the present invention is characterized by comprising (A) a copolymer comprising 10 to 99 mole % of a constitutional unit (A1) represented by the following Formula (1) and 90 to 1 mole % of a constitutional unit (A2) represented by the following Formula (2) (provided that the total of all constitutional units constituting the above copolymer (A) is 100 mole %): | 09-24-2009 |
| 20090271962 | Electronic device and method of making same - The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) | 11-05-2009 |
| 20100097723 | THIN-FILM PIEZOELECTRIC DEVICE, PRODUCTION METHOD THEREOF, HEAD GIMBALS ASSEMBLY USING THE THIN-FILM PIEZOELECTRIC DEVICE, AND HARD DISK DRIVE USING THE HEAD GIMBALS ASSEMBLY - A method includes a step of stacking a first electrode layer, a piezoelectric layer, and a second electrode layer on a first substrate to form a first laminate; a step of stacking a support layer on a second substrate to form a second laminate; a step of bonding the first and second laminates through an adhesive layer to form a third laminate; a step of removing the first substrate from the third laminate; a step of processing the third laminate in a desired shape; and a step of removing the second substrate. A Young's modulus of the adhesive layer is smaller than a Young's modulus of the piezoelectric layer. Respective Young's moduli of the second electrode layer and the support layer are larger than the Young's modulus of the adhesive layer. The third laminate has no other piezoelectric layer except for the aforementioned piezoelectric layer. | 04-22-2010 |
| 20100147789 | METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT - A manufacturing method of the present invention comprises the step of epitaxially growing a PZT layer on a first electrode layer, and the step of processing the PZT layer to a desired shape using an etching solution after the growing step. The etching solution contains at least one acid from among hydrochloric acid and nitric acid in a concentration C | 06-17-2010 |
| 20100196822 | PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT OF THE COMPOSITION, AND METHOD OF PRODUCING INSULATING FILM - A photosensitive insulating resin composition includes (A) an alkali-soluble resin that contains (a1) a structural unit derived from a crosslinkable monomer and (a2) a structural unit having a phenolic hydroxyl group, (B) a crosslinking agent, (C) a photosensitive compound, and (D) a solvent. | 08-05-2010 |
| 20100276186 | PHOTOSENSITIVE INSULATING RESIN COMPOSITION, HARDENING PRODUCT THEREOF, AND CIRCUIT BOARD EQUIPPED THEREWITH - A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer. | 11-04-2010 |
