| Patent application number | Description | Published |
|---|
| 20080247432 | Semiconductor Laser Equipment - This invention relates to a semiconductor laser apparatus having a structure to prevent corrosion in a refrigerant flow path of a heat sink and cool stably a semiconductor laser array over a long period. The semiconductor laser apparatus has a semiconductor laser stack, a refrigerant supplier, an insulating piping, and a refrigerant. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. The insulating piping is an insulating piping with flexibility. An grounded conductive material is arranged inside the insulating piping. The conductive material operates to remove static electricity generated where the refrigerant flows inside the insulating piping. | 10-09-2008 |
| 20080273564 | Semiconductor Laser Element and Semiconductor Laser Element Array - A semiconductor laser device | 11-06-2008 |
| 20080279239 | Semiconductor Laser Device and Method of Manufacturing the Same - A semiconductor laser device | 11-13-2008 |
| 20090016385 | Passive Q switch laser device - A laser apparatus | 01-15-2009 |
| 20090022194 | Semiconductor laser device and semiconductor laser device array - In an active layer | 01-22-2009 |
| 20090120556 | Method For Producing Hermetically Sealed Container For Beverage Or Food - An object of the present invention is to provide a method for producing a hermetically sealed container, which method comprises conducting hermetic sealing of a container for beverage or food using a laser welding method, whereby the process speed of the sealing process can be made fast, strict control of the scanning position of laser spots is unnecessary, partial oversupply of energy does not occur easily, and there is no reduction in the welding area or welding strength per area due to the gathering of water drops. | 05-14-2009 |
| 20090323193 | Laser Equipment - A laser apparatus ( | 12-31-2009 |
| 20100202479 | HEAT SINK, LASER APPARATUS PROVIDED WITH SUCH HEAT SINK, AND LASER STACK APPARATUS - A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. | 08-12-2010 |
