| Patent application number | Description | Published |
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| 20080265235 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A nonvolatile semiconductor memory device includes a first stacked structure in which a plurality of electrode layers are stacked on a substrate via insulating layers, a first resistance changing layer provided on a side surface of the first stacked structure and in contact with the first electrode layers, the first resistance changing layer having a resistance value changing on the basis of an applied voltage, a second electrode layer provided on a side surface of the first resistance changing layer, and a bit line provided on the first stacked structure and electrically connected to the second electrode layer. | 10-30-2008 |
| 20080315280 | SEMICONDUCTOR MEMORY DEVICE HAVING MEMORY CELL UNIT AND MANUFACTURING METHOD THEREOF - A semiconductor memory device includes a silicon substrate including a first region which has a buried insulating layer below a single-crystal silicon layer and a second region which does not have the buried insulating layer below the single-crystal silicon layer, at least one memory cell transistor which has a first gate electrode, the first gate electrode being provided on the single-crystal silicon layer in the first region, and at least one selective gate transistor which has a second gate electrode and is provided on the single-crystal silicon layer in the first region. The one selective gate transistor is provided in such a manner that a part of the second gate electrode is placed on the single-crystal silicon layer in the second region. | 12-25-2008 |
| 20090090964 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a device isolation insulating film which is buried in a semiconductor substrate, a gate insulation film which is provided on the semiconductor substrate, a gate electrode which is provided on the gate insulation film, a source region and a drain region which are provided in the semiconductor substrate and spaced apart from each other in a manner to sandwich the gate electrode, both end portions of each of the source region and the drain region being offset from the device isolation insulating film in a channel width direction by a predetermined distance, and first and second gate electrode extension portions which are provided in a manner to cover both end portions of each of the source region and the drain region in a channel length direction. | 04-09-2009 |
| 20090121208 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A nonvolatile semiconductor memory device comprises a plurality of first lines; a plurality of second lines crossing the plurality of first lines; a plurality of memory cells each connected at an intersection of the first and second lines between both lines and including a variable resistor operative to store information in accordance with a variation in resistance; and a protection film covering the side of the variable resistor to suppress migration of cations at the side of the variable resistor. | 05-14-2009 |
| 20090122598 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a memory cell array with memory cells arranged therein, the memory cell having a variable resistance element for storing a rewritable resistance value; a reference cell formed of the same memory cells as those set in a high resistance state in the memory cell array, the reference cell being trimmed with selection of the number of parallel-connected memory cells to have a reference current value used for detecting data in the memory cell array; and a sense amplifier configured to compare a cell current value of a memory cell selected in the memory cell array with the reference current value of the reference cell. | 05-14-2009 |
| 20090134431 | NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND METHOD OF MANUFACTURING THE SAME - A nonvolatile semiconductor storage apparatus includes: a plurality of first wirings; a plurality of second wirings which cross the plurality of first wirings; and a memory cell which is connected between both the wirings at an intersection of the first and second wirings, and includes a variable resistive element operative to store information according to a change in resistance and includes a variable resistive element, wherein the memory cell is formed so that a cross section area of the variable resistive element becomes smaller than a cross section area of the other portion. | 05-28-2009 |
| 20090134432 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A nonvolatile semiconductor memory device comprises a semiconductor substrate; a cell array block formed on the semiconductor substrate and including plural stacked cell array layers each with a plurality of first lines, a plurality of second lines crossing the plurality of first lines, and memory cells connected at intersections of the first and second lines between both lines; and a plurality of via-holes extending in the stacked direction of the cell array layers to individually connect the first or second line in the each cell array layer to the semiconductor substrate. The via-holes are formed continuously through the plural cell array layers, and multiple via-holes having equal lower end positions and upper end positions are connected to the first or second lines indifferent cell array layers. | 05-28-2009 |
| 20090137112 | METHOD OF MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY DEVICES - A method of manufacturing nonvolatile semiconductor memory devices comprises forming a first wiring material; and stacking memory cell materials on the first wiring material, which configure memory cells each including a variable resistor operative to nonvolatilely store information in accordance with variation in resistance. The method also comprises forming a plurality of first parallel trenches in the first wiring material and the stacked memory cell materials, the first trenches extending in a first direction, thereby forming first lines extending in the first direction and memory cell materials self-aligned with the first lines and separated by the first trenches. The method further comprises burying an interlayer insulator in the first trenches to form a block body and stacking a second wiring material on the block body. The method also comprises forming a plurality of second parallel trenches in the block body with the second wiring material stacked thereon, the second trenches extending in a second direction crossing the first direction and having a depth reaching the upper surface of the first wiring material, thereby forming second lines extending in the second direction and memory cells self-aligned with the second lines and separated by the first and second trenches. | 05-28-2009 |
| 20090141532 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory block having a three-dimensional memory cell array structure in which memory cell arrays are stacked, the memory cell array including: a plurality of first interconnections which are parallel to one another; a plurality of second interconnections which are formed so as to intersect with the plurality of first interconnections, the second interconnections being parallel to one another; and a memory cell which is disposed in each intersection portion of the first interconnection and the second interconnection, one end of the memory cell being connected to the first interconnection, the other end of the memory cell being connected to the second interconnection. The first interconnection disposed between the adjacent memory cell arrays is shared by memory cells above and below the first interconnection, and the vertically-overlapping first interconnections are connected to each other. | 06-04-2009 |
| 20090305152 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device manufacturing method has forming a first resist pattern on the semiconductor substrate, and then, forming a first pattern on the semiconductor substrate by the use of the first resist pattern, and forming a second resist pattern on the semiconductor substrate by using an imprinter, and then, forming a second pattern on the semiconductor substrate by the use of the second resist pattern. The forming the first pattern, the first pattern smaller than a design pattern corresponding to the design data for forming a plurality of patterns on a semiconductor substrate being formed. | 12-10-2009 |
| 20100027318 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time. | 02-04-2010 |
| 20100038616 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND PRODUCING METHOD THEREOF - A cell array includes a memory cell region in which memory cells are formed and a peripheral region that is provided around the memory cell region. In the memory cell region, first lines are extended in parallel with a first direction, and the first lines are repeatedly formed at first intervals in a second direction orthogonal to the first direction. In the peripheral region, each of the first lines located at (4n−3)-th (n is a positive integer) and (4n−2)-th positions in the second direction from a predetermined position has a contact connecting portion on one end side in the first direction of the first line. In the peripheral region, each of the first lines located at (4n−1)-th and 4n-th positions in the second direction from the predetermined position has the contact connecting portion on the other end side in the first direction of the first line. The contact connecting portion is formed so as to contact a contact plug extended in a laminating direction. | 02-18-2010 |
| 20100238702 | SEMICONDUCTOR MEMORY DEVICE - A memory array includes a memory cell, the memory cell being disposed between a first line and a second line and being configured by a variable resistor and a rectifier connected in series. The variable resistor is a mixture of silicon oxide (SiO2) and a transition metal oxide, a proportion of the transition metal oxide being set to 55˜80%. | 09-23-2010 |
| 20100238703 | INFORMATION RECORDING/REPRODUCING DEVICE - An information recording/reproducing device includes a first electrode layer, a second electrode layer, a recording layer as a variable resistance between the first and second electrode layer, and a circuit which supplies a voltage to the recording layer to change a resistance of the recording layer. Each of the first and second electrode layers is comprised of IV or III-V semiconductor doped with p-type carrier or n-type carrier. | 09-23-2010 |
| 20110103128 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - Nonvolatile semiconductor memory device of an embodiment includes: a memory cell array including a plurality of first and second lines intersecting each other and plural memory cells provided at intersections of the first and second lines and having data written and erased upon application of voltages of the same polarity; and a writing circuit configured to select first and second lines and supply a set or reset pulse to the memory cell through the selected first and second lines. In an erase operation, the writing circuit repeatedly supplies the reset pulse to a selected memory cell until data is erased, by increasing or decreasing voltage level and voltage application time of the reset pulse within a reset region. The reset region, or an aggregate of combinations of voltage level and voltage application time of the reset pulse, is a region where voltage level and voltage application time are negatively correlated. | 05-05-2011 |
| 20110122676 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes: word lines; bit lines; an insulating film; an interlayer insulating film; and a resistance varying material. The word lines, the bit lines and the insulating film configure a field-effect transistor at each of the intersections of the word lines and the bit lines. The field-effect transistor has one of the word lines as a control electrode and one of the bit lines as a channel region. The field-effect transistor and the resistance varying material configure a memory cell having the field-effect transistor and the resistance varying material connected in parallel. Each of the bit lines includes a first surface opposing the word lines, and a second surface on an opposite side to the first surface. The resistance varying material is disposed in contact with the second surface and has a portion thereof in contact with the interlayer insulating film. | 05-26-2011 |
