| Patent application number | Description | Published |
|---|
| 20090311526 | Adhesive composition, film adhesive, and heat treatment method - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 12-17-2009 |
| 20100010182 | Adhesive composition, film adhesive, and method for producing the adhesive composition - An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance. | 01-14-2010 |
| 20100068453 | METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE - A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity. | 03-18-2010 |
| 20100086799 | Removal method, adhesive agent for substrate, and laminate including substrate - The removal method of the present invention includes: providing a support plate and a substrate being combined to each other via a first adhesive layer and a second adhesive layer, the second adhesive layer being an adhesive layer which is dissolvable in a solvent quicker than the first adhesive layer or an adhesive layer which is dissolvable in a solvent different from a solvent to which the first adhesive layer is dissolvable, and the second adhesive layer being between the support plate and the first adhesive layer; and removing the support plate from the substrate by dissolving the second adhesive layer. Further, the removal method of the present invention includes, after the step of removing, dissolving the first adhesive layer. This removes the support plate from the wafer in a quick and easy way. | 04-08-2010 |
| 20100159191 | PROCESSED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - The present invention provides (i) a processed substrate having a through-hole whose openings on respective surfaces of the processed substrate are matched to each other in size, and (ii) a method for easily manufacturing the processed substrate with high efficiency. A processed substrate | 06-24-2010 |
| 20100178498 | Adhesive composition and film adhesive - An adhesive composition of the present invention is an adhesive composition including a polymer obtained by polymerizing a monomer composition containing a (meth)acrylic acid ester having a structure represented by General Formula (1): | 07-15-2010 |
| 20100178499 | ADHESIVE COMPOSITION AND FILM ADHESIVE - An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): | 07-15-2010 |
| 20100186895 | Adhesive composition, film adhesive, and heat treatment method - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 07-29-2010 |
| 20100310817 | SUPPORT PLATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PROCESSING SUBSTRATE - This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive. | 12-09-2010 |
| 20100314043 | STICKING METHOD AND STICKING APPARATUS - A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate | 12-16-2010 |
| 20100331477 | ADHESIVE COMPOSITION AND FILM ADHESIVE - The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped. | 12-30-2010 |
| 20110061800 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 03-17-2011 |
| 20110065858 | Adhesive composition and adhesive film - An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.). | 03-17-2011 |
| 20110081544 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD - An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process. | 04-07-2011 |
