| Patent application number | Description | Published |
|---|
| 20080241497 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM - A solution containing a silane coupling agent, in which 5% or more of the alkoxy group bound to an Si atom is hydrolyzed, and substantially no water, is applied to one side or both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film having a thickness of 7 μm to 30 μm with reliably improved adhesiveness. | 10-02-2008 |
| 20090036601 | THERMOSETTING SOLUTION COMPOSITION AND PREPREG - A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3′,4′-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2′,3,3′-biphenyltetracarboylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg. | 02-05-2009 |
| 20100252309 | POLYIMIDE FILM AND WIRING BOARD - The polyimide film of the present invention is to be used for the production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. | 10-07-2010 |
| 20100323183 | THERMOSETTING SOLUTION COMPOSITION AND PREPREG - A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3′,4′-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2′,3,3′-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg. | 12-23-2010 |
| 20100331432 | PROCESS FOR PRODUCING POLYIMIDE FOAM AND POLYIMIDE FOAM - A polyimide foam formed of an aromatic polyimide prepared from a 3,3′,4,4′-biphenyltetracarboxylic acid component and an aromatic diamine component. The polyimide foam has flexibility at least such that no cracking occurs when a specimen of the polyimide foam with a 1 cm by 1 cm cross-section and a length of 5 cm is deformed until both ends thereof come into contact with each other to make a closed loop. The polyimide foam is obtained by dissolving a 3,3′,4,4′-biphenyltetracarboxylic acid component and an aromatic diamine component in a solvent in the presence of an acid phosphoric ester having a specific structure to prepare a polyimide precursor and heating the polyimide precursor to expand. | 12-30-2010 |
| 20110067760 | AROMATIC POLYIMIDE FILM, LAMINATE AND SOLAR CELL - Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from −0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell. | 03-24-2011 |
| 20110079277 | POLYIMIDE-METAL LAMINATE AND SOLAR CELL - A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell. | 04-07-2011 |
| 20110218265 | POLYIMIDE FOAM AND METHOD FOR PRODUCING SAME - Disclosed is a polyimide foam made of an aromatic polyimide composed of a tetracarboxylic acid component, which is composed of 0 to 90% by mole of a 3,3′,4,4′-biphenyltetracarboxylic acid component and 100 to 10% by mole of a 3,3′,4,4′-benzophenone tetracarboxylic acid component and/or a 2,3,3′,4′-biphenyltetracarboxylic acid component, and a diamine component, which is composed of 50 to 97% by mole of m-phenylenediamine and 50 to 3% by mole of 4,4′-methylenedianiline. The polyimide foam can be produced easily, has uniform and fine cells, and has the mechanical properties required for practical use as a foam, such as flexibility that prevents the foam from cracking easily even when deformed and excellent cushioning properties, as well as heat resistance that can resist use at high temperatures. | 09-08-2011 |
