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| 20080241497 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM - A solution containing a silane coupling agent, in which 5% or more of the alkoxy group bound to an Si atom is hydrolyzed, and substantially no water, is applied to one side or both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film having a thickness of 7 μm to 30 μm with reliably improved adhesiveness. | 10-02-2008 |
| 20090036601 | THERMOSETTING SOLUTION COMPOSITION AND PREPREG - A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3′,4′-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2′,3,3′-biphenyltetracarboylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg. | 02-05-2009 |
| 20100252309 | POLYIMIDE FILM AND WIRING BOARD - The polyimide film of the present invention is to be used for the production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. | 10-07-2010 |
| 20100323183 | THERMOSETTING SOLUTION COMPOSITION AND PREPREG - A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3′,4′-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2′,3,3′-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg. | 12-23-2010 |
| 20100331432 | PROCESS FOR PRODUCING POLYIMIDE FOAM AND POLYIMIDE FOAM - A polyimide foam formed of an aromatic polyimide prepared from a 3,3′,4,4′-biphenyltetracarboxylic acid component and an aromatic diamine component. The polyimide foam has flexibility at least such that no cracking occurs when a specimen of the polyimide foam with a 1 cm by 1 cm cross-section and a length of 5 cm is deformed until both ends thereof come into contact with each other to make a closed loop. The polyimide foam is obtained by dissolving a 3,3′,4,4′-biphenyltetracarboxylic acid component and an aromatic diamine component in a solvent in the presence of an acid phosphoric ester having a specific structure to prepare a polyimide precursor and heating the polyimide precursor to expand. | 12-30-2010 |
| 20110067760 | AROMATIC POLYIMIDE FILM, LAMINATE AND SOLAR CELL - Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from −0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell. | 03-24-2011 |
| 20110079277 | POLYIMIDE-METAL LAMINATE AND SOLAR CELL - A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell. | 04-07-2011 |
| 20110218265 | POLYIMIDE FOAM AND METHOD FOR PRODUCING SAME - Disclosed is a polyimide foam made of an aromatic polyimide composed of a tetracarboxylic acid component, which is composed of 0 to 90% by mole of a 3,3′,4,4′-biphenyltetracarboxylic acid component and 100 to 10% by mole of a 3,3′,4,4′-benzophenone tetracarboxylic acid component and/or a 2,3,3′,4′-biphenyltetracarboxylic acid component, and a diamine component, which is composed of 50 to 97% by mole of m-phenylenediamine and 50 to 3% by mole of 4,4′-methylenedianiline. The polyimide foam can be produced easily, has uniform and fine cells, and has the mechanical properties required for practical use as a foam, such as flexibility that prevents the foam from cracking easily even when deformed and excellent cushioning properties, as well as heat resistance that can resist use at high temperatures. | 09-08-2011 |
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| 20080261060 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM - A solution containing a polyamic acid oligomer having at least one terminal alkoxysilyl group is applied to one side or both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reliably improved adhesiveness. | 10-23-2008 |
| 20090197068 | POLYIMIDE FILM, AND METHOD FOR PRODUCTION THEREOF - Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine. | 08-06-2009 |
| 20090242250 | POLYIMIDE FILM, METHOD FOR PRODUCTION THEREOF, POLYIMIDE-METAL LAMINATED PRODUCT, AND CIRCUIT BOARD - Disclosed is a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing an aluminum chelate compound and, optionally, a nonionic surfactant and/or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization. | 10-01-2009 |
| 20100041860 | POLYIMIDE, DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME - A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): | 02-18-2010 |
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| 20110284694 | AIRCRAFT FUEL TANK - An aircraft fuel tank that is capable of suppressing the occurrence of sparks on a pipe caused by a lightning current through the pipe during a lightning strike, and also suppressing static electricity charging of a pipe caused by flow electrification generated by the fuel. An aircraft fuel tank ( | 11-24-2011 |
| 20110297790 | AIRCRAFT FUEL TANK - An aircraft fuel tank capable of suppressing electrostatic charging caused, for example, by flow electrification with the fuel. The aircraft fuel tank comprises an upper skin ( | 12-08-2011 |
| 20120012710 | COMPOSITE TANK, WING, AND METHOD FOR MANUFACTURING COMPOSITE TANK - A composite tank that can suppress electrification, corrosion and strength degradation, a wing comprising the composite tank, and a method for manufacturing the composite tank. The composite tank comprises: a tank body inside which a combustible material is stored, having a first resin portion ( | 01-19-2012 |
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| 20080286538 | Polyimide-Metal Laminated Body and Polyimide Circuit Board - A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained. | 11-20-2008 |
| 20090002953 | PRODUCTION OF VIA HOLE IN FLEXIBLE CIRCUIT PRINTABLE BOARD - A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole. | 01-01-2009 |
| 20090068454 | Polyimide film-laminated body - A polyimide film-laminated body is composed of a metal layer and an aromatic polyimide layer formed by casting a polyamic acid solution composition, comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as an essential tetracarboxylic dianhydride component and with introduction of a specific diamine component, onto a metal foil. The polyimide film-laminated body has an excellent gas permeation rate and moisture permeation rate, with heat resistance, a high elastic modulus and a low linear expansion coefficient, and with reduced foaming and delamination during the high-temperature steps for formation of the laminated body. | 03-12-2009 |
