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| 20100053776 | Imaging Lens and Small-Size Image Pickup Apparatus using the Same - There are provided an imaging lens, which is capable of promoting high definition and miniaturization of a small-size image pickup apparatus, and the small-size image pickup apparatus using the same. A aperture diaphragm S is arranged between a first lens L | 03-04-2010 |
| 20100187860 | CAB AND CONSTRUCTION MACHINE - A cab includes left and right rear pole members having internal spaces and prescribed shapes in cross-section. The right rear pole member includes a first hole portion that extends along the longitudinal direction of the right rear pole member and penetrates the right rear pole member in the left-and-right direction of the right rear pole member, and a first plate-shaped member inserted into and secured in the first hole portion. | 07-29-2010 |
| 20110057479 | CAB FOR CONSTRUCTION MACHINE - A cab for a construction machine includes a pillar member and a beam member. The pillar member is disposed generally along a vertical direction, and includes a cutout portion and a protruding portion. The cutout portion is formed on an upper end thereof. The protruding portion is formed on the upper end on an inner side of the cutout portion with respect to a widthwise direction of the cab. The beam member is disposed generally along a direction perpendicular to the vertical direction. The beam member is joined to the pillar member with the beam member partially overlapping the cutout portion on the upper end of the pillar member in a plan view, and a lateral surface of the beam member abutting against the protruding portion. | 03-10-2011 |
| 20110273611 | Single-Focus Optical System, Image Pickup Device, and Digital Apparatus - Provided is a single-focus optical system which is configured, in order from the object side to the image side, of a first to third lens groups and in which the first lens group and the third lens group are fixed with respect to a predetermined imaging surface, and the second lens group is moved in the optical axis direction to focus, wherein the first lens group comprises at least one positive lens and at least one negative lens, the second lens group comprises at least one positive lens, the third lens group comprises at least one lens having at least one aspheric surface and having a positive optical power at a peripheral portion thereof, and 5<|Δv | 11-10-2011 |
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| 20080280385 | Thin-film transistor, TFT-array substrate, liquid-crystal display device and method of fabricating the same - A thin-film transistor includes a gate layer, a gate insulting layer, a semiconductor layer, a drain layer, a passivation layer (each of which being formed on or over an insulating substrate), and a conductive layer formed on the passivation layer. The conductive layer is connected to the gate layer or the drain layer by way of a contact hole penetrating at least the passivation layer. The passivation layer has a multiple-layer structure comprising at least a first sublayer and a second sublayer stacked, the first sublayer having a lower etch rate than that of the second sublayer. The first sublayer is disposed closer to the substrate than the second sublayer. The second sublayer has a thickness equal to or less than that of the conductive layer. The shape or configuration of the passivation layer and the underlying gate insulating layer can be well controlled in the etching process, and the conductive layer formed on the passivation layer is prevented from being divided. | 11-13-2008 |
| 20080287038 | Polishing composition for semiconductor wafer, method for production thereof and polishing method - The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing composition for a semiconductor wafer comprises an acid and an aqueous medium dispersion containing positively-charged silica particles having an amino group-containing silane coupling agent bonded on a surface thereof, the polishing composition having a pH of 2 to 6. | 11-20-2008 |
| 20080311750 | Polishing composition for semiconductor wafer and polishing method - The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica particles having a ratio of long axis to short axis of 1.5 to 15. The polishing method for a semiconductor wafer uses the polishing composition. The polishing composition can provide a remarkably high polishing rate compared with a polishing composition using spherical colloidal silica, and can provide good mirror-polishing without causing scratches. In addition, small alkali metal content enables reduction of adverse effects on a semiconductor wafer, such as residual abrasives after polishing. | 12-18-2008 |
| 20090209070 | METHOD FOR MANUFACTURING A THIN FILM TRANSISTOR HAVING A MICRO-CRYSTALLINE SILICON HYDROGEN FEEDING LAYER FORMED BETWEEN A METAL GATE AND A GATE INSULATING FILM. - A TFT (Thin Film Transistor) is provided in which a hydrogen feeding layer is able to be formed in a position where diffusing distance of hydrogen can be made short without causing an increase in photolithography processes. In the TFT, the hydrogen feeding layer to diffuse hydrogen into a dangling bond existing at an interface between a polycrystalline silicon thin film and a gate insulating film is formed in a position between the gate insulating film and a gate electrode. According to this configuration, diffusing distance of hydrogen at a period of time during hydrogenation can be made short and the hydrogenation process can be sufficiently performed without taking time in heat treatment. | 08-20-2009 |
| 20090278968 | SOLID STATE IMAGING APPARATUS, SOLID STATE IMAGING DEVICE DRIVING METHOD AND CAMERA - A solid state imaging apparatus includes a solid state imaging device and a control circuit for performing control such that a first clock signal applied to transfer signal charges for a time period from after a preceding signal charge has been read out from a light sensing unit to when the preceding signal charge is transferred to a horizontal transfer unit and a second clock signal applied for a time period from after the preceding signal charge has been transferred to the horizontal transfer unit to when a succeeding signal charge is read out from the light sensing unit have almost the same amplitude and a high level potential of the first clock signal is set higher than that of the second clock signal. | 11-12-2009 |
| 20110034622 | AQUEOUS DISPERSION AND AQUEOUS COATING COMPOSITION, AND PROCESS OF FORMING COATING FILM - It is an object of the present invention to provide an aqueous dispersion of acrylic modified starch with excellent long-term storage stability, as well as an aqueous coating composition that can form a coated film with excellent finished appearance, curability and weather resistance, obtained using the dispersion. | 02-10-2011 |
| 20110258367 | MEMORY SYSTEM, CONTROL METHOD THEREOF, AND INFORMATION PROCESSING APPARATUS - According to the embodiment, a nonvolatile semiconductor memory that includes a plurality of banks capable of operating in parallel, a command analyzing unit that, upon receiving a power management command from a host, analyzes the received power management command, and a recording control unit that dynamically and variably controls an upper limit of the number of banks to be operated in parallel at a time of writing in accordance with an analysis result by the command analyzing unit are included, thereby suppressing the upper limit of a power consumption in accordance with an instruction from the host. | 10-20-2011 |
| 20120008025 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip. | 01-12-2012 |
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| 20090269057 | WAVELENGTH ROUTE SELECTION SYSTEM AND WAVELENGTH ROUTE SELECTION METHOD - A wavelength route selection system includes an inhibition route setting unit determining, for each of the spans, whether or not the span reliability exceeds the upper limit value, and extracting, as second wavelength routes, routes based on spans, the span reliability of which is determined to exceed the upper limit value, from among wavelength routes from the node device as the start point to the node device as the end point. The system further includes a route reliability calculation unit adding, for each of the second wavelength routes extracted by the inhibition route setting unit, the span reliabilities of all the spans in the corresponding second wavelength route calculated so as to calculate a wavelength route reliability representing the reliability of the second wavelength route. The system further includes a route selection unit selecting a second wavelength route having a minimum wavelength route reliability calculated by the route reliability calculation unit from among the second wavelength routes as the first wavelength route. | 10-29-2009 |
| 20100130661 | RESIN COMPOSITION FOR OPTICAL MEMBER AND OPTICAL MEMBER OBTAINED FROM THE SAME - The present invention can provide a composition for optical members, which contains (a) a compound having one or more of any group selected from the group consisting of an acryloyl group, a methacryloyl group, an allyl group and a vinyl group and one or more β-epithiopropyl groups in a molecule. In a preferable embodiment of the present invention, the composition for optical members further contains at least one compound selected from (b) a compound having one or more β-epithiopropyl groups in a molecule while having no polymerizable unsaturated bond group, (c) an inorganic compound having a sulfur atom and/or a selenium atom, (d) a compound having one or more thiol groups in a molecule, (e) a compound having one or more amino groups in a molecule while having no heterocyclic ring, and (f) a compound having one or more of at least one group selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group and an allyl group in a molecule. | 05-27-2010 |
| 20100299472 | MULTIPROCESSOR SYSTEM AND COMPUTER PROGRAM PRODUCT - In a multiprocessor system including a plurality of processors, the processors execute, at a time of migration a task operating in own processor to another processor, a transmitting task for transmitting the migration target task to a destination processor, and when an interrupt request to be received and executed by an interrupt handler accompanying the migration target task is generated during transmission of the migration target task, the transmitting task receives the interrupt request instead of the interrupt handler and starts the interrupt handler. | 11-25-2010 |
| 20110317999 | WAVELENGTH DIVISION MULTIPLEX DEVICE, WAVELENGTH DIVISION MULTIPLEX TRANSMISSION SYSTEM, AND WAVELENGTH MULTIPLEX SIGNAL CONTROL METHOD - To provide a wavelength division multiplex device capable of detecting an abnormality in counting of a wavelength number of a wavelength multiplex signal transmitted and received between two opposing devices. When a comparison result of a wavelength number information comparison unit | 12-29-2011 |
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| 20080237535 | Composition for polishing semiconductor wafer, and method of producing the same - A composition for polishing a semiconductor wafer contains fumed silica particles that are produced by wet grinding using a grinding medium and that have characteristics (A) to (C): | 10-02-2008 |
| 20090253813 | Colloidal silica consisting of silica particles fixing nitrogen contained alkaline compound - A colloidal silica comprising, silica particles inside of which or on the surface of which a nitrogen containing alkaline compound is fixed, wherein said silica particles are prepared by forming and growing colloid particles using the nitrogen containing alkaline compound. Said colloidal silica can be prepared by preparing active silicic acid aqueous solution contacting silicate alkali aqueous solution with cation exchange resin, adding the nitrogen containing alkaline compound and heating, and then growing up particles by build-up method. | 10-08-2009 |
| 20090267021 | Colloidal silica for semiconductor wafer polishing and production method thereof - Colloidal silica forming nonspherical particles cluster, whose long axis/short axis ratio of silica particles is of 1.2 to 20, and average long axis/short axis ratio of 3 to 15. This colloidal silica can be produced by forming particles by adding basic nitrogen compounds to an active silicic acid aqueous solution, the solution which produced by hydrolysis of tetraalkoxysilane, while heating, then growing particles by using a build up method. | 10-29-2009 |
| 20100163786 | Polishing composition for semiconductor wafer - A polishing composition for semiconductor wafer polishing comprising, colloidal silica prepared from an active silicic acid aqueous solution obtained by removal of alkali from alkali silicate and at least one nitrogen containing basic compound selected from a group consisting of ethylenediamine, diethylenediamine, imidazole, methylimidazole, piperidine, morpholine, arginine, and hydrazine, wherein pH of the colloidal silica is of 8.5 to 11.0 at 25° C. by containing quaternary ammonium hydroxide. | 07-01-2010 |
