Patent application number | Description | Published |
20080292805 | METHOD FOR MANUFACTURING STAMPER, METHOD FOR MANUFACTURING NANOHOLE STRUCTURE, AND METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM - According to an aspect of an embodiment, a method for manufacturing a stamper for duplicating a pit pattern on a substrate includes forming on another substrate, a layer of a material insoluble to a liquid of a suspension of particles in a pattern having a plurality of land portions and a plurality of groove portions between the land portions, and dipping the another substrate having the layer of the material having the pattern in the liquid of the suspension of the particles so that the particles are adhered to the groove portions. The-method further includes forming a mold having a plurality of pits corresponding to the particles by transferring the shapes of the particles on the another substrate to the mold, and forming a stamper having a plurality of protrusions corresponding to the pits by transferring the shapes of the pits of the molds to the stamper. | 11-27-2008 |
20090045550 | TRANSCRIPTION MOLD FIXATION APPARATUS AND SUBSTRATE REMOVING METHOD - According to an aspect of an embodiment, a transcription mold fixation apparatus includes a support base, a magnet, a pin, and a regulating mechanism. The support base receives, on a surface thereof, a transcription mold having a center hole formed therein and containing a magnetic material, and the support base has a through hole aligned to the center hole. The magnet is incorporated in the support base, and fixes the transcription mold to the surface of the support base. The pin extends through the through hole. The regulating mechanism causes the magnet to be spaced apart from the magnetic material. | 02-19-2009 |
20090127224 | METHOD OF PRODUCING A NANO-STRUCTURE AND METHOD OF PRODUCING A MAGNETIC RECORDING MEDIUM - According to an aspect of an embodiment, a manufacturing method for a nano-structure comprises the steps of: arranging nano-particles on a substrate having a surface provided with a projecting pattern and a recessing pattern; forming cavities under the nano-particles; and polishing the surfaces in which the cavities are formed. | 05-21-2009 |
20090206513 | METHOD OF MANUFACTURING MOLDED PRODUCT AND METHOD OF MANUFACTURING STORAGE MEDIUM - A method of manufacturing a molded product includes forming a coat film for covering and concealing particles with the surface of a board while filling the gaps among the particles, and separating the coat film for holding the particles on the reverse side from the board. The coat film and the particles are etched from the reverse side of the separated coat film, the particles are removed from the coat film, and an array of dents carved by the particles is formed on the reverse side of the coat film. A film is formed on the reverse side of the coat film, and a molded product having an array of protrusions on the surface is formed from the film. | 08-20-2009 |
20090218718 | MANUFACTURING METHOD FOR A MOLD - According to an aspect of an embodiment, a manufacturing method for a mold includes a step of forming a protection film having fluidity on a front surface of a base material on which concave/convex patterns are partitioned, and a step of punching a mold from the base material by causing a male mold to come into a female mold while overlapping a punching surface of the male mold on a back surface of the base material. | 09-03-2009 |
20110041879 | CLEANING APPARATUS AND CLEANING METHOD - A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object. | 02-24-2011 |
20110073577 | ELECTRONIC COMPONENT LEAD MANUFACTURING METHOD AND MANUFACTURING DEVICE - An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer. | 03-31-2011 |
20110075386 | ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE - An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion. | 03-31-2011 |
20120021617 | ELECTRONIC PART AND LEAD - A lead configured to join to a signal line of an electronic part through solder is disposed in an opposing relationship to the signal line and extends for sliding movement. A first opposing face section including a pair of faces having wettability to the solder is formed on surfaces of the signal line and the lead. Further, a second opposing face section including a pair of faces having wettability lower than the wettability of the first opposing face section is formed on the surfaces of the signal line and the lead along an extending direction of the lead. | 01-26-2012 |
20120234595 | ELECTRONIC-COMPONENT LEAD TERMINAL AND METHOD OF FABRICATING THE SAME - An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction. | 09-20-2012 |