Patent application number | Description | Published |
20080213656 | Battery, Charging Apparatus and Electronic Apparatus - In a battery ( | 09-04-2008 |
20090017373 | Battery Loading and Unloading Mechanism - Erroneous insertion of a battery into an imaging device resulting from downsizing of the battery is prevented. In a battery loading and unloading mechanism for loading and unloading a battery | 01-15-2009 |
20100232101 | Battery, Charging Apparatus and Electronic Device - In a battery including a battery cell formed in a flattened substantially parallelepiped shape and a terminal contacting section electrically connected to the battery cell, at one end in the longitudinal direction of a face of the battery opposing to the face on which the terminal contacting section is provided, a projecting portion which projects in the longitudinal direction of the face is provided. Meanwhile, another projecting portion which projects in the longitudinal direction of the face is provided at the other end. The projecting portions may have projecting lengths different from each other or may have projecting lengths and projecting thicknesses different from each other. A charging apparatus into which the battery is to be installed includes an accommodating section for the battery which in turn includes projection accommodating portions configured to individually accommodate the projecting portions. | 09-16-2010 |
20100323238 | SECONDARY BATTERY - A secondary battery for electronic appliance to be accommodated in an electronic appliance, thereby feeding an electric power to the electronic appliance, is disclosed, which includes a battery cell in which a positive electrode, a negative electrode and an electrolyte are accommodated in a pack, and a positive electrode terminal and a negative electrode terminal from the positive electrode and the negative electrode, respectively are lead out from the same side face of the pack; a metallic battery can in which one opening from which the battery cell is inserted is formed and which accommodates the battery cell therein such that one side face from which the positive electrode terminal and the negative electrode terminal are lead out is faced towards the opening side; and a lid made of a synthetic resin in which a positive electrode terminal part and a negative electrode terminal part to be connected to the electrodes of the electronic appliance upon being connected to the positive electrode terminal and the negative electrode terminal and being faced outwardly are provided and which plugs the opening of the battery can, the battery cell being accommodated in the battery can while the positive electrode terminal and the negative electrode terminal being curved between the positive electrode terminal and the negative electrode terminal and the lid. | 12-23-2010 |
20110064847 | METHOD OF DENATURING PROTEIN WITH ENZYMES - A method of denaturing a protein by treating the protein with a protein glutaminase and a transglutaminase, a food containing a protein having been denatured with these enzymes, and an enzyme preparation for denaturing a protein which contains these enzymes. A protein is denatured by adding protein glutaminase and transglutaminase to the protein substantially at the same timing, or adding protein glutaminase to the protein before the transglutaminase acts on the protein, or controlling the quantitative ratio of protein glutaminase to transglutaminase, by which a protein is treated, to a definite level. | 03-17-2011 |
20110086263 | Battery, Charging Apparatus and Electronic Device - In a battery including a battery cell formed in a flattened substantially parallelepiped shape and a terminal contacting section electrically connected to the battery cell, at one end in the longitudinal direction of a face of the battery opposing to the face on which the terminal contacting section is provided, a projecting portion which projects in the longitudinal direction of the face is provided. Meanwhile, another projecting portion which projects in the longitudinal direction of the face is provided at the other end. The projecting portions may have projecting lengths different from each other or may have projecting lengths and projecting thicknesses different from each other. A charging apparatus into which the battery is to be installed includes an accommodating section for the battery which in turn includes projection accommodating portions configured to individually accommodate the projecting portions. | 04-14-2011 |
20110223473 | BATTERY DEVICE, ELECTRONIC APPARATUS, AND BATTERY SYSTEM - Disclosed is a battery device including a battery enclosure incorporating a battery cell. The battery device further includes an output terminal that outputs power of the battery cell. The battery enclosure includes a first surface, a second surface, a first step surface, a second step surface, a first engaging portion, a second engaging portion, a first groove, and a second groove formed in the second step surface and the second engaging portion, and a recess is provided in at least one of the first step surface and the second step surface. | 09-15-2011 |
20110244276 | STRUCTURE OF THIN BATTERY COVERED BY OUTER PACKAGING FILM, BATTERY PACK, AND METHOD FOR MANUFACTURING BATTERY PACK - To provide a thinner, lighter battery pack and to reduce the cost by eliminating the need for a battery case. A thin battery pack structure using an outer packaging film (battery pack) is constructed by a flat and rectangular shaped battery cell, a flat and rectangular shaped frame portion accommodating the battery cell, a circuit board unit disposed on the outer side surface of the frame portion, a cap portion mounted on one ends of the frame portion and the battery cell so as to sandwich the circuit board unit with the outer side surface of the frame portion, and an outer packaging film for integrally covering the rectangular battery cell and the frame portion. | 10-06-2011 |
20110287306 | BATTERY LOADING AND UNLOADING MECHANISM - In a battery loading and unloading mechanism, a battery formed in a flat rectangular parallelepiped and having an almost square main surface is loaded and unloaded to and from a device. The battery is formed with projecting portions at longitudinal both ends of a back surface thereof and along the back surface, whereby the battery can be prevented from being erroneously inserted into the device. The projecting portion has an inclined surface acutely inclined with respect to the back surface, and when the battery is unloaded from the device, unloading of the battery from the device is accelerated by the inclined surface undergoing contact pressure of the retaining means. The device is formed with a notched portion which is adapted to expose the other projecting portion of the battery when the battery is loaded, thereby facilitating unloading of the battery. | 11-24-2011 |
20120120517 | DATA PROCESSING SYSTEM HAVING DATA REPRODUCTION INDEPENDENT OF DATA PROCESSING - A processing unit performs a method including controlling a reading-out of data from a first storage medium at a predetermined read-out data rate to produce inputted data, and controlling a compression of the inputted data to produce first compressed data of a first compressed format. The method includes controlling a storage of the first compressed data in a second storage medium at a faster writing data rate than the predetermined read-out data rate, controlling a reading-out of second compressed data of a second compressed format from the second storage medium, and controlling a decompression of the second compressed data to produce decompressed data. The method also includes controlling simultaneously the storage of the first compressed data in the second storage medium, the reading-out of the second compressed data from the second storage medium, and audibly reproducing the decompressed data. The first compressed format is different from the second compressed format. | 05-17-2012 |
20120214052 | BATTERY DEVICE, ELECTRONIC APPARATUS, AND BATTERY SYSTEM - Disclosed is a battery device including a battery enclosure incorporating a battery cell. The battery device further includes an output terminal that outputs power of the battery cell. The battery enclosure includes a first surface, a second surface, a first step surface, a second step surface, a first engaging portion, a second engaging portion, a first groove, and a second groove formed in the second step surface and the second engaging portion, and a recess is provided in at least one of the first step surface and the second step surface. | 08-23-2012 |
20120280386 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer. | 11-08-2012 |
20130094334 | DATA PROCESSING SYSTEM HAVING DATA REPRODUCTION INDEPENDENT OF DATA PROCESSING - A processing unit performs a method including controlling a reading-out of data from a first storage medium at a predetermined read-out data rate to produce inputted data, and controlling a compression of the inputted data to produce first compressed data of a first compressed format. The method includes controlling a storage of the first compressed data in a second storage medium at a faster writing data rate than the predetermined read-out data rate, controlling a reading-out of second compressed data of a second compressed format from the second storage medium, and controlling a decompression of the second compressed data to produce decompressed data. The method also includes controlling simultaneously the storage of the first compressed data in the second storage medium, the reading-out of the second compressed data from the second storage medium, and audibly reproducing the decompressed data. The first compressed format is different from the second compressed format. | 04-18-2013 |
20130209855 | BATTERY DEVICE, ELECTRONIC APPARATUS, AND BATTERY SYSTEM - Disclosed is a battery device including a battery enclosure incorporating a battery cell. The battery device further includes an output terminal that outputs power of the battery cell. The battery enclosure includes a first surface, a second surface, a first step surface, a second step surface, a first engaging portion, a second engaging portion, a first groove, and a second groove formed in the second step surface and the second engaging portion, and a recess is provided in at least one of the first step surface and the second step surface. | 08-15-2013 |
20130280592 | SECONDARY BATTERY - A secondary battery for an electronic appliance, including a battery cell. The battery cell has a positive electrode, a negative electrode, and an electrolyte in a pack. A positive electrode terminal and a negative electrode terminal are led out from the same side face of the pack. A metallic battery can accommodates the battery cell therein such that the side face from which the positive electrode terminal and the negative electrode terminal are lead out is faced towards the opening side. A lid, made of a synthetic resin, in which terminal parts to be connected to the electrodes of the electronic appliance upon being connected to the positive electrode terminal and the negative electrode terminal are faced outwardly, plugs the opening of the battery can, the battery cell being accommodated in the battery can upon being adhered onto an inner face thereof. | 10-24-2013 |
20140078873 | DATA PROCESSING SYSTEM HAVING DATA REPRODUCTION INDEPENDENT OF DATA PROCESSING - A processing unit performs a method including controlling a reading-out of data from a first storage medium at a predetermined read-out data rate to produce inputted data, and controlling a compression of the inputted data to produce first compressed data of a first compressed format. The method includes controlling a storage of the first compressed data in a second storage medium at a faster writing data rate than the predetermined read-out data rate, controlling a reading-out of second compressed data of a second compressed format from the second storage medium, and controlling a decompression of the second compressed data to produce decompressed data. The method also includes controlling simultaneously the storage of the first compressed data in the second storage medium, the reading-out of the second compressed data from the second storage medium, and audibly reproducing the decompressed data. The first compressed format is different from the second compressed format. | 03-20-2014 |
20140178733 | BATTERY DEVICE, ELECTRONIC APPARATUS, AND BATTERY SYSTEM - Disclosed is a battery device including a battery enclosure incorporating a battery cell. The battery device further includes an output terminal that outputs power of the battery cell. The battery enclosure includes a first surface, a second surface, a first step surface, a second step surface, a first engaging portion, a second engaging portion, a first groove, and a second groove formed in the second step surface and the second engaging portion, and a recess is provided in at least one of the first step surface and the second step surface. | 06-26-2014 |
20140199576 | BATTERY DEVICE, ELECTRONIC APPARATUS, AND BATTERY SYSTEM - Disclosed is a battery device including a battery enclosure incorporating a battery cell. The battery device further includes an output terminal that outputs power of the battery cell. The battery enclosure includes a first surface, a second surface, a first step surface, a second step surface, a first engaging portion, a second engaging portion, a first groove, and a second groove formed in the second step surface and the second engaging portion, and a recess is provided in at least one of the first step surface and the second step surface. | 07-17-2014 |
20140205880 | BATTERY LOADING AND UNLOADING MECHANISM - Erroneous insertion of a battery into an imaging device resulting from downsizing of the battery is prevented. In a battery loading and unloading mechanism for loading and unloading a battery | 07-24-2014 |
20150030914 | BATTERY DEVICE, ELECTRONIC APPARATUS, AND BATTERY SYSTEM - Disclosed is a battery device including a battery enclosure incorporating a battery cell. The battery device further includes an output terminal that outputs power of the battery cell. The battery enclosure includes a first surface, a second surface, a first step surface, a second step surface, a first engaging portion, a second engaging portion, a first groove, and a second groove formed in the second step surface and the second engaging portion, and a recess is provided in at least one of the first step surface and the second step surface. | 01-29-2015 |
Patent application number | Description | Published |
20090217086 | Disk array apparatus, disk array control method and disk array controller - An error table stores information indicating the occurrence of an error. A statistical score addition table stores the number of scores for disk or path according to the error. A control unit adds the first number of scores to the error disk. Also, when the information indicating the occurrence of the error is not stored in the error table, the control unit adds the second number of scores smaller than the first number of scores to the path to the error disk, while when the information is stored, the control unit adds the third number of scores larger than the first number of scores to the path. The control unit separates the path or disk of which the number of scores exceeds a threshold from the disk array apparatus. | 08-27-2009 |
20100306576 | STORAGE SYSTEM AND STORAGE CONTROL APPARATUS - A storage system includes first and second expanders for connecting storage units, each of the first and second expanders being connected cascade each other, a first controller connected one of the first and one of the second expanders and a host, a second controller connected the one of the second expanders, the one of the first expanders and the host, the second controller detecting a failure of at least one of the first controller, the first expanders and the second expanders, the second controller selectively controlling a first boot sequence which boots the first controller after the first expanders have been booted and a second boot sequence which boots the first controller before the first expanders have been booted, determining one of the first boot sequence and the second boot sequence on the basis of a place where a failure has occurred in a recovery process. | 12-02-2010 |
20120005426 | STORAGE DEVICE, CONTROLLER OF STORAGE DEVICE, AND CONTROL METHOD OF STORAGE DEVICE - A storage device includes a plurality of data storage units that store data; an attribution storage unit that stores an attribution group including each data storage unit on the basis of attributions of the plurality of data storage units; a defect storage unit that stores defects that occurred in a data storage unit; and a preventive-maintenance-subject extracting unit that extracts, as a preventive-maintenance subject, another data storage unit belonging to the same attribution group as the data storage unit in which the defects stored by the defect storage unit has occurred, on the basis of an occurrence history of the defects that occurred in the data storage unit and the attribution group stored by the attribution group storage unit. The storage device also includes a preventive-maintenance performing unit that performs preventive-maintenance on data stored in the other data storage unit extracted by the preventive-maintenance-subject extracting unit. | 01-05-2012 |
20120250179 | STORAGE SYSTEM, STORAGE CONTROL APPARATUS, AND STORAGE CONTROL METHOD - In a storage system, when power supply to HDDs is instantaneously interrupted, a spin up controller of a magnetic disk apparatus spins up the HDDs. On the other hand, based on a response for an access to the HDDs in the magnetic disk apparatus, when detecting that the HDDs as an access destination are spun down, a spin up controller of a control apparatus spins up the HDDs. When a certain number of the HDDs or more are spun down, a separate controller does not permit the magnetic disk apparatus to be used for a given length of time. While the magnetic disk apparatus is not permitted to be used, the HDDs are spun up by using the spin up controller of the magnetic disk apparatus. | 10-04-2012 |
20120254673 | STORAGE SYSTEM AND METHOD FOR DETERMINING ANOMALY-OCCURRING PORTION - In a storage system, when a recovered error occurred upon access to a storage apparatus, a data redundancy determination unit determines whether data to be accessed has redundancy. When the data is determined to have no redundancy, an anomaly-occurring portion determination unit determines that the storage apparatus is not an anomaly-occurring portion and at the same time, an error history determination unit determines whether a recovered error occurred at the time of the past access to the storage apparatus other than that of the access destination. The anomaly-occurring portion determination unit determines whether a common transmission path is the anomaly-occurring portion based on the determination result of the error history determination unit. | 10-04-2012 |
Patent application number | Description | Published |
20120155055 | SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME - A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly. | 06-21-2012 |
20120286416 | SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME - A microelectronic assembly may include a microelectronic element having a plurality of element contacts at a face thereof, and a compliant dielectric element having a Young's modulus of less than about two gigapascal (GPa) and substrate contacts at a first surface joined to the element contacts. The substrate contacts may be electrically connected with terminals at a second surface of the compliant dielectric element that opposes the first surface, through conductive vias in the compliant dielectric element. A rigid underfill may be between the face of the microelectronic element and the first surface of the compliant dielectric element. The terminals may be usable for bonding the microelectronic assembly to corresponding contacts of a component external to the microelectronic assembly. | 11-15-2012 |
20120313238 | SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME - A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent the first surface, and a second dielectric layer disposed between the first dielectric layer and the second surface. A Young's modulus of the first dielectric layer may be at least 50% greater than the Young's modulus of the second dielectric layer, which is less than two gigapascal (GPa). A conductive structure may extend through the first and second dielectric layers and electrically connect substrate contacts at the first surface with terminals at the second surface. The substrate contacts may be joined with contacts of a microelectronic element through conductive masses, and a rigid underfill may be between the microelectronic element and the first surface. The terminals may be usable to bond the microelectronic assembly to contacts of a component external to the microelectronic assembly. | 12-13-2012 |
20120313253 | FAN-OUT WLP WITH PACKAGE - A microelectronic package includes a microelectronic unit and a substrate. The microelectronic unit includes a microelectronic element having contacts on a front face. A dielectric material has a first surface substantially flush with the front face of the microelectronic element. Conductive traces have at least portions extending along the front face away from the contacts, at least some of which also extend along the first surface of the dielectric material. Contacts are connected with the traces, at least some of which are disposed at the first surface of the dielectric material. The substrate has first and second opposed surfaces and an edge extending therebetween, the first surface facing the front face of the microelectronic unit, and the second surface having a plurality of terminals thereon configured for electrical connection with at least one external component. Masses of conductive matrix material join the terminals with the redistribution contacts. | 12-13-2012 |
20120313264 | CHIP WITH SINTERED CONNECTIONS TO PACKAGE - A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge surface can be disposed at a periphery of the substrate or can be the edge surface of an aperture within the substrate. A microelectronic element has a front face and contacts thereon, with at least some of the contacts being adjacent to the edge surface of the substrate. A dielectric material overlies the edge surface of the substrate and defines a sloping surface between the front face of the microelectronic element and the substrate. A conductive matrix material defines a plurality of conductive interconnects extending along the sloping surface. The conductive interconnects electrically interconnect respective ones of the contacts with the conductive elements. | 12-13-2012 |
20130032944 | MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND METHOD FOR MANUFACTURE THEREOF - A microelectronic package may include a stacked microelectronic unit including at least first and second vertically stacked microelectronic elements each having a front face facing a top surface of the package. The front face of the first element may be adjacent the top surface, and the first element may overlie the front face of the second element such that at least a portion of the front face of the second element having an element contact thereon extends beyond an edge of the first element. A conductive structure may electrically connect a first terminal at the top surface to an element contact at the front face of the second element, and include a continuous monolithic metal feature extending along the top surface and through at least a portion of an encapsulant, which is between the top surface and the front face of the second element, towards the element contact. | 02-07-2013 |
20130037312 | HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATION - A method for making a microelectronic substrate includes forming a pattern of a selected metallic layer of an in-process unit using laser ablation such that the pattern corresponds to desired locations for conductive features. Conductive material is than added to the in-process unit by a process that uses the pattern to concentrate application of the conductive material to the in-process unit such that the conductive material forms conductive features of the substrate according to the pattern. The step forming a pattern of a selected metallic layer of an in-process unit using laser ablation can includes the use of a UV laser, a CO2 or an excimer laser. | 02-14-2013 |
20130159773 | INFORMATION PROCESSING APPARATUS AND OPERATION STATUS MONITORING METHOD - An information processing apparatus includes a plurality of controller modules capable of performing communications with each other, and a memory included in each controller module to be stored with status information reflecting a status of an error occurring during the communications with other controller modules with respect to the controller module of a communication partner apparatus and/or the controller module of the self-apparatus, wherein, when determining whether or not a fault occurs in a certain controller module in the plurality of controller modules, the controller module different from a determination target controller module determines, based on status information of the determination target controller module that is stored on the memories of two or more controller modules different from the determination target controller module, whether the fault occurs in the determination target controller module. | 06-20-2013 |
20130203216 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby. | 08-08-2013 |
20130300000 | MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND METHOD FOR MANUFACTURE THEREOF - A microelectronic package may include a stacked microelectronic unit including at least first and second vertically stacked microelectronic elements each having a front face facing a top surface of the package. The front face of the first element may be adjacent the top surface, and the first element may overlie the front face of the second element such that at least a portion of the front face of the second element having an element contact thereon extends beyond an edge of the first element. A conductive structure may electrically connect a first terminal at the top surface to an element contact at the front face of the second element, and include a continuous monolithic metal feature extending along the top surface and through at least a portion of an encapsulant, which is between the top surface and the front face of the second element, towards the element contact. | 11-14-2013 |
20140070423 | TUNABLE COMPOSITE INTERPOSER - A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure. | 03-13-2014 |
20140344630 | INFORMATION PROCESSING DEVICE AND CONTROL DEVICE - An information processing device includes a plurality of components and a processor. The processor is configured to measure, upon detection of abnormalities in first components among the plurality of components, a number of abnormalities that occur in each of the first components. The processor is configured to measure an access processing value in each of the first components. The access processing value represents an amount of a predetermined feature relating to each of the first components. The processor is configured to calculate a ratio of the number of abnormalities to the access processing value in each of the first components. The processor is configured to identify a component as a fault location based on the calculated ratios. | 11-20-2014 |
20150044824 | Fan-Out WLP With Package - The present disclosure is directed to a method for making a microelectronic package that includes assembling a microelectronic unit with a substrate, and electrically connecting redistribution contacts on the microelectronic unit and terminals on the substrate with a conductive matrix material extending within at least one opening extending through the substrate. | 02-12-2015 |
20150091118 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby. | 04-02-2015 |
20150146393 | HIGH STRENGTH THROUGH-SUBSTRATE VIAS - A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter. | 05-28-2015 |