Patent application number | Description | Published |
20080265372 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The bottom side of an N type silicon substrate is connected to a power supply terminal, a second P type epitaxial layer is formed on all sides of the N type silicon substrate, and a device forming portion is provided on the second P type epitaxial layer. A first P type epitaxial layer and an interlayer insulating film are provided on the device forming portion and an N well and a P well are formed on the top surface of the first P type epitaxial layer. The second P type epitaxial layer is connected to a ground terminal via the first P type epitaxial layer, the P well, a p | 10-30-2008 |
20090273056 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, and an electrical fuse provided on the semiconductor substrates. The electrical fuse includes a first fuse link and a second fuse link mutually connected in series, a first current inlet/outlet terminal (first terminal) and a second current inlet/outlet terminal (second terminal) respectively provided at an end and the other end of the first fuse link, and a third current inlet/outlet terminal (second terminal) and a fourth current inlet/outlet terminal (third terminal) provided at an end and the other end of the second fuse link. | 11-05-2009 |
20100025816 | Semiconductor device - A width of a region where each of the N wells is in contact with the buried P well is not more than 2 μm. A ground voltage and a power supply voltage are applied to the P well and the N well, respectively. A decoupling capacitor is formed between the N well and the buried P well. | 02-04-2010 |
20100164053 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality of semiconductor chip circuit portions provided over the semiconductor wafer, a plurality of first conductive layers, provided in each of the semiconductor chip forming regions, which is electrically connected to each of the circuit portions, and a first connecting portion that electrically connects the first conductive layers to each other across a portion of the scribe region. An external power supply or grounding pad is connected to any one of the first conductive layer and the first connecting portion. The semiconductor device includes a communication portion, connected to the circuit portion, which performs communication with the outside by capacitive coupling or inductive coupling. | 07-01-2010 |
20100308387 | Solid state imaging device - A solid state imaging device having a light receiving region on a first surface side of a semiconductor substrate, incident light from an object to be imaged being illuminated on a second surface side of the semiconductor substrate, the solid state imaging device including an impurity diffusion layer formed on the first surface side of the semiconductor substrate, a surface of the impurity diffusion layer being silicided, and a gate electrode formed on the first surface side of the semiconductor substrate. The impurity diffusion layer includes the light receiving region disposed on the first surface side of the semiconductor substrate, a surface of the light receiving region being silicided, and the impurity diffusion layer includes at least a surface adjacent to the gate electrode. | 12-09-2010 |
20110089247 | Interface IC and memory card including the same - An exemplary aspect of the present invention is a memory card that includes: a memory that stores data; a driver that modulates the data stored in the memory; a transmitter that transmits the data modulated by the driver to a receiver provided in an external main unit; and an IC chip having the driver and the transmitter formed therein. | 04-21-2011 |
20110175196 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The bottom side of an N type silicon substrate is connected to a power supply terminal, a second P type epitaxial layer is formed on all sides of the N type silicon substrate, and a device forming portion is provided on the second P type epitaxial layer. A first P type epitaxial layer and an interlayer insulating film are provided on the device forming portion and an N well and a P well are formed on the top surface of the first P type epitaxial layer. The second P type epitaxial layer is connected to a ground terminal via the first P type epitaxial layer, the P well, a p | 07-21-2011 |
20120133810 | SOLID STATE IMAGING DEVICE - A solid state imaging device has a semiconductor substrate, a light receiving region provided on a surface layer on a first surface side of the semiconductor substrate, the light receiving region having a silicided surface, second impurity diffusion layer provided adjacent to the light receiving region on the surface layer on the first surface side of the semiconductor substrate, a gate insulating film provided adjacent to the second impurity diffusion layer on the first surface of the semiconductor substrate, a gate electrode provided on the gate insulating film, and a third impurity diffusion layer provided on an opposite side to the second impurity diffusion layer, with the gate insulating film and the gate electrode sandwiched. | 05-31-2012 |
20120262223 | SEMICONDUCTOR DEVICE - A semiconductor device includes a signal output unit, and a decision unit. The signal output unit includes m (≧2) pieces of fuses, a NAND gate, resistance elements, and an output terminal. The decision unit decides whether n or more pieces (m≧n≧2) of fuses are disconnected out of the m pieces of fuses included in the signal output unit, and outputs the result of a decision. When m=n=2, the decision unit is constituted of a NOR gate having two input terminals connected to a respective end of the fuses. Thus, a H-level potential signal is output at an output terminal of the NOR gate when the decision result is affirmative. On the other hand, when the decision result is negative, a L-level potential signal is output at the output terminal. | 10-18-2012 |
20130093044 | SEMICONDUCTOR DEVICE - A semiconductor device includes a signal output unit, and a decision unit. The signal output unit includes m (≧2) pieces of fuses, a NAND gate, resistance elements, and an output terminal. The decision unit decides whether n or more pieces (m≧n≧2) of fuses are disconnected out of the m pieces of fuses included in the signal output unit, and outputs the result of a decision. When m=n=2, the decision unit is constituted of a NOR gate having two input terminals connected to a respective end of the fuses. Thus, a H-level potential signal is output at an output terminal of the NOR gate when the decision result is affirmative. On the other hand, when the decision result is negative, a L-level potential signal is output at the output terminal. | 04-18-2013 |