| Patent application number | Description | Published |
|---|
| 20080236876 | MULTILAYER PRINTED CIRCUIT BOARD - The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating layer. Herein, an end portion of the above described optical path for transmitting an optical signal protrudes from the surface of the outermost insulating layer. | 10-02-2008 |
| 20080247703 | SUBSTRATE FOR MOUNTING IC CHIP AND DEVICE FOR OPTICAL COMMUNICATION - The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element. | 10-09-2008 |
| 20080247704 | PACKAGE SUBSTRATE AND DEVICE FOR OPTICAL COMMUNICATION - A package substrate according to an embodiment of the present invention comprises:
| 10-09-2008 |
| 20080308311 | OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication comprising;
| 12-18-2008 |
| 20080310793 | OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication comprising;
| 12-18-2008 |
| 20080317402 | OPTICAL/ELECTRICAL COMPOSITE WIRING BOARD AND A MANUFACTURING METHOD THEREOF - The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer. | 12-25-2008 |
| 20090010594 | OPTICAL AND ELECTRICAL CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An optical and electrical circuit board includes a patterned electrical wiring and a micro convex lens. The micro convex lens is provided in at least one hole formed in the optical and electrical circuit board. | 01-08-2009 |
| 20090016671 | MULTILAYER PRINTED CIRCUIT BOARD - The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered, wherein the optical circuits are formed and layered so as to be located in different layers. | 01-15-2009 |
| 20090028497 | OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING THE OPTICAL COMMUNICATION DEVICE - An optoelectronic wiring board includes a rigid, a flexible flex section made of an optical wiring, a flex rigid substrate section provided with an electric wiring, and optical wiring means. In the rigid section, a lamination which is formed of a conductive circuit and an insulating layer is formed on both sides of a substrate. The flexible flex section is made of an optical wiring. The flex rigid substrate section is provided with an electric wiring. The optical wiring means has an end face substantially perpendicular to the optical wiring means. The end face is arranged facing an optical element mounting region provided on the rigid section, and at least a part of the flex section is fixed on the rigid section. | 01-29-2009 |
| 20100014803 | METHOD FOR MANUFACTURING OPTICAL INTERFACE MODULE AND OPTICAL INTERFACE MODULE - An optical interface module and a method for manufacturing an optical interface module. One method includes forming a lower clad layer on a first surface of a substrate, forming a core layer on the lower clad layer and forming two grooves in part of the core layer to form a first core part between the two grooves having one end and another end. Also included is forming an upper clad layer on the core layer and in the grooves, mounting a light-emitting element on the first surface and mounting a light-receiving element on the first surface of the substrate. A second core part is optically coupled to the light-emitting element and the first core part, and a third core part is optically coupled to the light-receiving element and the other end of the first core part. | 01-21-2010 |
| 20100135611 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers. | 06-03-2010 |
| 20100195954 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively. | 08-05-2010 |
| 20100202729 | OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING THE OPTICAL COMMUNICATION DEVICE - An optoelectronic wiring board includes a flex-rigid substrate and an optical communication unit. The flex-rigid substrate includes a flexible substrate provided with an electric wiring, and a pair of rigid sections provided on both sides of the flexible substrate. The pair of rigid sections each include a lamination formed of a conductive circuit and an insulating layer. The optical communication unit is made of a flexible material and has both end faces substantially perpendicular to its optical path of transmitting light. Both end portions of the optical communication unit are disposed and fixed on the rigid sections so that both end faces of the optical communication unit face an optical element mounting region provided on the rigid sections of the flex-rigid substrate. | 08-12-2010 |
| 20100232744 | SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING IC CHIP, DEVICE FOR OPTICAL COMMUNICATION, AND MANUFACTURING METHOD OF DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip. | 09-16-2010 |
| 20100303406 | OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication including a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal, and an optical element or a package substrate on which an optical element is mounted. An optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit. The optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface. The lens is provided at either the entrance surface or the exit surface on the side facing the optical circuit. | 12-02-2010 |
