Patent application number | Description | Published |
20080209151 | Storage device and control method of the storage device - A storage device includes a storage medium, a nonvolatile memory, a head, a driving unit, and a processor. The driving unit drives the storage medium. The processor controls the storage device according to a process. The process includes receiving the data transmitted from the host, storing the data received into the nonvolatile memory, estimating a period of time from a time point of the reception of the data to a time point at which a usage rate of the nonvolatile memory becomes 100%, controlling the driving unit on the basis of comparison of the estimated period of time with a period of time before the storage medium is accessible, and writing the data stored in the nonvolatile memory to the storage medium by controlling the head in accordance with the control of the driving unit. | 08-28-2008 |
20080210007 | Angular velocity sensor - An angular velocity sensor includes: a first tuning-fork vibrator having a first base and first aims extending from the first base in a first direction; a second tuning-fork vibrator having a second bass and second arms extending from the second base in a second direction; and a double gimbal portion mat has a drive gimbal portion vibrating about an axis extending in a fourth direction, and a sense gimbal portion vibrating about an axis extending in a fifth direction and senses an angular velocity about an axis extending in a third direction. | 09-04-2008 |
20080237757 | MICRO MOVABLE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER - A micro movable device is made by processing a material substrate of a multilayer structure including a first layer, a second layer having a finely rough region on its surface on the side of the first layer, and an intermediate layer provided between the first and the second layer. The micro movable device includes a first structure formed in the first layer and a second structure formed in the second layer. The second structure includes a portion opposing the first structure via a gap and having a finely rough region on the side of the first structure, and being relatively displaceable with respect to the first structure. | 10-02-2008 |
20090139328 | Packaged micro movable device and method for making the same - A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products. | 06-04-2009 |
20090219642 | MAGNETIC DISK APPARATUS AND DATA STORAGE METHOD - A magnetic disk apparatus | 09-03-2009 |
20090249168 | STORAGE DEVICE - A storage device includes: a storage medium; an auxiliary memory; and a controller for: determining an error correcting code length corresponding to an error rate of a data write area and/or an error correcting code write area of the storage medium; generating an error correcting code on the basis of the data and the determined error correcting code length; storing the generated error correcting code in the error correcting code write area and storing the data in the data write area; and storing a part of the error correcting code in the auxiliary memory if the generated error correcting code has a greater data length than that of the error correcting code write area, so that the part of the error correcting code overflowed from the error correcting code write area is stored in the auxiliary memory. | 10-01-2009 |
20090262447 | STORAGE DEVICE - A storage device includes: a storage unit for writing data into a rotating storage medium via a writing head; a nonvolatile memory; a temporary storage memory for storing a plurality of writing commands temporarily; and a controller for executing the plurality of writing commands so as to selectively write data into the storage unit or the nonvolatile memory, rearranging the writing commands stored in the temporary storage memory in accordance with efficiency for executing the writing commands to write data into the storage unit, sequentially executing the rearranged writing commands in descending order, and executing in parallel at least one of the writing commands that has not been executed to write data into the nonvolatile memory until all the data to be written in accordance with the writing commands are stored in either the storage unit or the nonvolatile memory. | 10-22-2009 |
20100017633 | MEMORY DEVICE, CONTROL DEVICE FOR MEMORY DEVICE, AND CONTROL METHOD FOR MEMORY DEVICE - According to one embodiment, a control device includes: a calculation module acquiring at least one of speed information, and calculating a process time taken to write data group when the acquired speed information is used, each of the speed information corresponding to different swing speed; a selection module selecting one of the speed information based on the acquired speed information and the process time thereof; and a control module controlling a memory medium driving module, controlling the writing module to write the data group when the memory medium driving module is in operation, storing the data group in the memory module when the memory medium driving module is not in operation, controlling the swing module on the basis of the selected speed information, and controlling the writing module to write the data group stored in the memory module. | 01-21-2010 |
20100024547 | ANGULAR SPEED SENSOR AND ELECTRONIC APPARATUS - An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation. | 02-04-2010 |
20100067208 | Packaged device and method of fabricating packaged-device - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 03-18-2010 |
20100118434 | STORAGE APPARATUS AND CONTROL METHOD OF STORAGE APPARATUS - According to one embodiment, a storage apparatus includes: a storage medium configured to include a plurality of tracks; a head configured to write data to the storage medium; an auxiliary storage module configured to be able to store the data; and a controller configured to determine, during data writing, a write start position of the data, move the head to a track to which the data is to be written, start writing the data along the track when the head reaches the track, and store a piece of the data to be written between the write start position and the position where the data is started to be written into the auxiliary storage module. | 05-13-2010 |
20100218977 | PACKAGED DEVICE AND PRODUCING METHOD THEREOF - A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface. | 09-02-2010 |
20100294633 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes a substrate, a stationary electrode provided above the substrate, a movable electrode that is provided to face the stationary electrode, a wall portion that is provided on the substrate and surrounds the movable electrode and the stationary electrode, a film member that is fixed to the wall portion and seals space including the movable electrode and the stationary electrode, and a support portion that is provided, on an inner side of the wall portion on the substrate, in addition to the movable electrode and the stationary electrode to support the film member from within the space. | 11-25-2010 |
20110132734 | ELECTRONIC DEVICE - An electronic device includes a substrate including an active layer, a signal electrode formed on a surface of the active layer, a first driving electrode that is formed on the surface of the active layer and is connected to a ground, and a second driving electrode including a first part that is formed on the surface of the active layer and a second part that is connected to the first part and is provided above the first driving electrode. The substrate is provided with a loop-like groove that penetrates through the active layer and encompasses the first part. | 06-09-2011 |
20110223702 | MANUFACTURING METHOD OF MEMS DEVICE, AND SUBSTRATE USED THEREFOR - A method for manufacturing a MEMS device, includes: preparing a substrate provided with a first substrate in which a cavity is formed, and a second substrate that is bonded to a side of the first substrate on which the cavity is formed and includes a slit to delimit a movable portion in a position corresponding to the cavity, the second substrate, including a first surface thereof facing the first substrate, being provided with a thermally-oxidized film selectively formed on the first surface in a position corresponding to the movable portion; forming a first electrode layer on a second surface opposite to the first surface on which the thermally-oxidized film for the movable portion is formed; forming a sacrifice layer on the first electrode layer and the second substrate; forming a second electrode layer on the sacrifice layer; and removing the sacrifice layer and the thermally-oxidized film after the second electrode layer is formed. | 09-15-2011 |
20130010447 | PACKAGED DEVICE AND METHOD OF FABRICATING PACKAGED-DEVICE - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 01-10-2013 |
20130022790 | MANUFACTURING METHOD OF MEMS DEVICE, AND SUBSTRATE USED THEREFOR - A method for manufacturing a MEMS device, includes: preparing a substrate provided with a first substrate in which a cavity is formed, and a second substrate that is bonded to a side of the first substrate and includes a slit to delimit a movable portion in a position corresponding to the cavity, the second substrate, including a first surface thereof facing the first substrate, being provided with a thermally-oxidized film selectively formed on the first surface in a position corresponding to the movable portion; forming a first electrode layer on a second surface opposite to the first surface; forming a sacrifice lager on the first electrode layer and the second substrate; forming a second electrode layer on the sacrifice layer; and removing the sacrifice layer and the thermally-oxidized film after the second electrode layer is formed. | 01-24-2013 |