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| 20100001456 | PAPER SHEET FEEDING DEVICE - A paper sheet feeding device for sequentially feeding, to a conveyance path, mail items simultaneously received includes a suction mechanism provided adjacent to a pickup position. The suction mechanism includes a chamber having an opening opposed to the pickup position, a guide plate provided at the opening of the chamber, and two projections vertically arranged on the surface of the guide plate. When air is drawn from the pickup position through a plurality of suction holes formed in the guide plate, the leading one of the mail items closest to the pickup position is drawn to the pickup position, and is curved between the two projections. A handling nozzle blows air into the space that is formed between the leading mail item and a subsequent mail item when the leading mail item is curved. | 01-07-2010 |
| 20110254220 | SHEET HANDLING APPARATUS - According to one embodiment, a pickup device includes a separation mechanism for applying, to a to-be-subsequently-fed mail item picked up from accumulated mail items, a separation force exerting in a direction opposite to a mail item pickup direction. The separation mechanism comprises an outer drum with suction holes that face the to-be-subsequently-fed mail item during rotation, an inner drum provided inside and concentric with the outer drum and having air holes that overlap with the suction holes during rotation, a pump for drawing air through the suction holes facing the to-be-subsequently-fed mail item and the air holes overlapping with them to attach the to-be-subsequently-fed mail item to the outer peripheral surface of the outer drum. A controller rotates the inner and outer drums in association with each other to apply a sufficient separation force to the to-be-subsequently-fed mail item. | 10-20-2011 |
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| 20090057982 | SHEET TAKE-OUT APPARATUS - A sheet take-out apparatus includes a supplying structure configured to move a plurality of sheets supplied in a stacking state in a stacking direction and supply a sheet at a leading edge thereof in a movement direction to a take-out position, a take-out structure configured to make contact with the sheet supplied to the take-out position and rotate, thereby taking out the sheet in a direction almost orthogonal to the stacking direction, and move the sheet to a conveying route, a suction structure configured to generate an air current to suck the sheet at the leading edge in the movement direction to the take-out position on an upstream side of a position where the take-out structure makes contact with the sheet in the sheet take-out direction by the take-out structure, and a controller configured to control an operation of the suction structure so as to decrease suction force by the suction structure when the sheet at the leading edge in the movement direction is not taken out by the take-out structure. | 03-05-2009 |
| 20100038840 | SHEET TAKE-OUT APPARATUS - A sheet take-out apparatus includes an insertion portion configured to stack and insert a plurality of sheets in an upright state, a supply structure configured to move the plurality of inserted sheets in the stacking direction and supply a sheet at a leading edge in a moving direction to a take-out position at one end of the insertion portion, a take-out structure configured to rotate in contact with the sheet supplied to the take-out position, thereby take out the sheet in a direction almost perpendicular to the stacking direction, and a suction structure configured to permit an air current to act on the sheet, supplied to the take-out position by the supply structure, at the leading edge in the moving direction and absorb the sheet toward the take-out position. Wherein the suction structure, so as to raise the fallen sheet at the leading edge in the moving direction and permit it to face the take-out structure, makes a flow rate of the air current acting on the sheet different in a surface thereof. | 02-18-2010 |
| 20110042882 | SHEET TAKE-OUT APPARATUS, SHEET PROCESSING APPARATUS, AND SHEET TAKE-OUT METHOD - To provide a sheet take-out apparatus for preventing double feed of sheets and controlling gaps to a desired value, a sheet processing apparatus, and a sheet take-out method. A take-out apparatus includes a supply structure for supplying postal matter to a take-out position, a take-out structure for taking out the postal matter from the take-out position, and a conveying structure for receiving and conveying the postal matter taken out on a conveying path. When a leading edge of the postal matter is held by the conveying structure, an absorbing operation of a vacuum pump is stopped and a moving speed of a take-out belt is reduced. Furthermore, when the postal matter is detected by a sensor, the take-out belt is stopped. | 02-24-2011 |
| 20110101599 | SHEET TAKE OUT APPARATUS AND SHEET PROCESSING APPARATUS - According to one embodiment, a sheet take out apparatus includes a supply table on which sheets are stacked; a detecting portion configured to detect a state of a top surface of the stacked sheets; a cylindrical take out rotor which is rotatably provided so as to face an end portion on a take out side of a top sheet and partially includes a suction hole to attract the sheet, the take out rotor taking out the sheets one by one by attracting the end portion on the take out side of the sheet with rotation; a suction portion which is provided inside the take out rotor and includes an air hole to attract the sheet through the suction hole, the suction portion provided so as to allow the air hole to rotationally move between a first opening position and a second opening position, the first opening position having a first distance away from the end portion on the take out side of the sheet, the second opening position having a second distance, which is longer than the first distance, away from the end portion on the take out side of the sheet; and a drive structure configured to rotationally move the suction portion to any of the first opening position and the second opening position based on state information detected by the detecting portion. | 05-05-2011 |
| 20110290568 | DEVICE FOR MEASURING THE WEIGHT OF A SHEET-LIKE ARTICLE, SHEET PROCESSING DEVICE INCLUDING THIS WEIGHT MEASURING DEVICE AND METHOD FOR MEASURING THE WEIGHT OF A SHEET-LIKE ARTICLE - A weight measuring device for measuring the weight of a sheet-like article, comprising: a conveying unit that is arranged along a conveying route to convey the sheet-like article to be measured, the conveying unit being adapted to rotate while contacting the sheet-like article without being applied by a driving force from outside after receiving the sheet-like article from the conveying route, and transporting the sheet-like article in its rotation direction while supporting the weight of the sheet-like article; and a scale to measure the weight of the conveying unit in a state in which the conveying unit supports the weight of the sheet-like article and transports the sheet-like article. | 12-01-2011 |
| 20110316216 | SHEET HANDLING APPARATUS AND SHEET HANDLING METHOD - According to one embodiment, a sheet handling apparatus includes a take-out member to take out a sheet from a take-out position by rotating in a state in which a negative pressure is applied to the sheet at the take-out position and the sheet is adsorbed to the take-out member; a conveyor portion to receive and convey the sheet taken out from the take-out position by the take-out member; and a control portion to control the take-out member such that, when the sheet at the take-out position is being adsorbed to the take-out member, the take-out member is rotated at a circumferential speed that is slower than a conveying speed of the sheet at the conveyor portion, and when the sheet adsorbed to the take-out member is being transferred to the conveyor portion, the take-out member is rotated at a circumferential speed that is the same as a conveying speed of the conveyor portion at that time. | 12-29-2011 |
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| 20080258316 | Power Semiconductor Module - A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mmφ, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K. | 10-23-2008 |
| 20090159650 | Semiconductor device and automotive AC generator - A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu | 06-25-2009 |
| 20090321783 | Semiconductor Device - A semiconductor device which includes a semiconductor chip; an electrically conductive base electrode bonded to the lower surface of the semiconductor chip by a first bonding member; an electrically conductive lead electrode bonded to the upper surface of the semiconductor chip by a second bonding member; and a first stress relief member for reducing stress developed in the first bonding member due to the difference in thermal expansion between the semiconductor chip and the base electrode, wherein both the base electrode and the first stress relief member are in direct contact with the lower surface of the first bonding member. | 12-31-2009 |
| 20110223718 | SEMICONDUCTOR DEVICE AND AUTOMOTIVE AC GENERATOR - A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu | 09-15-2011 |
