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Hiramatsu
Akioshi Hiramatsu, Aichi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120107674 | SECONDARY BATTERY HAVING ANTI-SCATTERING MECHANISM - A housing for containing electrode assemblies and an electrolyte includes a cover | 05-03-2012 |
Akitoshi Hiramatsu, Aichi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120100421 | SECONDARY BATTERY - Disclosed is a battery | 04-26-2012 |
Hidefumi Hiramatsu, Toronto CA
| Patent application number | Description | Published |
|---|---|---|
| 20110294692 | USE OF MIR-126 FOR ENHANCING HEMATOPOIETIC STEM CELL ENGRAFTMENT, FOR ISOLATING HEMATOPOIETIC STEM CELLS, AND FOR TREATING AND MONITORING THE TREATMENT OF ACUTE MYELOID LEUKEMIA - There is disclosed herein composition, methods and uses relating to miR-126 as a measure of engraftment potential of a population of hematopoietic stem cells (HSCs), as a method of purifying HSCs and in the monitoring or treatment of acute myeloid leukemia. | 12-01-2011 |
Hisanao Hiramatsu, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110251266 | APTAMER FOR NGF AND USE THEREOF - Provided are an aptamer having an inhibitory activity against NGF; a complex containing an aptamer having a binding activity or inhibitory activity against NGF and a functional substance (e.g., affinity substances, labeling substances, enzymes, drug delivery vehicles, drugs and the like); a medicament, a diagnostic agent, a labeling agent and the like containing an aptamer having a binding activity or inhibitory activity against NGF, or a complex containing the aptamer and the functional substance; and the like. | 10-13-2011 |
Ikue Hiramatsu, Okayama-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20110309099 | OPENABLE AND CLOSABLE CONTAINER - An openable and closable container includes a container body having a take-out opening, and an opening-closing lid provided on the container body swingably about a swing axis on a base end side of the lid, the lid opening and closing the take-out opening. Plate rubber (an elastic member) is provided between the contain body and the opening-closing lid. A packing member (an elastic sealing body) is attached to the rear surface of the opening-closing lid such that the packing member seals the take-out opening of the upper plate. | 12-22-2011 |
Katsunori Hiramatsu, Kumamoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20120025059 | Solid-state imaging device and method of manufacturing the same, and imaging apparatus - A solid-state imaging device includes: a semiconductor substrate provided with an effective pixel region including a light receiving section that photoelectrically converts incident light; an interconnection layer that is provided at a plane side opposite to the light receiving plane of the semiconductor substrate; a first groove portion that is provided between adjacent light receiving sections and is formed at a predetermined depth from the light receiving plane side of the semiconductor substrate; and an insulating material that is embedded in at least a part of the first groove portion. | 02-02-2012 |
Nobuki Hiramatsu, Soraku-Gun JP
| Patent application number | Description | Published |
|---|---|---|
| 20110298568 | High-Frequency Module - A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot. | 12-08-2011 |
Seiji Hiramatsu, Aichi-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20110318074 | Fixing Device Having Temperature Detection Element - A fixing device for thermally fixing a developing agent image to a sheet fed in a sheet feeding direction including: a tubular flexible fusing member; a heater; a nip member; a backup member; and a temperature detection element. The tubular flexible fusing member has an inner peripheral surface defining an internal space. The heater is disposed in the internal space and configured to radiate radiant heat. The nip member is disposed in the internal space and configured to receive the radiant heat from the heater. The inner peripheral surface is in sliding contact with the nip member. The backup member is configured to provide a nip region in cooperation with the fusing member upon nipping the fusing member between the backup member and the nip member. The backup member confronts the nip member in a confronting direction. The temperature detection element is disposed in a superposed region of the nip member superposed with the nip region in the confronting direction and configured to detect a temperature of the superposed region. | 12-29-2011 |
Shinichi Hiramatsu, Chiryu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120056449 | Deflector apparatus for vehicle - A deflector apparatus for a vehicle includes the deflector body configured to be provided along a front edge portion of an opening portion formed on a roof portion of a vehicle and to be deployed by projecting above a surface of the roof portion. The deflector body includes a mesh member extending along the front edge portion of the opening portion. The deflector apparatus for the vehicle also includes a pair of resin frames provided at end portions of the mesh member in a widthwise direction of the mesh member respectively to extend in a lengthwise direction of the mesh member over an entire length of the mesh member. The pair of resin frames is resin-molded integrally with the mesh member and covers the end portions of the mesh member including edges of the mesh member in the widthwise direction of the mesh member. | 03-08-2012 |
Shogo Hiramatsu, Kawasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120103934 | METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM - The present invention aims to prevent decreases in etching rate due to adhesion of an etched film to a substrate holder. | 05-03-2012 |
Shoji Hiramatsu, Fukuoka-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20120085285 | SEMICONDUCTOR GROWTH APPARATUS - A according to one embodiment, a semiconductor growth apparatus growing a semiconductor layer on a substrate includes a susceptor, a heater element, a gas feed unit and an auxiliary susceptor. The susceptor includes a first major surface, a second major surface and a substrate holder provided in the first major surface. The heater element heats the susceptor from the second major surface side. The gas feed unit feeds source gases of the semiconductor layer flowing along the first major surface. The auxiliary susceptor is disposed on a portion adjacent to the substrate holder on an upstream side in the source gas flow in the first major surface. | 04-12-2012 |
Takehiro Hiramatsu, Chigasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110286736 | CAMERA MODULE - According to one embodiment, there is provided a camera module formed with substantially the same scale as a chip of an image sensor, includes a lens held by a lens holder, an image sensor placed in a position in which an image is formed by the lens, and a wiring board disposed between the lens and the image sensor and electrically connected to the image sensor. An opening that permits light entering the image sensor to pass therethrough is formed in the wiring board. Further, a passive component is contained in the wiring board. | 11-24-2011 |
Tatsuya Hiramatsu, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120072877 | LAYOUT VERIFICATION APPARATUS AND LAYOUT VERIFICATION METHOD - According to one embodiment, a layout verification apparatus includes a design section, a layout creation section, a first verification section and a second verification section. One of the first and second verification sections includes a filter processing section which executes a filter processing of a verification target element to be verified by a mask data used to a manufacture of the semiconductor integrated circuit, and the verification target element to be verified needs an ion implantation. The filter processing section comprises a first logic section which executes an logical AND of the verification target element to be verified, a mask data necessary in order to form the verification target element to be verified, and a data inverted a mask data unnecessary in order to form the verification target element to be verified. | 03-22-2012 |