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Hinode
Haruo Hinode, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100030645 | ADVERTISEMENT DISTRIBUTING SYSTEM, ADVERTISING DISTRIBUTING SERVER, ADVERTISEMENT DISTRIBUTING METHOD, PROGRAM AND RECORDING MEDIUM - An advertisement distributing system, advertisement distributing server, and advertisement distributing method, program and recording medium are provided for encouraging the users to buy a product in such a manner that the most suitable program video scene is selected in accordance with the advertisement distributed by an advertiser, and distributed to the users with the advertisement. An advertising video searching unit of a server, based on an advertisement ID received from a first terminal device, searches through advertisement video, extracts a video ID corresponding to the advertisement ID and outputs it to a viewing history searching unit. A viewing history searching unit determines whether the video ID has been stored in viewing history that reflects user's taste, and outputs the corresponding video ID if it is found, to a content synthesizer. The content synthesizer distributes the advertisement data and video data to the first terminal device. | 02-04-2010 |
Haruo Hinode, Chiba JP
| Patent application number | Description | Published |
|---|---|---|
| 20090121876 | Ic Tag Whose Function Can Be Changed Upon Separation - Data falsification or the like is prevented and security is enhanced in an IC tag. The IC tag consists of three portions: separable portions A | 05-14-2009 |
Kenji Hinode, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080233736 | PROCESS FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer. | 09-25-2008 |
| 20100136786 | PROCESS FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer. | 06-03-2010 |
Yoshihiro Hinode, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090316554 | IMAGE RECORDING/REPRODUCING DEVICE - There is provided an image recording/reproducing device that can discriminate a disk separation error that is specific to removable hard disks. A disk error detector ( | 12-24-2009 |