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Hinken
Aaron Hinken, San Francisco, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110014212 | Certain Chemical Entities, Compositions and Methods - Provided is a method of treating myasthenia gravis in a patient by administering to the patient an effective amount of a skeletal muscle troponin activator, or a pharmaceutically acceptable salt thereof. | 01-20-2011 |
Frank Hinken, Rheine DE
Johann Hinken, Magdeburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20090102471 | PROBE FOR A MAGNETIC REMANENCE MEASUREMENT METHOD, AND METHOD FOR DETECTING DEPOSITS OF FOREIGN MATERIAL AND INCLUSIONS IN HOLLOW SPACES - A probe for a magnetic remanence measurement method, in particular for detecting foreign material deposits and inclusions in hollow spaces, the hollow spaces being formed in a non-ferromagnetic material and the foreign material deposits and inclusions being made of a ferromagnetic material, wherein the probe includes at least one magnetic field sensor, at least one first and one second magnet, the magnets being configured before the at least one magnetic field sensor in a direction of introduction into the hollow space, and being situated relative to one another in such a way that their pole axes run non-parallel to one another. | 04-23-2009 |
| 20090219031 | Method for Checking the Current Flow Through Individual Wires of a Braided Wire, and Apparatus for Carrying out the Method - In order to make it possible to detect a fault location, safely, reliably and with a high response sensitivity, in a braided wire which has a plurality of individual wires, an electric current is passed through the braided wire and the magnetic field which is formed as a result of the braided wire through which current flows is detected by a sensor and is evaluated. A fault location is deduced if the measured magnetic field has an oscillation whose length is a multiple of a lay length of the braided wire, and in particular corresponds to the lay length. The method is also used in particular for non-destructive testing of the quality of a contact connection of a contact element to the braided wire. | 09-03-2009 |
| 20110062965 | DEVICE FOR THE MEASUREMENT OF COATING THICKNESSES BY MEANS OF MICROWAVES - A device for measurement of a thickness of a coating applied to a substrate includes a transmitter/receiver module configured to transmit and receive microwave radiation; a computing unit; and a probe having a flange and an inner and an outer conductor, wherein the outer conductor coaxially surrounds the inner conductor, and wherein the inner conductor includes at least one thickened section. | 03-17-2011 |
John C. Hinken, Hudsonville, MI US
| Patent application number | Description | Published |
|---|---|---|
| 20100279051 | TRIM PANEL - An apparatus and method for making a trim panel. The method includes providing a preform laminate including a compressible material sandwiched between a flexible skin and a back skin. Positioning the preform laminate in the mold. Placing an insert with the preform laminate in the mold to created a step to establish a seam location and define a secondary area on the preform laminate. Compressing the compressible material by introducing a molten polymeric material to the mold forming a substrate and bonding the substrate to the preform laminate forming the trim component. The preform laminate folds onto itself and creates a crease along the step to simulate the seam and provide a contour change with the appearance of cushioning in the secondary area, and removing the trim panel component from the mold. | 11-04-2010 |
Ludger Hinken, Lindau DE
| Patent application number | Description | Published |
|---|---|---|
| 20090052146 | Printed Board - The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled. In order to prevent short-circuits and allow power connections, an additional layer is arranged on the printed board above the inlay and simultaneously below the component to be cooled and comprises thermic provisions between a component to be cooled and the inlay for ensuring a good to excellent heat conduction from the heating zone of a component to be cooled to the inlay. | 02-26-2009 |