Him
Aylan Him, Coppell, TX US
Patent application number | Description | Published |
---|---|---|
20130074534 | MULTI-STAGED WATER MANIFOLD SYSTEM FOR A WATER SOURCE HEAT PUMP - One aspect, as provided herein, is directed to a multi-stage fluid control system for a fluid source heat pump system. This embodiment comprises compressors configured to operate as separate, heat exchange stages, condensers each being fluidly coupled to at least one of the compressors by refrigerant tubing and having intake ends coupled together by a fluid intake manifold. This embodiment further includes output conduits coupled to each of the condensers and that are couplable to a distal location. Further included is a modulating valve control system interposed the output conduits. The modulating valve control system is configured to stage a flow of fluid through the condensers based on a number of operating compressors. | 03-28-2013 |
Aylan A. Him, Irving, TX US
Patent application number | Description | Published |
---|---|---|
20100293991 | AIR CONDITIONING WIRING SYSTEM - A wiring system for use in an air conditioning system comprising a printed circuit board having a perimeter and wiring receptacles located proximate the perimeter and wiring connectors. In one aspect, at least some of the wiring receptacles comprise two or more wiring sub-receptacles, and each of the wiring sub-receptacles includes a slotted sub-receptacle connection pattern. Furthermore, the slotted sub-receptacle connection pattern of each of the wiring sub-receptacles is different from every other sub-receptacle connection pattern. Each of the wiring connectors includes a ridged connection pattern that is different from every other ridged connection pattern of the wiring connectors, such that a given wiring connector is receivable within only one of the wiring sub-receptacles. An air conditioning system and a method of manufacturing is also provided. | 11-25-2010 |
20120122323 | AIR CONDITIONING WIRING SYSTEM - A wiring system for use in an air conditioning system comprising a printed circuit board having wiring receptacles and wiring connectors. In one aspect, at least some of the wiring receptacles comprise two or more wiring sub-receptacles, and each of the wiring sub-receptacles includes a slotted sub-receptacle connection pattern. Furthermore, the slotted sub-receptacle connection pattern of each of the wiring sub-receptacles is different from every other sub-receptacle connection pattern. Each of the wiring connectors includes a ridged connection pattern that is different from every other ridged connection pattern of the wiring connectors, such that a given wiring connector is receivable within only one of the wiring sub-receptacles. An air conditioning system and a method of manufacturing is also provided. | 05-17-2012 |
Phean Him, Santa Rosa, CA US
Patent application number | Description | Published |
---|---|---|
20100124533 | Large Animal Model for Human-Like Advanced Atherosclerotic Plaque - An animal model for cardiovascular disease comprising one or more vascular plaque lesions formed at selected sites within a vascular segment of a nonhuman mammal. The vascular plaque lesion is formed by administering a hypercholesterolemic diet to the nonhuman mammal, inflicting an injury to the vascular wall at the selected site after a predetermined exposure to the hypercholesterolemic diet, and applying a hydrogel to the injured vascular wall. Another aspect of the invention provides a method for evaluating a test compound for an effect on atherosclerotic lesion formation comprising administering to a nonhuman mammal a hypercholesterolemic diet, and, after a defined period of time, isolating a segment of a blood vessel using a balloon catheter, inflicting an injury to the vascular wall within the isolated segment, and applying a hydrogel within the vascular segment. The method further comprises forming a vascular plaque lesion on the vascular wall at the site of the injury, delivering the test compound to the nonhuman mammal, and monitoring atherosclerotic lesion size and composition at the injured site after a defined period of exposure to the test compound. | 05-20-2010 |