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Hilty, US
Christian Hilty, College Station, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20100264917 | DETECTION OF MAGNETIC RESONANCE SIGNALS USING A MAGNETORESISTIVE SENSOR - A method and apparatus are described wherein a micro sample of a fluidic material may be assayed without sample contamination using NMR techniques, in combination with magnetoresistive sensors. The fluidic material to be assayed is first subject to pre-polarization, in one embodiment, by passage through a magnetic field. The magnetization of the fluidic material is then subject to an encoding process, in one embodiment an rf-induced inversion by passage through an adiabatic fast-passage module. Thereafter, the changes in magnetization are detected by a pair of solid-state magnetoresistive sensors arranged in gradiometer mode. Miniaturization is afforded by the close spacing of the various modules. | 10-21-2010 |
David J. Hilty, Kodiak, AK US
| Patent application number | Description | Published |
|---|---|---|
| 20100275504 | GATE FOR MARINE ANIMAL TRAP - A trigger for a marine animal trap is preferably constructed from two identical, or nearly identical, parts. The two parts are substantially flat as manufactured, and are constructed to have connector sections that fold without breaking away from each substantially flat part. The connector sections overlap and secure to one another, preferably with integral connection facilitators on each connector section. Fingers from each substantially flat part converge towards one another when the connector sections are secured together. Optional excluder bars may be included on each substantially flat part, and may be bent towards one another and secured together. | 11-04-2010 |
Robert D. Hilty, Harrisburg, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20080202641 | COMPOSITION AND METHOD FOR ALLOY HAVING IMPROVED STRESS RELAXATION RESISTANCE - A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electromechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating. The microalloyed sulfur-containing nickel-based alloy of the present invention includes a second phase of sulfide precipitates across the grain (intragranular) that improves the stress-relaxation resistance of the alloy. | 08-28-2008 |
| 20080242128 | Elastomeric electrical contact - An electrical contact is provided that includes an elastomeric body extending between a base portion and a mating end portion. The elastomeric body includes a ledge extending from the mating end portion to the base portion of the elastomeric body. The ledge is defined by a portion of the elastomeric body. An electrically conductive pad extends over at least a portion of the mating end portion. An electrically conductive trace is formed on a surface of the ledge. The electrically conductive trace extends from the mating end portion to the base portion of the elastomeric body. The electrically conductive trace is in electrical contact with the electrically conductive pad for electrically connecting the electrically conductive pad with an electrically conductive element engaging the base portion of the elastomeric body. | 10-02-2008 |
Robert Daniel Hilty, Harrisburg, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20090050358 | Electrical connector with elastomeric element - An electrical connector is provided. The electrical connector includes a substrate and an elastomeric element extending outwardly from the substrate. The elastomeric element extends outwardly from a base portion thereof at the substrate to an end portion thereof that is opposite the base portion. An electrical contact engages an electrically conductive element of the substrate. The electrical contact has a portion extending over at least a portion of the end portion of the elastomeric element. | 02-26-2009 |
| 20100308103 | SYSTEM AND METHOD FOR VAPOR PHASE REFLOW OF A CONDUCTIVE COATING - A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components. | 12-09-2010 |
| 20100311289 | COMPOSITE ASSEMBLY FOR AN ELECTRICAL CONNECTOR AND METHOD OF MANUFACTURING THE COMPOSITE ASSEMBLY - A composite assembly for an electrical connector includes a conductive substrate and an electrodeposited layer. The conductive substrate is configured to form a conductive path of the electrical connector. The electrodeposited layer is disposed on the conductive substrate and includes a dielectric material. A method of manufacturing a composite assembly for an electrical connector includes providing a fluid bath that includes a dielectric material and immersing at least part of a conductive substrate into the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate and electrodepositing a dielectric layer that includes the dielectric material on the conductive substrate. | 12-09-2010 |