Patent application number | Description | Published |
20090323300 | Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board - The invention provides an adhesive layer-attached conductive foil and a conductor-clad laminated sheet which allow transmission loss to be satisfactorily reduced especially in the high-frequency band, which exhibit excellent heat resistance, and which allow production of printed circuit boards that are adequately resistant to interlayer peeling. The adhesive layer-attached conductive foil of the invention is provided with a conductive foil and an adhesive layer formed on the conductive foil, wherein the adhesive layer is composed of a curable resin composition containing component (A): a polyfunctional epoxy resin, component (B): a polyfunctional phenol resin and component (C): a polyamideimide. The conductor-clad laminated sheet of the invention comprises an insulating layer, a conductive layer situated facing the insulating layer, and an adhesive layer sandwiched between the insulating layer and conductive layer, and the adhesive layer is composed of a cured resin composition containing components (A), (B) and (C). | 12-31-2009 |
20100129676 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE - Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength. | 05-27-2010 |
20100173163 | METHOD FOR PRODUCING CURING AGENT HAVING ACIDIC SUBSTITUENT AND UNSATURATED MALEIMIDE GROUP, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE - The invention provides a method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I)); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The curing agent produced through the method of the present invention has good solubility in an organic solvent and can provide a thermosetting resin composition exhibiting excellent adhesion-to-metal foil property, heat resistance, moisture resistance, flame retardancy, and copper cladding heat resistance, and low dielectric properties and low dielectric loss tangent. Therefore, the thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices. | 07-08-2010 |
20100233495 | Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same - Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. | 09-16-2010 |
20120077401 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM - A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same. | 03-29-2012 |
20120237751 | PREPREG, LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD - Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. | 09-20-2012 |
20120247820 | RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD - Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. | 10-04-2012 |
20120276392 | THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE - Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided. | 11-01-2012 |
20120305291 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF - Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B). | 12-06-2012 |
20120316263 | Method for Producing Curing Agent Having Acidic Substituent and Unsaturated Maleimide Group, Thermosetting Resin Composition, Prepreg, and Laminate - A method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I) below); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices. | 12-13-2012 |
20130008695 | VARNISH, PREPREG, FILM WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes. | 01-10-2013 |
20130040153 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE - A thermosetting resin varnish that includes a thermosetting resin composition of an uncured semi-IPN composite having compatibilized with one another (A) a polyphenylene ether, (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified, and (C) a crosslinking agent; (D) an inorganic filler; and (E) a saturated thermoplastic elastomer. Also, a resin varnish for a printed circuit board, a prepreg, and a metal-clad laminate, using the thermosetting resin varnish. | 02-14-2013 |
20130112459 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing at least two glass substrate layers and at least one inner cured resin layer existing between the adjacent two glass substrate layers, wherein the inner cured resin layer comprises a cured product of an inner resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 05-09-2013 |
20130112460 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate comprising a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 05-09-2013 |
20130172459 | PROCESS FOR PRODUCING COMPATIBILIZED RESIN, THERMOSETTING RESIN COMPOSITION, PREPREG, AND LAMINATE - Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same. The foregoing thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foil, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric characteristics, and drillability, achieves the high density and high reliability of wiring boards required at present, and can be widely used for production of electronic appliances and the like. | 07-04-2013 |
20130180760 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 07-18-2013 |
20130180765 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate. | 07-18-2013 |
20130180769 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and a fibrous base material and wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate body. A laminate plate containing at least one cured resin layer of the resin composition and at least one glass substrate layer, wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate, which comprises forming a fiber-containing cured resin layer on the surface of a glass substrate. | 07-18-2013 |
20130330563 | MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME - There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. | 12-12-2013 |
20140000948 | RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME | 01-02-2014 |
20140151091 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME - Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. Specifically disclosed are a primer layer for plating process formed of a resin composition for primer layer including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B); a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. | 06-05-2014 |
20140192501 | MODIFIED SILOXANE COMPOUND HAVING AROMATIC AZOMETHINE, THERMOSETTING RESIN COMPOSITION INCLUDING THEREOF, PREPREG, FILM HAVING RESIN, LAMINATE, MULTI-LAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE - A siloxane compound containing structures represented by the following general formulae (1) and (2): | 07-10-2014 |