Patent application number | Description | Published |
20120224809 | OPTICAL FIBER COMPONENT, MANUFACTURING METHOD THEREOF, OPTICAL FIBER AND LENS SUBSTRATE ASSEMBLY, AND MANUFACTURING METHOD THEREOF - An optical fiber and lens substrate assembly includes: an optical fiber component including an optical fiber core wire, and an end-surface-fixing resin block in which the optical fiber core wire is embedded, and cross section of an optical fiber element wire and a secondary coating that constitute the optical fiber core wire are exposed to a smooth surface thereof; and a lens substrate attached to the smooth surface of the end-surface-fixing resin block. | 09-06-2012 |
20120248977 | LIGHT EMITTING DEVICE-LIGHT RECEIVING DEVICE ASSEMBLY, AND MANUFACTURING METHOD THEREOF - A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base. | 10-04-2012 |
20120256814 | PIXEL CHIP, DISPLAY PANEL, LIGHTING PANEL, DISPLAY UNIT, AND LIGHTING UNIT - There are provided a pixel chip capable of preventing false lighting of a light emitting device, a display panel including the pixel chip as a pixel, a lighting panel including the pixel chip as a pixel, a display unit including the display panel, and a lighting unit including the lighting panel. The pixel chip includes: one or a plurality of light emitting devices; a driver IC driving the light emitting devices; a connection section that is arranged between the light emitting devices and the driver IC, and electrically connects the light emitting devices to the driver IC; and a light shielding section that is arranged between the light emitting devices and the driver IC, and blocks direct entrance of light emitted from each of the light emitting devices into the driver IC together with the connection section. | 10-11-2012 |
20130108219 | CONNECTOR AND ELECTRONIC APPARATUS | 05-02-2013 |
20140064662 | CONNECTOR, METHOD OF MANUFACTURING SAME, AND OPTICAL COMMUNICATION SYSTEM - A connector includes: a fiber attachment path in which at least a part thereof has a height less than an outer diameter of an optical fiber; and a light-direction changing section provided at an end of the fiber attachment path. | 03-06-2014 |
20140203196 | SEMICONDUCTOR LASER DEVICE, PHOTOELECTRIC CONVERTER, AND OPTICALINFORMATION PROCESSING UNIT - A semiconductor laser device that enables flip-chip assembly by having an embedding section around a mesa section, and that has an improved emission lifetime, as well as a photoelectric converter and an optical information processing unit each having such a semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section overlaying the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture. | 07-24-2014 |
20140295203 | MEMBER MOUNTING METHOD AND MEMBER ASSEMBLY - A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member. | 10-02-2014 |
20140326892 | IMAGE PICKUP PANEL AND IMAGE PICKUP PROCESSING SYSTEM - An image pickup panel ( | 11-06-2014 |
20140339289 | METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS - A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate. | 11-20-2014 |
20140361431 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a first semiconductor electronic component which includes a pad electrode, a solder bump, and a metal layer between a pad and solder that is configured to have an underlying metal layer formed between the pad electrode and the solder bump and connected to the pad electrode, and a main metal layer formed on the underlying metal layer, and in which the main metal layer has an eave portion at an outer edge portion thereof. | 12-11-2014 |
20150078711 | OPTICAL TRANSMISSION MODULE - An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate. | 03-19-2015 |