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Higuchi, Osaka

Hiroyuki Higuchi, Osaka JP

Patent application numberDescriptionPublished
20110039091POROUS SHEET AND METHOD FOR PRODUCING THE SAME, AND HEAT INSULATING SHEET - The method for producing the porous sheet of the present invention includes the steps of (I) preparing a plurality of sheet materials that contain polytetrafluoroethylene and carbon particles and (II) stacking the plurality of sheet materials over one another and rolling the stacked sheet materials. In the method for producing the porous sheet of the present invention, step (I) and step (II) may be repeated alternately. Further, as the sheet materials to be used in the production method of the present invention, a base sheet obtained by forming a mixture containing polytetrafluoroethylene and carbon particles into sheet form also can be used, or a laminated sheet obtained by stacking a plurality of base sheets over one another and rolling them also can be used, for example.02-17-2011

Isao Higuchi, Osaka JP

Patent application numberDescriptionPublished
20090163632CYCLOOLEFIN COPOLYMER - A novel cycloolefin copolymer that can be employed in the production of molding with fewer defects, for example, fewer gel particles (fish eyes). There is provided a cycloolefin copolymer comprising 80 to 20 mol % of repeating units derived from an α-olefin monomer and 20 to 80 mol % of repeating units derived from at least one cycloolefin monomer selected from the group consisting of monomer of the general formula (I), monomer of the general formula (II), monomer of the general formula (III), monomer of the general formula (IV) and monomer of the general formula (V), wherein with respect to the repeating units derived from cycloolefin monomer, the proportion thereof being present in the form of dimer (Rd) is 50 mol % or below and the proportion thereof being present in the form of trimer (Rt) 5 mol % or above.06-25-2009
20100297453INSULATING SHEET AND MULTILAYER STRUCTURE - The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer comprises: (A) a polymer having an aromatic skeleton and a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent composed of a phenol resin, an acid anhydride having an aromatic skeleton or an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride; and (D) a filler. When the insulating sheet is uncured, the insulating sheet has a glass transition temperature Tg of 25° C. or lower.11-25-2010
20110135911INSULATING SHEET AND MULTILAYER STRUCTURE - The present invention provides an insulating sheet which is excellent in handleability when it is uncured, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, acid resistance, and processability, and a multilayer structure produced by the use of the insulating sheet. The insulating sheet comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy resin (B1) having a weight average molecular weight of less than 10,000 and an oxetane resin (B2) having a weight average molecular weight of less than 10,000; (C) a curing agent; and (D) at least one of magnesium carbonate anhydrous (D1) represented by MgCO06-09-2011
20110159296INSULATING SHEET AND LAMINATED STRUCTURE - The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).06-30-2011

Patent applications by Isao Higuchi, Osaka JP

Kunihiro Higuchi, Osaka JP

Patent application numberDescriptionPublished
20100130045Connector for Flexible Circuit - A connector to be attached to an end portion of a planar flexible circuit board includes a main body having a support surface on which is placed a portion of the flexible circuit board of a predetermined length from a distal end thereof, the support surface provided with an electrode which contacts a conductor on one surface of the flexible circuit board; and an actuator which holds the flexible circuit board between the actuator and the support surface of the main body. The actuator is pivotably joined to the main body at a base end portion of the actuator, and engages with the main body at a distal end portion of the actuator.05-27-2010

Masashi Higuchi, Osaka JP

Patent application numberDescriptionPublished
20080293898Catalyst for Olefin Polymerization and Polymerization Method Using the Same - Disclosed is a catalyst for olefin polymerization, comprising: Component [A]: a prepolymer obtained by olefin prepolymerization on solid titanium catalyst component having an average particle size of 25 to 70 μm produced by contacting of a solid component (i) having an average particle size of 26 to 75 μm, containing magnesium, titanium, halogen, and an electron donor (c11-27-2008

Minoru Higuchi, Osaka JP

Patent application numberDescriptionPublished
20110192449PHOTOVOLTAIC MODULE - This invention provides a photovoltaic module for preventing insulation failure between an outer frame and connection leads. The photovoltaic module comprises: a photovoltaic submodule including a plurality of solar cells interposed between two light-transmitting substrates through the intermediary of an encapsulant and the connection leads extending from an edge between light-transmitting substrates and outputting generated electric currents; a terminal box attached near an edge of the photovoltaic submodule and housing connected parts between the connection leads and cables for outputting the electric currents to the outside; and an outer frame fitting over peripheral edges of the photovoltaic submodule. A side, of the light-receiving side light-transmitting substrate, from which the connection leads are pulled out, is made large so as to extend outward further than the other light-transmitting substrate. The connection leads are led out from the edge between the two light-transmitting substrates to be guided into the terminal box.08-11-2011

Motohiro Higuchi, Osaka JP

Patent application numberDescriptionPublished
20100269330COMPONENT MOUNTING APPARATUS, COMPONENT MOUNTING HEAD, AND COMPONENT MOUNTING METHOD - An object of the present invention is to provide a component a mounting apparatus capable of accurately determining minute mounting applied pressure. The component mounting head of the component mounting apparatus includes: a movable part having a suction bit section and a movable shaft, a weight compensation mechanism for engaging with the movable shaft to compensate for the gravitational force of the total weight of the movable part and a component suctioned to the suction bit section, on the basis of the total weight; a force determination unit for determining a force applied to the movable part in the vertical direction; and a drive unit for moving the force determination unit in the vertical direction. The control unit of the component mounting apparatus controls the drive unit in such a manner that the determination value of the force determination unit becomes a target value.10-28-2010

Naoaki Higuchi, Osaka JP

Patent application numberDescriptionPublished
20090087647Impact Absorption Sheet for Flat Panel Display, Process for Producing the Same, and Flat Panel Display - The present invention provides an impact absorption sheet for flat panel display with a polyoxyalkylene-series polymer as the main component, preferably, an impact absorption sheet for flat panel display made of a cured product obtained by curing a composition containing (A) polyoxyalkylene-series polymer having at least one alkenyl group in each molecule, (B) compound having an average of 2 or more hydrosilyl groups in each molecule, and (C) hydrosilylation catalyst.04-02-2009
20090291227PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING THE SAME - The present invention relates to a pressure-sensitive adhesive composition including, as a main ingredient, a monomer mixture or an acrylic copolymer material obtained by at least partially polymerizing the monomer mixture, the monomer mixture including: at least one monomer (monomer ml) selected from alkyl (meth)acrylates represented by the following formula (I) CH11-26-2009
20090292095PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET TO BE ATTACHED TO METAL SURFACE - The present invention relates to a pressure-sensitive adhesive composition used for a pressure-sensitive adhesive sheet to be directly attached to a metal surface, the composition including, as a base polymer, an acrylic copolymer obtained by polymerizing a monomer mixture, the monomer mixture including: at least one monomer (monomer m1) selected from alkyl(meth)acrylates represented by the formula (I): CH11-26-2009
20100233466ACRYLIC PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention relates to an acrylic pressure-sensitive adhesive sheet including: a viscoelastic material layer (X) containing hollow microspheres; and a pressure-sensitive adhesive layer (Y) provided on at least one face of the viscoelastic material layer (X) and formed from a pressure-sensitive adhesive composition including, as a main component, an acrylic copolymer which is constructed from the following monomers (m1) and (m2) as an essential monomer component, in which a content of the monomer (m1) is 50 to 99.9% by weight and a content of the monomer (m2) is 0.1 to 25% by weight based on a total amount of monomer components constituting the acrylic copolymer, (m1) an alkyl(meth)acrylate monomer including an alkyl group having 1 to 20 carbon atoms, which is represented by the following formula (1),09-16-2010
20100233467ACRYLIC PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention relates to an acrylic pressure-sensitive adhesive sheet including: a viscoelastic material layer (X) containing hollow microspheres; and a pressure-sensitive adhesive layer (Y) provided on at least one face of the viscoelastic material layer (X) and formed from a monomer composition, in which the monomer composition includes the following monomers (m1), (m2) and (m3) as essential monomer components, in which a content of the monomer (m1) is 50 to 85% by weight, a content of the monomer (m2) is 0.1 to 20% by weight, and a content of the monomer (m3) is 2 to 40% by weight, based on a total amount of monomer components constituting the monomer composition, 09-16-2010

Naotaka Higuchi, Osaka JP

Patent application numberDescriptionPublished
20100157560Wired circuit board and connection structure between wired circuit boards - A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.06-24-2010

Patent applications by Naotaka Higuchi, Osaka JP

Takeshi Higuchi, Osaka JP

Patent application numberDescriptionPublished
20110081953MOBILE COMMUNICATION TERMINAL AND TERMINAL OPERATION METHOD - An object is to effectively use a surface of a display unit of a mobile communication terminal and to appropriately set a detection area according to display modes, thereby allowing a user to perform an operation easily and intuitively.04-07-2011

Tatsuya Higuchi, Osaka JP

Patent application numberDescriptionPublished
20080299873CMP apparatus - The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin.12-04-2008

Toshihiro Higuchi, Osaka JP

Patent application numberDescriptionPublished
20090206430SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A pattern (08-20-2009
20110156192SOLID-STATE IMAGE SENSING DEVICE HAVING A LAYER ON MICROLENS AND METHOD FOR FABRICATING THE SAME - A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.06-30-2011

Patent applications by Toshihiro Higuchi, Osaka JP