| Patent application number | Description | Published |
|---|
| 20090062580 | Method for Producing Cyclic Olefin Compound - Disclosed is a method for producing a cyclic olefin compound having two or more cyclohexene rings per molecule via intramolecular dehydration of an alicyclic alcohol having two or more hydroxylated cyclohexane rings per molecule. The method includes the step (i) of heating the alicyclic alcohol at a temperature of 130° C. to 230° C. and a pressure greater than 20 Torr in an organic solvent in the presence of a dehydration catalyst, to carry out dehydration of the alicyclic alcohol while distilling off by-product water, which dehydration catalyst is liquid or soluble in a liquid reaction mixture under the reaction conditions; and the subsequent step (ii) of heating the resulting reaction mixture at a temperature of 50° C. to 220° C. and a pressure of 200 Torr or less to recover the cyclic olefin compound as a distillate. According to the method, side reactions such as isomerization are suppressed, and high-purity cyclic olefin compounds with less impurities can be simply and efficiently obtained in high yields. | 03-05-2009 |
| 20100249341 | ALICYCLIC DIEPOXY COMPOUND, EPOXY RESIN COMPOSITION COMPRISING THE SAME, AND CURED ARTICLE THEREFROM - Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3′,4′-diepoxybicyclohexyl compound represented by following Formula (1): | 09-30-2010 |
| 20110021722 | COMPOSITION CONTAINING CYCLOALIPHATIC EPOXIDE, POLYOL OLIGOMER, CURING AGENT AND CURING ACCELERATOR - A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors. | 01-27-2011 |
