Patent application number | Description | Published |
20110136321 | METHOD FOR MANUFACTURING LAMINATION TYPE SEMICONDUCTOR INTEGRATED DEVICE - Provided is a method for manufacturing a lamination type semiconductor integrated device that can simultaneously attain grinding force resistance during back side grinding of a semiconductor wafer, heat resistance during anisotropic dry etching and the like, chemical resistance during plating and etching, smooth debonding of a support substrate for processing at the end, and low adherend staining; the method comprises at least a step of back side grinding of a first semiconductor wafer having a device formed on its surface and a step of laminating by electrical bonding the first semiconductor wafer with a second semiconductor wafer having a device formed on its surface, wherein, at the time of back side grinding of the first semiconductor wafer, back of the first semiconductor wafer is ground after surface of formed device on the first semiconductor wafer is bonded to a support substrate for processing by using a pressure-sensitive silicone adhesive. | 06-09-2011 |
20110275768 | NOVEL SILPHENYLENE SKELETON-CONTAINING SILICONE TYPE POLYMER AND METHOD FOR MANUFACTURING THE SAME - There is disclosed a silphenylene skeleton-containing silicone type polymer comprising a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 5,000 to 40,000. There can be a novel silphenylene skeleton-containing silicone type polymer which enables to satisfy both chemical resistance and adhesiveness to a substrate and can be used as a material for a thermosetting resin for forming coatings for protecting substrates, circuits, and interconnections; and a method for manufacturing the same. | 11-10-2011 |
20120108762 | ADHESIVE COMPOSITION, ADHESIVE SHEET, SEMICONDUCTOR APPARATUS PROTECTION MATERIAL, AND SEMICONDUCTOR APPARATUS - A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, | 05-03-2012 |
20120139131 | WAFER MOLD MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The invention provides a wafer mold material for collectively subjecting a wafer having semiconductor devices on a surface thereof to resin molding, wherein the wafer mold material has a resin layer containing a filler and at least any one of an acrylic resin, a silicone resin having an epoxy group, an urethane resin, and a polyimide silicone resin, and the wafer mold material is formed into a film-like shape. There can be a wafer mold material that enables collective molding (wafer molding) with respect to a wafer having semiconductor devices formed thereon, has excellent transference performance with respect to a large-diameter thin-film wafer, can provide a flexible hardened material with low-stress properties, and can be preferably used as a mold material in a wafer level package with less warp of a formed (molded) wafer. | 06-07-2012 |
20120276717 | ORGANOPOLYSILOXANE, TEMPORARY ADHESIVE COMPOSITION CONTAINING ORGANOPOLYSILOXANE, AND METHOD OF PRODUCING THINNED WAFER USING THE SAME - The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III):
| 11-01-2012 |
Patent application number | Description | Published |
20130220687 | WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPORARY ADHESIVE MATERIAL, AND METHOD FOR MANUFACTURING THIN WAFER - Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity. | 08-29-2013 |
20130302983 | TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSING USING THE SAME, WAFER PROCESSED BODY, AND METHOD FOR PRODUCING THIN WAFER - The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R | 11-14-2013 |
20140106137 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHERING MATERIAL FOR PROCESSING WAFER, AND MANUFACTURING METHOD OF THIN WAFER - A wafer processing laminate, a wafer processing member, a temporary adhering material for processing wafer, and a method for manufacturing a thin wafer using the same. The wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed. The temporary adhesive material layer includes a first temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A) releasably adhered on a surface of the wafer, a second temporary adhesive layer of a radiation curable polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A′) laminated on the second temporary adhesive layer and releasably adhered to the support. | 04-17-2014 |
20140154868 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHERING MATERIAL FOR PROCESSING WAFER, AND MANUFACTURING METHOD OF THIN WAFER - A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer. | 06-05-2014 |