Patent application number | Description | Published |
20080298745 | OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME - An optical module, including: an optical transmission line holding member having an optical semiconductor element mounting surface, an electrical interconnection layer formed on the mounting surface, and an optical transmission line guide hole with an opening on the mounting surface; an optical transmission line inserted into the guide hole; an optical semiconductor element, mounted on the mounting surface, having an electrode and a light-receiving or light-emitting area on a surface facing the mounting surface; an electrical connection portion which electrically connects the electrode and the interconnection layer, formed between the semiconductor element and the mounting surface; a first resin filling a space around the connection portion between the semiconductor element and the mounting surface; and a second resin filling a gap between the optical transmission line and the semiconductor element, with a property different from that of the first resin, and a method of manufacturing the module. | 12-04-2008 |
20090040739 | LSI PACKAGE WITH INTERFACE MODULE AND INTERFACE MODULE - An LSI package includes an interface module having first and second surfaces and including a wiring board having a first through hole, a driver selectively provided on the second surface, a transmission line connected to the driver, and a first terminal formed on the second surface and connected to the driver, an interposer having a third surface facing the second surface and a fourth surface, and including a signal processor and a second terminal provided on the third surface, a third terminal provided on the fourth surface and a second through hole, the third surface facing the second surface except a region where the driver portion is provided. The interposer is arranged so that the first through hole matches with the second through hole, and a movable guide pin is inserted into the first and second through holes to position the interface module and the interposer. | 02-12-2009 |
20090080480 | LASER-INDUCED OPTICAL WIRING APPARATUS - A laser-induced optical wiring apparatus includes a substrate, first and second light-reflecting members provided on the substrate separately from each other, an optical waveguide provided on the substrate for optically coupling the first and second light-reflecting members to form an optical resonator, a first optical gain member provided across the optical waveguide and forming a laser oscillator along with the first and second light-reflecting members, and a second optical gain member provided across the optical waveguide separately from the first optical gain member, and forming another laser oscillator along with the first and second light-reflecting members. | 03-26-2009 |
20090103864 | OPTICAL TRANSMISSION LINE HOLDING MEMBER, OPTICAL MODULE AND MOUNTING METHOD THEREOF - An optical transmission line holding member includes a main body that mechanically positions and holds an optical transmission line, and an electrical interconnection used to mount an optical element. The main body includes a holding hole which opens in one surface of the main body and is used to mechanically position and hold the optical transmission line, an guide hole which opens in another surface of the main body, has a diameter larger than that of the holding hole and is coaxially aligned with the holding hole, and a resin storage groove provided in the guide hole. The electrical interconnection is formed on the surface in which the holding hole opens. | 04-23-2009 |
20090185803 | OPTICAL MULTIPLEXER/DEMULTIPLEXER - An optical multiplexer/demultiplexer comprises one light guide main line which guides lights of a plurality of wavelengths, and two or more microring optical resonators directly optically coupled to the one light guide main line. The two or more microring optical resonators are arranged in any two of layers higher than, level with, and lower than a plane where the one light guide main line is disposed, and/or the two or more microring optical resonators are arranged on both sides of the one light guide main line in a light guide direction. | 07-23-2009 |
20090310978 | COMPLEMENTARY OPTICAL WIRING SYSTEM - A complementary optical wiring system has a transmitting circuit configured to combine a delayed signal obtained by delaying a digital electric input signal by a time shorter than a minimum pulse width of the digital electric input signal with the digital electric input signal to generate a first electric pulse signal synchronized with a rising edge of the digital electric input signal and a second electric pulse signal synchronized with a falling edge of the digital electric input signal, a first light-emitting element configured to convert the first electric pulse signal to a first optical signal, a second light-emitting element configured to convert the second electric pulse signal to a second optical signal, a first optical transmission path configured to transmit the first optical signal, a second optical transmission path configured to transmit the second optical signal, a first light-receiving element configured to convert the first optical signal transmitted through the first optical transmission path to a third electric pulse signal, a second light-receiving element configured to convert the second optical signal transmitted through the second optical transmission path to a fourth electric pulse signal and a receiving circuit configured to generate a digital electric output signal corresponding to the digital electric input signal in synchronization with the third and fourth electric pulse signals. | 12-17-2009 |
20100021180 | COMPLEMENTARY OPTICAL WIRING APPARATUS - A complementary optical wiring apparatus includes an optical transmitter, first and second optical transmission lines, and an optical receiver, the optical transmitter has a first operation mode of transmitting an optical signal synchronized with the rising of one electrical input signal via the first optical transmission line and transmitting an optical signal synchronized with the falling thereof via the second optical transmission line, and a second operation mode of transmitting an optical signal synchronized with the rising and falling of one of two electrical input signals via the first optical transmission line and transmitting an optical signal synchronized with the rising and falling of the other electrical input signal via the second optical transmission line, and is operated after one of the two operation modes is selected. | 01-28-2010 |
20100098129 | LASER-INDUCED OPTICAL WIRING APPARATUS - A laser-induced optical wiring apparatus is provided wherein optical wiring is realized by digital operations of a laser oscillator. The apparatus includes optical ring resonator formed of a loop-shaped optical waveguide on substrate. At least two optical gain sections are provided on the optical ring resonator. When each optical gain section is activated, a laser oscillator including the optical ring resonator and optical gain sections is enabled to oscillate. In this state, the gain of at least one of the optical gain sections is changed in accordance with an input signal, thereby changing the optical route gain of the optical ring resonator to change the oscillation state of the laser oscillator. A change in the laser oscillation state is detected by the optical gain section other than the at least one optical gain section, whereby an output signal is acquired. | 04-22-2010 |
20100142976 | TRANSMITTING CIRCUIT AND COMPLEMENTARY OPTICAL WIRING SYSTEM - A transmitting circuit has a first transmitter configured to generate a first electric pulse signal in synchronization with a rising edge of a digital electric input signal, a second transmitter configured to generate a second electric pulse signal in synchronization with a falling edge of the digital electric input signal, a first variable impedance circuit configured to supply a bias current to a first light-emitting element only for a predetermined period before the first light-emitting element for converting the first electric pulse signal into a first light signal is supplied with the first electric pulse signal, and a second variable impedance circuit configured to supply a bias current to a second light-emitting element only for a predetermined period before the second light-emitting element for converting the second electric pulse signal into a second light signal is supplied with the second electric pulse signal. | 06-10-2010 |
20100150552 | OPTICAL/ELECTRICAL COMPOSITE CABLE, OPTICAL/ELECTRICAL COMPOSITE CABLE CONNECTION DEVICE AND OPTICAL/ELECTRICAL COMPOSITE CABLE DRIVE METHOD - An optical/electrical composite cable in which a first connector having an optical transmission unit is connected to a second connector having an optical reception unit via an electrical wire and an optical wiring line includes a state detection unit that detects a connection state of the first connector, a connection state of the second connector, a power supply state of a transmission-side electronic device connected to the first connector and a power supply state of a reception-side electronic device connected to the second connector, and an electrical power supply control unit that controls supply of electrical power to the optical transmission unit and optical reception unit according to the detected states. | 06-17-2010 |
20100150573 | OPTICAL/ELECTRICAL COMPOSITE CABLE - An optical/electrical composite cable in which a first connector having an optical transmission unit is connected to a second connector having an optical reception unit via an electrical wire and optical wiring line is provided. The optical transmission unit and optical reception unit are driven by electrical power supplied from an external electronic device. A detection unit that detects a removal/attachment operation of at least one of the first and second connectors and an interruption unit that interrupts supply of electrical power to the optical transmission unit and optical reception unit when the removal/attachment operation is detected by the detection unit are provided. | 06-17-2010 |
20100166407 | LIGHTING DEVICE, IMAGE PICKUP APPARATUS AND PORTABLE TERMINAL UNIT - A lighting device including a substrate ( | 07-01-2010 |
20100244170 | PHOTO DETECTOR AND OPTICALLY INTERCONNECTED LSI - A photo detector having an electrically conductive thin film and a light-receiving unit. A coupling periodic structure is provided on a surface of the film and converts incidence light to surface plasmon. The coupling periodic structure has an opening that penetrates the obverse and reverse surfaces of the thin film. The light-receiving unit is provided at one end of the opening in the surface that is opposite to the surface on which the coupling periodic structure is provided. The opening is shaped like a slit and is broader than half (½) the wavelength of the surface plasmon in a direction that intersects at right angles with a polarization direction of the incidence light and is narrower than half (½) the wavelength of the surface plasmon in a direction parallel to the polarization direction. | 09-30-2010 |
20100247030 | OPTOELECTRONIC WIRING BOARD INCLUDING OPTICAL WIRING AND ELECTRICAL WIRING AND METHOD OF MANUFACTURING OPTOELECTRONIC WIRING DEVICE USING THE SAME - An optoelectronic wiring board includes an optical wiring, an electrical wiring, an optical input/output portion, a dummy optical input portion, and a dummy optical waveguide. The optical wiring includes an optical waveguide. The electrical wiring includes an electrically conductive material. The optical input/output portion transmits and detects optical signal with and from the optical waveguide, an optical semiconductor device or an external light guide being disposed on the optoelectronic wiring board. The dummy optical input portion provided adjacent to the optical input/output portion. The dummy optical waveguide is connected to the dummy optical input portion and has an optical end portion which is provided at an end opposite to the dummy optical input portion and absorbs or scatters light which is incident on the dummy optical input portion. | 09-30-2010 |
20100303424 | OPTICAL WIRING CABLE - An optical wiring cable that transmits a light signal includes a first connector including a light transmission portion, a second connector including a light reception portion, and an optical wire provided between the first and second connectors to optically couple the light transmission portion and light reception portion. Further, a heat release wire is provided along the optical wire and thermally coupled with the light transmission portion and light reception portion to release heat generated from the light transmission portion and light reception portion. | 12-02-2010 |
20100316335 | OPTOELECTRONIC INTERCONNECTION FILM, AND OPTOELECTRONIC INTERCONNECTION MODULE - According to an aspect of the present invention, there is provided an optoelectronic interconnection film: including an interconnection portion including: an optical waveguide core having at least two optical input/output portions; an optical waveguide cladding formed along the optical waveguide core; and an electrical wiring formed along the optical waveguide core; and a reinforcing substrate partially attached to the interconnection portion correspondingly with one of the optical input/output portions, wherein the interconnection portion includes: a rigid region to which the reinforcing substrate is attached; and a flexible region to which the reinforcing substrate is not attached, and wherein, in the flexible region, the optical waveguide core is arranged to not across a boundary between a region where the electrical wiring is provided and a region where the electrical wiring is not provided. | 12-16-2010 |
20110026887 | MOUNTING STRUCTURE - In a mounting structure formed by mounting an optoelectronic interconnection module on a mounting board, an optical semiconductor device, electrical wires and electrical connection terminals are provided on the main surface of an optoelectronic interconnection board having flexibility on the optoelectronic interconnection module and an optical interconnection path is provided at the optoelectronic interconnection board. Electrical wires and electrical connection terminals are provided on the main surface of the mounting board. A conductive connection member is disposed between the electrical connection terminals on the optoelectronic interconnection module side and the electrical connection terminals on the mounting board side. A heat release member that releases heat of the optical semiconductor device to the mounting board side is disposed between the optical semiconductor device and the mounting board. | 02-03-2011 |
20110064369 | FLEXIBLE WIRING BOARD, MANUFACTURING METHOD THEREOF AND FLEXIBLE WIRING DEVICE - A flexible wiring board including a pair of end regions provided in portions of a flexible wiring board on which a plurality of wires are arranged in parallel in one direction and disposed separately in a wiring lengthwise direction, a wiring region configured in another portion of the wiring board and sandwiched between the end regions, a plurality of flexible wiring fins which is divided by at least one slit that connects the end regions in the wiring region, and a flexible wiring bundle by bundling at least part of the plurality of flexible wiring fins. | 03-17-2011 |
20110081118 | OPTOELECTRONIC INTERCONNECTION MODULE - An optoelectronic interconnection module capable of performing optical signal transmission and electrical signal transmission, including a flexible optoelectronic interconnection board including an optical interconnection path, electrical wires and electrical connection terminals used for electrically connecting the electrical wires to an exterior at an end portion thereof, an optical semiconductor device mounted on a portion near one-end of the flexible optoelectronic interconnection board, and a bend portion provided in a lengthwise direction of the flexible optoelectronic interconnection board in parallel to a mounting region of the optical semiconductor device. | 04-07-2011 |
20110097034 | MOUNTING STRUCTURE - A mounting structure includes an optoelectronic interconnection module that includes electrical interconnection lines, optical interconnection lines, optical semiconductor device and electrical connection terminals, a mounting board that includes electrical interconnection lines and electrical connection terminals on a main surface and on which the optoelectronic interconnection module is mounted, and a connection member that electrically connects, adheres and fixes the electrical connection terminals and the electrical connection terminals. The optoelectronic interconnection module comprises a circuit area on which the optical semiconductor device is mounted and electrical connection terminals are formed and an interconnection area that is formed in a region other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed, and the electrical connection terminals are formed on the interconnection area side rather than the optical semiconductor device. | 04-28-2011 |
20110103422 | LASER-INDUCED OPTICAL WIRING APPARATUS - A laser-induced optical wiring apparatus includes a substrate, first and second light-reflecting members provided on the substrate separately from each other, an optical waveguide provided on the substrate for optically coupling the first and second light-reflecting members to form an optical resonator, a first optical gain member provided across the optical waveguide and forming a laser oscillator along with the first and second light-reflecting members, and a second optical gain member provided across the optical waveguide separately from the first optical gain member, and forming another laser oscillator along with the first and second light-reflecting members. | 05-05-2011 |
20110150401 | OPTICAL WIRING CABLE - According to one embodiment, an optical wiring cable including a first optical interconnection paths, a first optical transmission unit incorporated in a first connector, and configured to transmit an optical signal to the first optical interconnection paths, a first optical reception unit incorporated in a second connector, and configured to receive an optical signal from the first optical interconnection paths, a second optical interconnection paths, a second optical transmission unit incorporated in the second connector, and configured to transmit an optical signal to the second optical interconnection paths, a second optical reception unit incorporated in the first connector, and configured to receive an optical signal from the second optical interconnection paths, and a control unit configured to detect a combination of electronic apparatuses to which the first and the second connector are to be connected, and control power supply to the optical transmission units and the optical reception units. | 06-23-2011 |
20110188816 | FLEXIBLE OPTOELECTRONIC INTERCONNECTION MODULE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a flexible optoelectronic interconnection module according to one embodiment includes a flexible electrical wiring board including an electrical wire and first electrical connection terminal, and a flexible optoelectronic interconnection board including an optical interconnection path, electrical wire, and second electrical connection terminal and mounted on a partial region of the flexible electrical wiring board. On the flexible optoelectronic interconnection board, an optical semiconductor element electrically connected to the electrical wire of the interconnection board and optically coupled with the optical interconnection path is mounted. The first and second electrical connection terminals are electrically connected by a conductive connecting member. | 08-04-2011 |
20120008903 | OPTICAL TRANSMISSION LINE HOLDING MEMBER AND AN OPTICAL MODULE - According to one embodiment, an optical transmission line holding member includes a holding member body, a plurality of holding holes, a plurality of electrical interconnections, and a plurality of grooves. The holding member body includes an optical semiconductor element mounting surface and an opposite surface thereof and configured to hold optical transmission lines. The holding holes are formed to penetrate between the optical semiconductor element mounting surface of the holding member body and the opposite surface thereof, the holding holes having an opening on the optical semiconductor element mounting surface side. The electrical interconnections are provided on a part of the optical semiconductor element mounting surface and electrically connected to the optical semiconductor element. The grooves are provided adjacent to the openings of the holding holes in a part of a region of the optical semiconductor element mounting surface except a region in which the electrical interconnections. | 01-12-2012 |
20120045168 | FLEXIBLE OPTOELECTRONIC INTERCONNECTION BOARD AND FLEXIBLE OPTOELECTRONIC INTERCONNECTION MODULE - According to one embodiment, a flexible optoelectronic interconnection board includes a flexible electrical wiring board having electrical wires, reinforcing boards mounted on the flexible electrical wiring board and having flexibility lower than that of the flexible electrical wiring board, and a flexible optical interconnection board mounted on the flexible electrical wiring board and having optical interconnection lines. The flexible electrical wiring board includes a fixed portion whose flexibility is lowered by mounting the reinforcing boards and a movable portion other than the fixed portion and the flexible optical interconnection board is fixed on the fixed portions. | 02-23-2012 |
20120236579 | FLEXIBLE WIRING MODULE AND FLEXIBLE WIRING DEVICE - According to one embodiment, a flexible wiring module includes a flexible wiring board including a plurality of electrical wirings, a through slit configured to divide the wiring board into a plurality of fins, and a bundling region configured to bundle the plurality of wiring fins. The through slit divides a wiring region of the wiring board into a plurality of wiring fins including a first wiring fin and a second wiring fin having electrical wiring width larger than that of the first wiring fin. The bundling region bundles a laminated portion having at least a portion of the wiring fins laminated in a thickness direction and bundles the fins to cause the second wiring fin to be arranged on at least one of the upper and lower layers of the first wiring fin. | 09-20-2012 |
20120241599 | VOLTAGE OUTPUT CIRCUIT, CONNECTOR MODULE, AND ACTIVE CABLE - According to one embodiment, a circuit comprises a first resistor configured to have one end to which a first voltage is input and the other end which outputs a second voltage and a first amplifier configured to have an inverting input connected to the other end of the first resistor and a noninverting input to which a third voltage is input. The circuit further comprises a first capacitor configured to have one end to which an output of the first amplifier is input and the other end to which the other end of the first resistor is connected. An output of the first amplifier or an output of a second amplifier connected to the other end of the first resistor is a fourth voltage. In the circuit, the first resistor and a mirror capacitance composed of the first capacitor and the first amplifier constitute a low-pass filter. | 09-27-2012 |
20120243835 | OPTICAL COUPLING ELEMENT AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an optical coupling element comprises an optical waveguide, a ferrule provided with a holding hole which holds the optical waveguide, electrical read frame formed on the element mounting surface of the ferrule, an optical semiconductor element which is mounted on the element mounting surface of the ferrule and connected to the electrical read frame, and a transparent adhesive which fills the gap between the optical semiconductor element and the optical waveguide. At least one side of the optical semiconductor element partially falls within a region obtained by extending the holding hole in the ferrule toward the optical semiconductor element. | 09-27-2012 |
20120275742 | OPTICALLY-COUPLED DEVICE AND METHOD OF FIXING THE SAME - According to one embodiment, an optically-coupled device includes a substrate and an optical fiber. The substrate is inclined from a first direction has a first width including a first surface optical device. The optical fiber is arranged in a second direction An end face has a second angle with respect to the first direction and has a radius of a second length. An outer edge of the end face of the optical fiber is it chamfered. A difference between the first angle and the second angle is not smaller than the difference with which the first surface optical device is protected from the end face of the optical fiber. | 11-01-2012 |
20130032381 | FLEXIBLE WIRING MODULE AND FLEXIBLE WIRING DEVICE - According to one embodiment, a flexible wiring module includes a flexible wiring board which comprises electric wiring lines and an insulating layer that covers the surfaces of the electric wiring lines and which has a pair of end areas separate from each other in a wiring length direction and a wiring area sandwiched between the end areas. At least one through slit is made in the wiring area so as to connect the end areas, thereby dividing the wiring area into wiring fins. A stacked part where at least a part of the wiring fins are stacked in a thickness direction of the wiring fins is bundled together with a conductive band to form a wire-bundle area. In the wire-bundle area, the electric wiring line of at least one of the wiring fins is exposed and direct contact with the band. | 02-07-2013 |
20130064511 | OPTICAL MODULE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an optical module includes an optical fiber, a ferrule which has a guide hole, a planar photonic device which is mounted on the ferrule, and a sleeve which includes a holding part for holding the optical fiber and a bumping part for making contact with one end of the ferrule and to which the optical fiber and the ferrule are fixed. The optical fiber is fixed to the sleeve in such a manner that the optical fiber protrudes from one end of the sleeve and has an end face formed using one end of the sleeve as a reference. The optical fiber with the formed end face is inserted in the guide hole in the ferrule and the ferrule is fixed to the sleeve with one end of the ferrule in contact with the bumping part of the sleeve. | 03-14-2013 |
20130108210 | FLEXIBLE OPTOELECTRONIC WIRING MODULE | 05-02-2013 |
20130163995 | OPTICAL TRANSMITTER/RECEIVER CIRCUIT DEVICE AND RECEIVER CIRCUIT - According to one embodiment, an optical transmitter/receiver circuit device includes a transmitter circuit including a transition time adjusting circuit to obtain a second voltage signal from a first voltage signal and a voltage-current converter circuit that converts the second voltage signal to a first current signal, a light-emitting element to convert the first current signal to an optical signal, a light-receiving element to convert the optical signal to a second current signal, and a receiver circuit including a current-voltage converter circuit that converts the second current signal to a third voltage signal, a pulse generation circuit to generate rise and fall pulse from the third voltage signal and a decoder circuit that generates a fourth voltage signal in synchronism with the pulse. | 06-27-2013 |
20140042463 | OPTOELECTRONIC INTEGRATED PACKAGE MODULE - According to one embodiment, there is provided an optoelectronic integrated package module including a silicon interposer that has an electrical interconnection and an optical waveguide, and formed on a silicon substrate, an optical semiconductor element formed in the silicon interposer, and electrically connected to the electrical interconnection and optically coupled to the optical waveguide, an electrical circuit element formed in the silicon interposer, and electrically connected to the optical semiconductor element, and a semiconductor integrated circuit chip mounted on the silicon interposer, and electrically connected to the electrical circuit element. The semiconductor integrated circuit chip transmits an electrical signal to the optical semiconductor element via the electrical circuit element or receives an electrical signal from the optical semiconductor element via the electrical circuit element. | 02-13-2014 |
20140044389 | OPTOELECTRONIC INTEGRATED PACKAGE MODULE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, there is provided an optoelectronic integrated package module including a silicon interposer, an optical semiconductor element formed in the silicon interposer, and a semiconductor integrated circuit chip module including a first semiconductor integrated circuit chip including a logic circuit and mounted on a first principal surface and a second semiconductor integrated circuit chip having a second principal surface side mounted on the silicon interposer. The first and second semiconductor integrated circuit chips are electrically connected to each other via the via interconnections formed inside the second semiconductor integrated circuit chip from the first principal surface. The first or second semiconductor integrated circuit chip receives an electrical signal obtained via the via interconnection by means of the unterminated reception circuit. | 02-13-2014 |
20140252505 | SEMICONDUCTOR ANALYSIS MICROCHIP AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a semiconductor analysis microchip configured to detect a fine particle in a sample liquid, including a semiconductor substrate, a first flow channel provided in the semiconductor substrate, to which the sample liquid is introduced, and a pore provided in the first flow channel and configured to pass the fine particle in the sample liquid. | 09-11-2014 |
20140255911 | SAMPLE DETECTION APPARATUS AND DETECTION METHOD - According to one embodiment, a sample detection apparatus including an insulating partition to divide a first and a second region, a pore formed in the partition, a first electrode arranged in the first region, a second electrode arranged in the second region, a power source configured to apply electrical current between the first and second electrode in a state in which a reagent containing a capture substance to be bound to a target and a tag particle bound to the capture substance is introduced into the first region together with a sample, and an electrolyte solution is introduced into the second region, a measurement unit configured to observe a change in a conductive state, and a detection unit to detect presence/absence of the target in the sample based on an observation result. | 09-11-2014 |
20140256028 | SEMICONDUCTOR MICRO-ANALYSIS CHIP AND MANUFACTURING METHOD THEREOF - According to one embodiment, a semiconductor micro-analysis chip for detecting fine particles in sample liquid includes a semiconductor substrate, a first flow channel that is formed in the semiconductor substrate and into which the sample liquid is introduced, and a plurality of columnar structures fully arranged in the first flow channel at regulation distance. | 09-11-2014 |
20140256031 | SEMICONDUCTOR MICRO-ANALYSIS CHIP AND SAMPLE LIQUID FLOWING METHOD - According to one embodiment, a semiconductor micro-analysis chip for detecting fine particles in sample liquid includes a semiconductor substrate, a flow channel formed in the semiconductor substrate and having a sample liquid inlet and sample liquid outlet at end portions thereof, and an absorber provided on at least part of the sample outlet of the flow channel to absorb the sample liquid. | 09-11-2014 |
20150041316 | SEMICONDUCTOR MICRO-ANALYSIS CHIP AND METHOD OF MANUFACTURING THE SAME - One of embodiments is a semiconductor micro-analysis chip for detecting particles in a sample liquid. The chip comprises a semiconductor substrate, a first flow channel provided on the semiconductor substrate to allow the sample liquid to flow therein, a second flow channel provided at a different position from the first flow channel of the semiconductor substrate to allow the sample liquid or an electrolyte solution to flow therein, a contact portion where a portion of the first flow channel and a portion of the second flow channel abut each other or intersect one another with a partition being arranged between the flow channels, and a fine hole provided on the partition of the contact portion to allow the particles to pass therethrough. | 02-12-2015 |
20150069437 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a sealing member configured to cover a lower surface of the semiconductor layer and a side surface of the semiconductor layer to protrude to be higher than an upper surface of the semiconductor layer at a side of the semiconductor layer, a fluorescer layer provided above the semiconductor layer and the sealing member, and an insulating film provided between the sealing member and the semiconductor layer and between the sealing member and the fluorescer layer. A corner of a protruding portion of the sealing member is rounded. | 03-12-2015 |