| Patent application number | Description | Published |
|---|
| 20090040513 | PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD - A pattern inspection apparatus includes a light source configured to emit a pulsed light, a stage on which an inspection target workpiece is placed, a sensor, including a plurality of light receiving elements two-dimensionally arrayed, configured to capture a pattern image in a two-dimensional region of the inspection target workpiece which is irradiated with the pulsed light, by using the plurality of light receiving elements, and a comparing unit configured to compare data of the pattern image with predetermined reference pattern image data, wherein the stage moves to be shifted by a number of pixels, being the number of natural number times one pixel, between pulses of the pulsed light. | 02-12-2009 |
| 20090087082 | PATTERN INSPECTION APPARATUS AND METHOD - A pattern inspection apparatus includes a stage configured to mount a target workpiece to be inspected thereon, a sensor configured to include a plurality of light receiving elements arrayed in a second direction orthogonal to a first direction which moves relatively to the stage, and to capture optical images of the target workpiece by using the plurality of light receiving elements, an accumulation unit configured to accumulate each pixel data of the optical images overlappingly captured by the sensor at positions shifted each other in the second direction by a pixel unit, for each pixel, and a comparison unit configured to compare the each pixel data accumulated for each pixel with predetermined reference data. | 04-02-2009 |
| 20090129664 | PATTERN INSPECTION APPARATUS AND METHOD - A pattern inspection apparatus includes a stage configured to mount thereon a target workpiece to be inspected where patterns are formed, at least one sensor configured to move relatively to the stage and capture optical images of the target workpiece to be inspected, a first comparing unit configured to compare first pixel data of an optical image captured by one of the at least one sensor with first reference data at a position corresponding to a position of the first pixel data, and a second comparing unit configured to compare second pixel data of an optical image captured by one of the at least one sensor at a position shifted by a sub-pixel unit from the position where the optical image of the first pixel data is captured, with second reference data at a position corresponding to the position of the second pixel data. | 05-21-2009 |
| 20090284591 | RETICLE DEFECT INSPECTION APPARATUS AND RETICLE DEFECT INSPECTION METHOD - The present invention provides a reticle defect inspection method and a reticle defect inspection apparatus capable of calibrating the offset and gain of a sensor amplifier using a product reticle even though black and white regions each sufficiently wider than a TDI sensor imaging area do not exist in the product reticle. An output of each pixel of the TDI sensor is amplified by the sensor amplifier. A bottom value of the amplified amount-of-light signal of each pixel is stored by bottom value storing means of offset/gain calibrating means, and a peak value thereof is stored by peak value storing means. The offset of each pixel is calculated by offset calculating means based on the bottom value of each pixel. The gain of each pixel is calculated by gain calculating means based on the offset of each pixel and the peak value of each pixel. The calculated offset and gain of each pixel are stored in a register and thereby the offset and gain of the sensor amplifier are calibrated. | 11-19-2009 |
| 20100060890 | APPARATUS AND METHOD FOR PATTERN INSPECTION - A pattern inspection apparatus includes a pulsed light source configured to emit pulsed light; a stage configured to mount thereon an inspection target object with a pattern formed thereon; a time delay integration (TDI) sensor configured to detect, a plurality of times with a time delay, each pixel value of an optical image of the inspection target object, wherein the optical image is acquired by emitting the pulsed light onto the inspection target object, and to integrate a detected each pixel value for each pixel of the optical image; a light quantity sensor configured to detect a light quantity of the pulsed light after emitting the pulsed light onto the inspection target object; a light quantity measurement circuit configured to input the light quantity detected by the light quantity sensor, and to measure a light quantity of each pulse while being synchronized with a period of the pulsed light; a correction unit configured to input the light quantity of each pulse and an integrated pixel value output from the TDI sensor, and to correct the integrated pixel value output from the TDI sensor, for each pixel of the optical image, using a total light quantity of the light quantity of corresponding each pulse; and an inspection unit configured to inspect whether there is a defect of the pattern, using the integrated pixel value corrected. | 03-11-2010 |
| 20110044528 | INSPECTION SYSTEM - The entire surface of a photomask | 02-24-2011 |
| 20110044529 | INSPECTION SYSTEM AND INSPECTION METHOD - A control computer | 02-24-2011 |
| 20110176719 | INSPECTION SYSTEM AND METHOD - Optical image data of a mask is acquired. Reference image data associated with the optical images is created from design pattern data. Regional image data that includes pixel values denoted by multi-valued resolution based on importance level information of the patterns is created from region data including at least one portion of the patterns defined in the design pattern data. Defect determination is conducted on a pixel-by-pixel basis by comparing the optical image data with the reference image data, by means of either a plurality of threshold values determined by each pixel value within the regional image data or a plurality of defect determination methods. Image data of a section whose Mask Error Enhancement Factor (MEEF) is equal to or greater than a predetermined value is created from the region data including at least one portion of the patterns defined in the design pattern data. | 07-21-2011 |
