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Hideo Mukai, Tokyo JP

Hideo Mukai, Tokyo JP

Patent application numberDescriptionPublished
20090109728RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including memory cells arranged, the memory cell having a stable state with a high resistance value and storing in a non-volatile manner such multi-level data that at least three resistance values, R04-30-2009
20090174032RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a semiconductor substrate; a three dimensional cell array formed by a plurality of unit cell array blocks of two dimensional arrangement on the semiconductor substrate, the unit cell array block being formed by stacking a plurality of unit cell arrays including a first wiring, a second wiring crossing with the first wiring, and a variable resistance element connected at an intersection of the both wirings; a reading/writing/driving circuit formed on the semiconductor substrate under the three dimensional cell array; a first via region which is arranged in an end portion of the unit cell array block, and in which a via wiring for connecting the first wiring in each layer to the reading/writing/driving circuit is formed; and a second via region which is arranged in an end portion of the unit cell array block, and in which a via wiring for connecting the second wiring in each layer to the reading/writing/driving circuit is formed. When the first wiring is longer than the second wiring, the number of via arrangements in the first via region is set larger than that in the second via region.07-09-2009
20090207647NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device comprises: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire up to a standby voltage larger than a reference voltage prior to a set operation for programming only a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying a program voltage necessary for programming of the selected variable resistor based on the reference voltage to the selected first wire and applying a control voltage which prevents the rectifying device from turning ON based on the program voltage to the non-selected second wire.08-20-2009
20090219750NONVOLATILE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - A nonvolatile memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistive element; a line selector circuit operative to decode an address signal to select the first and second lines; and a control circuit operative to execute control on at least one of data erase, write and read for the memory cell connected between the first and second lines selected at the line selector circuit. The control circuit executes control based on one parameter selected among a plurality of parameters. The line selector circuit specifies the parameter based on a first address portion in the address signal and selects the first and second lines based on a second address portion in the address signal.09-03-2009
20090230434SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a semiconductor substrate; a memory block formed on the semiconductor substrate and including plural stacked cell array layers of cell arrays each comprising a plurality of first lines, a plurality of second lines crossing the plurality of first lines, and memory cells connected at intersections of the first and second lines between both lines; and a plurality of contacts extending in the stack direction of the cell array layers and connecting the first lines in the cell arrays with diffusion regions formed on the semiconductor substrate. A certain one of the cell array layers is smaller in the number of the first lines divided and the number of contacts connected than the cell array layers in a lower layer located closer to the semiconductor substrate than the certain one.09-17-2009
20090237979SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY SYSTEM - A semiconduct or memory device comprises a memory cell array including a plurality of memory cells arranged at intersections of word lines and bit lines; a read/write circuit operative to execute data read/write to the memory cell; and an operational circuit operative to compare certain length data read out by the read/write circuit from plural ones of the memory cells with certain length data to be written in the plural memory cells to make a decision, and create a flag representing the decision result. The read/write circuit inverts each bit in the certain length data to be written in the memory cells in accordance with the flag, and writes only rewrite-intended data of the certain length data and the flag. The read/write circuit reads the certain length data together with the flag corresponding thereto, and inverts each bit in the certain length data in accordance with the flag.09-24-2009
20100097832NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile-semiconductor-memory-device including a cell array having a plurality of MATs (unit-cell-array) disposed in a matrix, the MATs each include a plurality of first lines, a plurality of second lines crossing the first lines, and memory cells being connected between the first and second lines. The device further includes a first and second drive circuit selecting the first and second lines connected to the memory cells of each MAT that are accessed, and driving the selected first and second lines to write or read data. The memory cells form a page by being connected to each first line selected from the MATs. The device also includes a data latch latching the write or the read data in units of pages, where the first and second drive circuit drive the first and second lines multiple times to write or read data for one page in and out of the cell array.04-22-2010
20100097858THREE-DIMENSIONALLY STACKED NONVOLATILE SEMICONDUCTOR MEMORY - A three-dimensionally stacked nonvolatile semiconductor memory of an aspect of the present invention including conductive layers stacked on a semiconductor substrate in such a manner as to be insulated from one another, a bit line which is disposed on the stacked conductive layers, a semiconductor column which extends through the stacked conductive layers, word lines for which the stacked conductive layers except for the uppermost and lowermost conductive layers are used and which have a plate-like planar shape, memory cells provided at intersections of the word lines and the semiconductor column, a register circuit which has information to supply a potential suitable for each of the word lines, and a potential control circuit which reads the information retained in the register circuit in accordance with an input address signal of a word line and which supplies a potential suitable for the word line corresponding to the address signal.04-22-2010

Patent applications by Hideo Mukai, Tokyo JP