| Patent application number | Description | Published |
|---|
| 20090009976 | MEMORY CARD - Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board. | 01-08-2009 |
| 20090040734 | SEMICONDUCTOR MEMORY MODULE INCORPORATING ANTENNA - The semiconductor memory module incorporating antenna includes a wiring board ( | 02-12-2009 |
| 20090051606 | ELECTRONIC CIRCUIT MODULE WITH BUILT-IN ANTENNA AND METHOD FOR MANUFACTURING THE SAME - An electronic circuit module with a built-in antenna ( | 02-26-2009 |
| 20090166064 | CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME - The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component. | 07-02-2009 |
| 20090173795 | CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME - Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard. | 07-09-2009 |
| 20090267214 | ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - The electronic circuit device of the present invention includes at least one semiconductor element, a plurality of external connection terminals, a connecting conductor for electrically connecting semiconductor element and external connection terminals, and an insulating resin for covering the semiconductor element and supporting the connecting conductor integrally, in which the semiconductor element is buried in the insulating resin, and the terminal surface of the external connection terminals is exposed from the insulating resin. | 10-29-2009 |
| 20100084762 | MEMORY CARD - Memory card ( | 04-08-2010 |
| 20100157550 | MEMORY CARD AND MEMORY CARD MANUFACTURING METHOD - A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip. | 06-24-2010 |
| 20100165587 | MEMORY CARD AND METHOD FOR MANUFACTURING THE SAME - A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin. | 07-01-2010 |
| 20100193927 | MEMORY CARD AND METHOD FOR MANUFACTURING MEMORY CARD - A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board. | 08-05-2010 |
