Patent application number | Description | Published |
20090151998 | ELECTROMAGNETIC WAVE SHIELDING WIRING CIRCUIT FORMING METHOD AND ELECTROMAGNETIC WAVE SHIELDING SHEET - The electromagnetic wave shielding wiring circuit forming method of the present invention comprises the steps of: preparing a fine copper particle dispersion, by dispersing fine copper particles into a disperse medium (S) including an organic solvent (A) having an amide-based compound, an organic solvent (B) having a boiling point of 20° C. or higher at an ordinary pressure and having a donor number of 17 or more, an organic solvent (C) having a boiling point exceeding 100° C. at an ordinary pressure and comprising alcohol and/or polyhydric alcohol, and an organic solvent (E) having an amine-based compound, at specific ratios; coating or printing the fine copper particle dispersion onto a substrate, to form a wiring pattern comprising a liquid film of the fine copper particle dispersion; and firing the liquid film of the fine copper particle dispersion, to form a sintered wiring layer. | 06-18-2009 |
20090190312 | Heat transfer film, semiconductor device, and electronic apparatus - A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material. | 07-30-2009 |
20090321689 | METHOD FOR PRODUCING FINE PARTICLE DISPERSION AND FINE PARTICLE DISPERSION - Disclosed is a method for producing a fine particle dispersion such as a dispersion of metal fine particles which is superior in dispersibility and storage stability. Specifically disclosed is a method for producing a fine particle dispersion wherein fine particles of a metal or the like, having a mean particle diameter of between 1 nm and 150 nm for primary particles, are dispersed in an organic solvent. This method for producing a fine particle dispersion is characterized by comprising the steps of: reducing a metal ion by liquid phase reduction in an aqueous solution wherein the metal ion and a polymer dispersing agent are dissolved, thereby forming a fine particle dispersion aqueous solution wherein fine particles having a mean particle diameter of between 1 nm and 150 nm for the primary particles and dispersed with being coated by the polymer dispersing agent (Process 1); adding an aggregation accelerator into the fine particle dispersion aqueous solution, the resulting solution is agitated for agglomerating or precipitating the fine particles, and then the agglomerated or precipitated fine particles are separated from the aqueous solution, thereby obtaining fine particles comprised of one type or not less than two types of a metal, an alloy and a metallic compound (Process 2); and re-dispersing the thus-obtained fine particles into an organic solvent or the like which contains an organic solvent (A) as between 25% and 70% by volume having an amide group, a low boiling point organic solvent (B) as between 5% and 25% by volume having a boiling point of between 20° C. and 100° C. at a normal pressure, and an organic solvent (C) as between 5% and 70% by volume having a boiling point of higher than 100° C. at a normal pressure and comprised of an alcohol and/or a polyhydric alcohol having one or not less than two hydroxyl groups in a molecule thereof (Process 3). | 12-31-2009 |
20100113647 | FINE PARTICLE DISPERSION AND METHOD FOR PRODUCING FINE PARTICLE DISPERSION - Disclosed is a fine particle dispersion which is superior in dispersibility and storage stability. Specifically disclosed is a fine particle dispersion in which a fine particle (P) comprised of one type or not less than two types of a metal, an alloy, and/or a metallic compound, having a mean particle diameter of between 1 nm and 150 nm for primary particles thereof, with being coated at least a part of a surface thereof with a polymer dispersing agent (D), is dispersed in a mixed organic solvent. This fine particle dispersion is characterized in that a weight ratio of (D/P) between the polymer dispersing agent (D) coating the surface of the fine particle (P) and the fine particles (P) in the dispersion is between 0.001 and 10, and the mixed organic solvent is one of: (i) a mixed organic solvent which contains an organic solvent (A) as between 50% and 95% by volume having an amide group, and a low boiling point organic solvent (B) as between 5% and 50% by volume having a boiling point of between 20° C. and 100° C. at a normal pressure; (ii) a mixed organic solvent which contains the organic solvent (A) as between 50% and 95% by volume having the amide group, and an organic solvent (C) as between 5% and 50% by volume having a boiling point of higher than 100° C. at a normal pressure and comprised of an alcohol and/or a polyhydric alcohol having one or not less than two hydroxyl groups in a molecule thereof; or (iii) a mixed organic solvent which contains the organic solvent (A) as between 50% and 94% by volume having the amide group, the low boiling point organic solvent (B) as between 5% and 49% by volume having the boiling point of between 20° C. and 100° C. at the normal pressure, and the organic solvent (C) as between 1% and 45% by volume having the boiling point of higher than 100° C. at the normal pressure and comprised of the alcohol and/or the polyhydric alcohol having the one or not less than the two hydroxyl groups in the molecule thereof. | 05-06-2010 |
20130001774 | ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECTION MEMBER PRODUCED USING THE PASTE - Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150 nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 μm, mixing ratio of (P1/P2) being from 80 to 95 mass % for P1 and from 20 to 5 mass % for P2 (a total of mass % being 100 mass %); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass % for P and from 50 to 15 mass % for D (a total of mass % being 100 mass %). | 01-03-2013 |
20130001775 | CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME - A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm. | 01-03-2013 |
20130266796 | MATERIAL FOR THERMAL BONDING, COATING MATERIAL FOR THERMAL BONDING, COATING, AND ELECTRONIC COMPONENT BONDING METHOD - A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30° C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30° C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm. | 10-10-2013 |
20140127409 | METHOD FOR PRODUCING FINE PARTICLE DISPERSION - In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D). | 05-08-2014 |