Patent application number | Description | Published |
20090097177 | Electrostatic protection circuit - An electrostatic protection circuit includes a first impurity region, a second impurity region, a first electrode, a third impurity region, a fourth impurity region, a second electrode, a fifth impurity region, a sixth impurity region, a third electrode, a gate insulating film, and a fourth electrode. | 04-16-2009 |
20090177415 | Surface Roughness Inspection System - [Problem] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved. | 07-09-2009 |
20090304258 | Visual Inspection System - [Problems] To provide a visual inspection system able to greatly suppress the increase of the amount of processing and detect scratches or other defects of the surface of an object being inspected by a suitable resolution and able to judge the state of formation of films on that object surface. | 12-10-2009 |
20100026997 | APPARATUS AND METHOD FOR INSPECTING EDGE OF SEMICONDUCTOR WAFER - A linear actuator which can make a bed flat in emergency. A linear actuator ( | 02-04-2010 |
20100052045 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - Disclosed herein is a semiconductor device including: a main body transistor region; and an electrostatic discharge protection element region, wherein the main body transistor region includes, a drain region; a drift region; body regions; a gate insulating film; gate electrodes; source regions; channel regions; and potential extraction regions, and the electrostatic discharge protection element region includes, the body regions; the gate insulating film; the gate electrodes; source regions and drain regions; and potential extraction regions, and a gate length in the electrostatic discharge protection element region is equal to or less than twice a channel length in the main body transistor region. | 03-04-2010 |
20100066998 | SURFACE INSPECTION APPARATUS - [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member. | 03-18-2010 |
20100074514 | WAFER CONTAINING CASSETTE INSPECTION DEVICE AND METHOD - To provide a wafer containing cassette inspection device capable of expressing external view attributes such as shapes of respective inspection object portions of water containing cassettes of different types under the same condition without changing imaging conditions for each of the types. A wafer containing cassette inspection device includes an imaging device ( | 03-25-2010 |
20100075442 | SEMICONDUCTOR WAFER PROCESSING APPARATUS, REFERENCE ANGULAR POSITION DETECTION METHOD, AND SEMICONDUCTOR WAFER - [Problems] To provide a semiconductor wafer processing apparatus and reference angular position detection method able to suitably detect a reference angular position for a semiconductor wafer for which a reference angular position is set and a semiconductor wafer for which a reference angular position is suitably set. | 03-25-2010 |
20100177953 | DISC WAFER INSPECTING DEVICE AND INSPECTING METHOD - [Problem] An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided. | 07-15-2010 |
20100245810 | INSPECTION METHOD BASED ON CAPTURED IMAGE AND INSPECTION DEVICE - A method of inspection and inspection apparatus able to use a captured image to more precisely inspect the state of film, defect parts, etc. at a surface of an object under inspection are provided. | 09-30-2010 |
20100246934 | INSPECTION DEVICE FOR DISK-SHAPED SUBSTRATE - An inspection apparatus of a disk-shaped substrate able to precisely quantitatively inspect positions of formation of film layers formed on the surface of a disk-shaped substrate is provided, that is, an inspection apparatus of a disk-shaped substrate on which film layers are formed designed to generate captured image data expressing a captured image corresponding to a field of view based on image signals successively output from an image capturing unit capturing an image of a predetermined surface at an outer circumference part of the disk-shaped substrate and to generate film layer edge position information Y | 09-30-2010 |
20100310150 | FEATURE ANALYZING APPARATUS - A feature analysis apparatus which enables visual confirmation of features of an inspected object and which enables limitations on the degree of freedom of classification based on the features to made relatively smaller is provided. It acquires inspected object information of an inspected object (S | 12-09-2010 |
20100310152 | SUBSTRATE SURFACE INSPECTING APPARATUS AND SUBSTRATE SURFACE INSPECTING METHOD - A substrate surface inspection apparatus and method enabling judgment and analysis of the state of even portions of a substrate supported by supports using a captured image are provided. A support mechanism | 12-09-2010 |
20120094452 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A method of making a semiconductor device having an ESD protection element which can achieve compatibility between high drain-to-backgate withstand voltage and ESD protection of DMOSFET gates. | 04-19-2012 |
20120248541 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first conduction-type semiconductor substrate, a first semiconductor region of a first conduction-type formed on the semiconductor substrate, a second semiconductor region of a second conduction-type formed on a surface of the first semiconductor region, a third semiconductor region of the second conduction-type formed to be separated from the second semiconductor region on the surface of the first semiconductor region, a fourth semiconductor region of the second conduction-type formed to be separated from the second semiconductor region and the third semiconductor region on the surface of the first semiconductor region, and a first electrode connected to the second semiconductor region and the third semiconductor region. | 10-04-2012 |
20120267705 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A method of making a semiconductor device having an ESD protection element which can achieve compatibility between high drain-to-backgate withstand voltage and ESD protection of DMOSFET gates. | 10-25-2012 |
20130105911 | SEMICONDUCTOR DEVICE | 05-02-2013 |