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Hideki Kojima

Hideki Kojima, Kawagoe-Shi JP

Patent application numberDescriptionPublished
20080252409Power transmission transformer for noncontact power transfer device - The present invention provides a power transmission transformer of which workability in implementing and reliability of connection are considered in a noncontact power transfer device using individual self-oscillation circuits. The power transmission transformer for a noncontact power transfer device including a transmitting coil L10-16-2008
20090015210Non-contact electric power transmission apparatus - The object is to provide a safe non-contact electric power transmission apparatus reducing unnecessarily consumed electric power, while intermittently-operated or otherwise restrained electric power transmission is not performed, and heat is not generated when a metal such as a foreign object is placed. In a non-contact electric power transmission apparatus having: a power supplying unit 01-15-2009
20100123430Non-contact power transfer apparatus - There is provided a non-contact power transfer apparatus performing non-contact power transfer from a power transmission coil L05-20-2010
20100148590Non-contact electric power transmission circuit - A non-contact electric power transmission circuit according to an embodiment of the invention includes an electric power transmission circuit and an electric power receiving circuit. The electric power transmission circuit includes a full bridge circuit and a resonant type full bridge circuit. A direct-current power supply is used as an input of the full bridge circuit, the full bridge circuit includes two sets of switching elements, two switching elements being connected in series in each set of the switching elements, a drive circuit alternately feeds a pulse signal to gates of the switching elements to perform switching of the direct-current input in the full bridge circuit, and a serial resonant circuit of a resonant capacitor and an electric power transmission coil is connected to an output of the full bridge circuit in the resonant type full bridge circuit. The electric power receiving circuit includes an electric power receiving coil and a rectifying and smoothing circuit. The electric power receiving coil is electromagnetically coupled to the electric power transmission coil, and the rectifying and smoothing circuit rectifies an output of the electric power receiving coil. In the non-contact electric power transmission circuit, a push-pull output PWM control circuit is provided in the drive circuit that controls the full bridge circuit, and only one of the switching elements in each set of switching elements performs a regenerative operation. Therefore, a non-contact electric power transmission circuit in which the resonant type full bridge circuit can be controlled by PWM control at a level similar to that of a phase shift operation can be provided.06-17-2010
20100295651Power transmission transformer for noncontact power transfer device - The present invention provides a power transmission transformer of which workability in implementing and reliability of connection are considered in a noncontact power transfer device using individual self-oscillation circuits. The power transmission transformer for a noncontact power transfer device including a transmitting coil L11-25-2010

Patent applications by Hideki Kojima, Kawagoe-Shi JP

Hideki Kojima, Tsurugashima-Shi JP

Patent application numberDescriptionPublished
20100219696Noncontact Electric Power Transmission System - Disclosed is a noncontact electric power transmission system having a power transmitter circuit section 09-02-2010

Hideki Kojima, Niigata JP

Patent application numberDescriptionPublished
20100124344PIEZOELECTRIC BODY MODULE AND MANUFACTURING METHOD THEREFOR - In order to miniaturize a piezoelectric body module, in which a rhombus-shaped electronic part 05-20-2010
20100148315SEMICONDUCTOR WAFER AND A METHOD OF SEPARATING THE SAME - A semiconductor wafer includes a plurality of predetermined separation lines extending from an upper surface to a bottom surface; and a semiconductor substrate including a plurality of chip regions segmented by the predetermined separation lines. Tensile stress is applied to regions of the semiconductor substrate provided with the predetermined separation lines.06-17-2010